Deposition of semiconductor materials on a substrate

Industry

CPC
H01L21/20

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/20Deposition of semiconductor materials on a substrate

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating semiconductor device
- Patent number 12,170,436
- Issue date Dec 17, 2024
- Modulight Oy
- Riina Ulkuniemi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit emulating neural system with neuron circuit and...
- Patent number 12,154,017
- Issue date Nov 26, 2024
- Seoul National University R&DBFoundation
- Byung-Gook Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Source/drain formation with reduced selective loss defects
- Patent number 12,154,974
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 12,131,907
- Issue date Oct 29, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor structures
- Patent number 12,131,898
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device including active patterns...
- Patent number 12,112,952
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Sungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding substrates, microchip and method of manufacturing...
- Patent number 12,103,246
- Issue date Oct 1, 2024
- Ushio Denki Kabushiki Kaisha
- Motohiro Sakai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Nanorod production method and nanorod produced thereby
- Patent number 12,074,247
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Young Rag Do
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor substrate
- Patent number 12,068,166
- Issue date Aug 20, 2024
- FILNEX INC.
- Mitsuhiko Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of substrates
- Patent number 11,955,339
- Issue date Apr 9, 2024
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and static random-acc...
- Patent number 11,950,399
- Issue date Apr 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and the manufacturing method thereof
- Patent number 11,948,884
- Issue date Apr 2, 2024
- Epistar Corporation
- Lin Tzu Hsiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annealed workpiece manufacturing method, laser anneal base stage, a...
- Patent number 11,938,563
- Issue date Mar 26, 2024
- JSW AKTINA SYSTEM CO., LTD.
- Suk-Hwan Chung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor epitaxial wafer and method of producing semiconductor...
- Patent number 11,935,745
- Issue date Mar 19, 2024
- Sumco Corporation
- Ryosuke Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including binding agent adhering an integrated...
- Patent number 11,929,345
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for conditioning a processing reactor
- Patent number 11,926,892
- Issue date Mar 12, 2024
- GlobalWafers Co., Ltd.
- Gang Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuits having source/drain structure and method of making
- Patent number 11,923,200
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
- Patent number 11,901,342
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-assisted method for parting crystalline material along lase...
- Patent number 11,901,181
- Issue date Feb 13, 2024
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for collectively fabricating a plurality of semiconductor s...
- Patent number 11,876,073
- Issue date Jan 16, 2024
- Soitec
- David Sotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of cooling semiconductor devices
- Patent number 11,869,804
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- David H. Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor device and method for fabricating nitride sem...
- Patent number 11,862,687
- Issue date Jan 2, 2024
- Fuji Electric Co., Ltd.
- Ryo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for bonding of two substrates
- Patent number 11,862,487
- Issue date Jan 2, 2024
- EV Group E. Thallner GmbH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
- Patent number 11,864,367
- Issue date Jan 2, 2024
- Yangtze Memory Technologies Co., Ltd.
- Weihua Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for bonding substrates
- Patent number 11,862,466
- Issue date Jan 2, 2024
- EV Group E. Thallner GmbH
- Kurt Hingerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,862,510
- Issue date Jan 2, 2024
- Kioxia Corporation
- Mie Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain formation with reduced selective loss defects
- Patent number 11,855,188
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding methods for light emitting diodes
- Patent number 11,854,810
- Issue date Dec 26, 2023
- Meta Platforms Technologies, LLC
- Stephan Lutgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,855,036
- Issue date Dec 26, 2023
- Kioxia Corporation
- Masaharu Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor interface between gate and active region
- Patent number 11,843,035
- Issue date Dec 12, 2023
- Micron Technology, Inc.
- Moeko Kawana
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING EPITAXIAL SEMICONDUCTOR LAYER AND METHOD OF MANUF...
- Publication number 20240412974
- Publication date Dec 12, 2024
- RNR LAB INC.
- Jeong Do RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN FORMATION WITH REDUCED SELECTIVE LOSS DEFECTS
- Publication number 20240387702
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR DICING BONDED WAFERS USING LASER TECHNOLOGIES
- Publication number 20240371693
- Publication date Nov 7, 2024
- Corning Incorporated
- Andreas Simon Gaab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...
- Publication number 20240371669
- Publication date Nov 7, 2024
- X-FAB SEMICONDUCTOR FOUNDRIES GmbH
- Ralf LERNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CHANNEL FOR BONDED 3D NAND DEVICES
- Publication number 20240363345
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Chang Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240347340
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Jui CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICE
- Publication number 20240339567
- Publication date Oct 10, 2024
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACC...
- Publication number 20240251538
- Publication date Jul 25, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240222125
- Publication date Jul 4, 2024
- Resonac Corporation
- Yoshikazu Umeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES OF SEMICONDUCTOR DEVICES FOR HEAT DISSIPATION
- Publication number 20240222224
- Publication date Jul 4, 2024
- GLOBALFOUNDRIES U.S. Inc.
- SIVA P. ADUSUMILLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING OF SUBSTRATES
- Publication number 20240213025
- Publication date Jun 27, 2024
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE SEMICONDUCTOR DEVICE...
- Publication number 20240186381
- Publication date Jun 6, 2024
- DENSO CORPORATION
- Hideyuki UEHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...
- Publication number 20240186298
- Publication date Jun 6, 2024
- Micron Technology, Inc.
- Scott D. Schellhammer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier-Assisted Method for Parting Crystalline Material Along Lase...
- Publication number 20240128085
- Publication date Apr 18, 2024
- Wolfspeed, Inc.
- Matthew Donofrio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOURCE/DRAIN FORMATION WITH REDUCED SELECTIVE LOSS DEFECTS
- Publication number 20240113205
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN SI...
- Publication number 20240112908
- Publication date Apr 4, 2024
- SOITEC
- Hugo Biard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240099009
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Mariko SUMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming One or More Covered Voids in a Semiconductor Sub...
- Publication number 20240087948
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- David H. Wells
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE
- Publication number 20240079244
- Publication date Mar 7, 2024
- FILNEX INC.
- Mitsuhiko OGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED OBJECT PRODUCTION METHOD AND PRODUCTION METHOD FOR CERAMIC C...
- Publication number 20240079238
- Publication date Mar 7, 2024
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE COMPOSITIONS AND METHODS OF DEPOSITING EPITAXIAL LAYERS
- Publication number 20240072206
- Publication date Feb 29, 2024
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE SEMICONDUCTOR STRUCTURES AND DEVICES
- Publication number 20240072207
- Publication date Feb 29, 2024
- Silanna UV Technologies Pte Ltd
- Petar Atanackovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240072752
- Publication date Feb 29, 2024
- Shenzhen Newsonic Technologies Co., Ltd.
- Guojun WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH PROCESSING APPARATUS, SYSTEMS, AND RELATED METHODS AND STRUCT...
- Publication number 20240021444
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Manjunath SUBBANNA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240014272
- Publication date Jan 11, 2024
- DENSO CORPORATION
- Seiya HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SOI SUBSTRATES
- Publication number 20230369038
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alex Usenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...
- Publication number 20230360962
- Publication date Nov 9, 2023
- Newport Fab, LLC dba Tower Semiconductor Newport Beach
- Kurt Moen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRIPPING METHOD FOR SEMICONDUCTOR STRUCTURE
- Publication number 20230317873
- Publication date Oct 5, 2023
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230309286
- Publication date Sep 28, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xingsong SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING SOURCE/DRAIN STRUCTURE AND METHOD OF MAKING
- Publication number 20230298891
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Hsien HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Deposition of semiconductor materials on a substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating semiconductor device

Integrated circuit emulating neural system with neuron circuit and...

Source/drain formation with reduced selective loss defects

Device and method for bonding of substrates

Bonded semiconductor structures

Methods of forming a semiconductor device including active patterns...

Method of bonding substrates, microchip and method of manufacturing...

Nanorod production method and nanorod produced thereby

Semiconductor substrate

Device and method for bonding of substrates

Bonded semiconductor devices having processor and static random-acc...

Semiconductor device and the manufacturing method thereof

Annealed workpiece manufacturing method, laser anneal base stage, a...

Semiconductor epitaxial wafer and method of producing semiconductor...

Semiconductor device including binding agent adhering an integrated...

Methods for conditioning a processing reactor

Integrated circuits having source/drain structure and method of making

Discontinuous patterned bonds for semiconductor devices and associa...

Carrier-assisted method for parting crystalline material along lase...

Process for collectively fabricating a plurality of semiconductor s...

Methods of cooling semiconductor devices

Nitride semiconductor device and method for fabricating nitride sem...

Device and method for bonding of two substrates

Bonded semiconductor devices having processor and NAND flash memory...

Method and device for bonding substrates

Semiconductor device manufacturing method and semiconductor device

Source/drain formation with reduced selective loss defects

Bonding methods for light emitting diodes

Bonding apparatus and bonding method

Transistor interface between gate and active region

Patents Applicationslast 30 patents

METHOD OF FORMING EPITAXIAL SEMICONDUCTOR LAYER AND METHOD OF MANUF...

SOURCE/DRAIN FORMATION WITH REDUCED SELECTIVE LOSS DEFECTS

TECHNIQUES FOR DICING BONDED WAFERS USING LASER TECHNOLOGIES

CARRIER SUBSTRATE FOR SEMICONDUCTOR STRUCTURES SUITABLE FOR A TRANS...

SILICON CHANNEL FOR BONDED 3D NAND DEVICES

EPITAXIAL STRUCTURE AND METHOD OF FORMING THE SAME

METAL OXIDE SEMICONDUCTOR-BASED LIGHT EMITTING DEVICE

BONDED SEMICONDUCTOR DEVICES HAVING PROCESSOR AND STATIC RANDOM-ACC...

SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATES OF SEMICONDUCTOR DEVICES FOR HEAT DISSIPATION

DEVICE AND METHOD FOR BONDING OF SUBSTRATES

SILICON CARBIDE SUBSTRATE AND SILICON CARBIDE SEMICONDUCTOR DEVICE...

DISCONTINUOUS PATTERNED BONDS FOR SEMICONDUCTOR DEVICES AND ASSOCIA...

Carrier-Assisted Method for Parting Crystalline Material Along Lase...

SOURCE/DRAIN FORMATION WITH REDUCED SELECTIVE LOSS DEFECTS

METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN SI...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Methods of Forming One or More Covered Voids in a Semiconductor Sub...

SEMICONDUCTOR SUBSTRATE

BONDED OBJECT PRODUCTION METHOD AND PRODUCTION METHOD FOR CERAMIC C...

OXIDE COMPOSITIONS AND METHODS OF DEPOSITING EPITAXIAL LAYERS

OXIDE SEMICONDUCTOR STRUCTURES AND DEVICES

BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME

BATCH PROCESSING APPARATUS, SYSTEMS, AND RELATED METHODS AND STRUCT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHODS OF FORMING SOI SUBSTRATES

SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...

SUBSTRATE STRIPPING METHOD FOR SEMICONDUCTOR STRUCTURE

MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR

INTEGRATED CIRCUITS HAVING SOURCE/DRAIN STRUCTURE AND METHOD OF MAKING