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H01L2224/06155

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/06155Covering only the peripheral area of the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 12,040,349
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer body and method of manufacturing the same
- Patent number 12,002,779
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel and display device
- Patent number 11,942,443
- Issue date Mar 26, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunxu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a back via stack
- Patent number 11,935,908
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Mihye Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a display panel with multiple pads
- Patent number 11,894,294
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Hanho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,848,319
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,810,869
- Issue date Nov 7, 2023
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving backplane and display apparatus
- Patent number 11,538,776
- Issue date Dec 27, 2022
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Tianyu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,495,590
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,482,498
- Issue date Oct 25, 2022
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a package substrate including stagg...
- Patent number 11,444,052
- Issue date Sep 13, 2022
- SK hynix Inc.
- Jong Hui Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 11,393,859
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Sungeun Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package devices and methods of packaging semiconductor dies
- Patent number RE49045
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
Information Patent Grant
Array substrate
- Patent number 11,264,407
- Issue date Mar 1, 2022
- Xiaoliang Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with pad structure
- Patent number 11,164,903
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huai-jen Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and chip bonding method
- Patent number 11,101,230
- Issue date Aug 24, 2021
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Chunpeng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Qubit-detector die assemblies
- Patent number 11,075,293
- Issue date Jul 27, 2021
- Intel Corporation
- Jeanette M. Roberts
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device including two or more chips mounted over wirin...
- Patent number 11,069,655
- Issue date Jul 20, 2021
- Micron Technology, Inc.
- Sensho Usami
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having wires connecting connection pads
- Patent number 11,049,845
- Issue date Jun 29, 2021
- LONGITUDE LICENSING LIMITED
- Takashi Ohba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and electronic apparatus to increas...
- Patent number 10,986,292
- Issue date Apr 20, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Kenji Mishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,923,437
- Issue date Feb 16, 2021
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 10,879,207
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heat spreading device and method
- Patent number 10,867,884
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreading device and method
- Patent number 10,867,885
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,847,476
- Issue date Nov 24, 2020
- Samsung Electronics Co., Ltd.
- Jun Woo Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 10,847,505
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20240315098
- Publication date Sep 19, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Bo ZHANG
- G01 - MEASURING TESTING
Information Patent Application
POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS
- Publication number 20240258251
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo TIMBOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
- Publication number 20240222308
- Publication date Jul 4, 2024
- PIXART IMAGING Inc.
- SAI-MUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...
- Publication number 20240213430
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY D...
- Publication number 20240164022
- Publication date May 16, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Jing WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC ISOLATION DEVICE
- Publication number 20240113094
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING OPTICAL DEVICE
- Publication number 20240038747
- Publication date Feb 1, 2024
- SEIKO NPC CORPORATION
- Takahiro NAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021541
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE
- Publication number 20240014164
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jooyoung OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND DRIVER
- Publication number 20230411324
- Publication date Dec 21, 2023
- Sharp Display Technology Corporation
- Shinzoh MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230411233
- Publication date Dec 21, 2023
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Step Seal Ring and Methods Forming...
- Publication number 20230386908
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Packaged Power Transistor Module Having Built-in Gate Driver
- Publication number 20230378145
- Publication date Nov 23, 2023
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DRIVER CHIP FOR DRIVING A PLURALITY OF PIXELS OF A DISPLAY...
- Publication number 20230351954
- Publication date Nov 2, 2023
- NOVATEK MICROELECTRONICS CORP.
- JHIH-SIOU CHENG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230309351
- Publication date Sep 28, 2023
- SAMSUNG DISPLAY CO., LTD.
- Soyoung Lee
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230299091
- Publication date Sep 21, 2023
- InnoLux Corporation
- Jia-Yan LAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICE
- Publication number 20230275099
- Publication date Aug 31, 2023
- SAMSUNG DISPLAY CO., LTD.
- Sang Yong NO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230217748
- Publication date Jul 6, 2023
- SAMSUNG DISPLAY CO., LTD.
- MYONG-SOO OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD
- Publication number 20230197652
- Publication date Jun 22, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xiaoxuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230163085
- Publication date May 25, 2023
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ayuhiko SAITOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230034834
- Publication date Feb 2, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jaesik MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230015101
- Publication date Jan 19, 2023
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, CIRCUIT BOARD, AND DISPLAY DEVICE
- Publication number 20230015549
- Publication date Jan 19, 2023
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jianchang CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip Semiconductor Package
- Publication number 20220384411
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONEN...
- Publication number 20220352105
- Publication date Nov 3, 2022
- Rohm Co., Ltd.
- Isamu NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS

Covering only the peripheral area of the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded structures

Light emitting device and method of manufacturing the same

Multilayer body and method of manufacturing the same

Array substrate, display panel and display device

Image sensor including a back via stack

Display apparatus including a display panel with multiple pads

Multi-chip semiconductor package

Method of direct bonding semiconductor components

Semiconductor device and method of manufacturing the same

Bonded structures

Chemical mechanical polishing for hybrid bonding

Driving backplane and display apparatus

Multi-chip semiconductor package

Semiconductor device and method of manufacturing the same

Semiconductor package including a package substrate including stagg...

Image sensor package

Package on package devices and methods of packaging semiconductor dies

Array substrate

Image sensor with pad structure

Array substrate and chip bonding method

Qubit-detector die assemblies

Semiconductor device including two or more chips mounted over wirin...

Semiconductor device having wires connecting connection pads

Solid-state image pickup device and electronic apparatus to increas...

Semiconductor device and method of manufacturing the same

Bonded structures

Heat spreading device and method

Heat spreading device and method

Semiconductor package

Multi-chip semiconductor package

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR DEVICE

DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY D...

SEMICONDUCTOR PACKAGE

GALVANIC ISOLATION DEVICE

OPTICAL DEVICE AND METHOD OF MANUFACTURING OPTICAL DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING AN ADHESIVE STRUCTURE

DISPLAY DEVICE AND DRIVER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Package Including Step Seal Ring and Methods Forming...

Flip-Chip Packaged Power Transistor Module Having Built-in Gate Driver

DISPLAY DRIVER CHIP FOR DRIVING A PLURALITY OF PIXELS OF A DISPLAY...

DISPLAY APPARATUS

ELECTRONIC DEVICE

DISPLAY DEVICE

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

DISPLAY DEVICE

PACKAGE STRUCTURE AND PACKAGING METHOD

SEMICONDUCTOR DEVICE

DISPLAY APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY PANEL, CIRCUIT BOARD, AND DISPLAY DEVICE

Multi-Chip Semiconductor Package

SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONEN...