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Deposition of semiconductor materials on a substrate
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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Deposition of semiconductor materials on a substrate
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last 30 patents
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Device and method for bonding of substrates
Patent number
11,955,339
Issue date
Apr 9, 2024
EV Group E. Thallner GmbH
Thomas Wagenleitner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded semiconductor devices having processor and static random-acc...
Patent number
11,950,399
Issue date
Apr 2, 2024
Yangtze Memory Technologies Co., Ltd.
Jun Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and the manufacturing method thereof
Patent number
11,948,884
Issue date
Apr 2, 2024
Epistar Corporation
Lin Tzu Hsiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Annealed workpiece manufacturing method, laser anneal base stage, a...
Patent number
11,938,563
Issue date
Mar 26, 2024
JSW AKTINA SYSTEM CO., LTD.
Suk-Hwan Chung
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor epitaxial wafer and method of producing semiconductor...
Patent number
11,935,745
Issue date
Mar 19, 2024
Sumco Corporation
Ryosuke Okuyama
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device including binding agent adhering an integrated...
Patent number
11,929,345
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for conditioning a processing reactor
Patent number
11,926,892
Issue date
Mar 12, 2024
GlobalWafers Co., Ltd.
Gang Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Integrated circuits having source/drain structure and method of making
Patent number
11,923,200
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Carrier-assisted method for parting crystalline material along lase...
Patent number
11,901,181
Issue date
Feb 13, 2024
Wolfspeed, Inc.
Matthew Donofrio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Discontinuous patterned bonds for semiconductor devices and associa...
Patent number
11,901,342
Issue date
Feb 13, 2024
Micron Technology, Inc.
Scott D. Schellhammer
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Process for collectively fabricating a plurality of semiconductor s...
Patent number
11,876,073
Issue date
Jan 16, 2024
Soitec
David Sotta
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods of cooling semiconductor devices
Patent number
11,869,804
Issue date
Jan 9, 2024
Micron Technology, Inc.
David H. Wells
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nitride semiconductor device and method for fabricating nitride sem...
Patent number
11,862,687
Issue date
Jan 2, 2024
Fuji Electric Co., Ltd.
Ryo Tanaka
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Device and method for bonding of two substrates
Patent number
11,862,487
Issue date
Jan 2, 2024
EV Group E. Thallner GmbH
Markus Wimplinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and device for bonding substrates
Patent number
11,862,466
Issue date
Jan 2, 2024
EV Group E. Thallner GmbH
Kurt Hingerl
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device manufacturing method and semiconductor device
Patent number
11,862,510
Issue date
Jan 2, 2024
Kioxia Corporation
Mie Matsuo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Bonded semiconductor devices having processor and NAND flash memory...
Patent number
11,864,367
Issue date
Jan 2, 2024
Yangtze Memory Technologies Co., Ltd.
Weihua Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Source/drain formation with reduced selective loss defects
Patent number
11,855,188
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Chiang Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding methods for light emitting diodes
Patent number
11,854,810
Issue date
Dec 26, 2023
Meta Platforms Technologies, LLC
Stephan Lutgen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus and bonding method
Patent number
11,855,036
Issue date
Dec 26, 2023
Kioxia Corporation
Masaharu Takizawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transistor interface between gate and active region
Patent number
11,843,035
Issue date
Dec 12, 2023
Micron Technology, Inc.
Moeko Kawana
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing panel using a glass substrate as the laser...
Patent number
11,842,898
Issue date
Dec 12, 2023
JSW AKTINA SYSTEM CO., LTD.
Suk-Hwan Chung
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bulk acoustic wave resonator and method of manufacturing the same
Patent number
11,838,001
Issue date
Dec 5, 2023
Shenzhen Newsonic Technologies Co., Ltd.
Guojun Weng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Precursor supply system and precursors supply method
Patent number
11,819,838
Issue date
Nov 21, 2023
L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
Toshiyuki Nakagawa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Direct-bonded native interconnects and active base die
Patent number
11,823,906
Issue date
Nov 21, 2023
Xcelsis Corporation
Javier A. Delacruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated decoupling capacitors
Patent number
11,810,877
Issue date
Nov 7, 2023
Cisco Technology, Inc.
Vipulkumar K. Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal plate for deposition mask, and deposition mask and manufactur...
Patent number
11,795,549
Issue date
Oct 24, 2023
LG Innotek Co., Ltd
Dong Mug Seong
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Method and device for surface treatment of substrates
Patent number
11,776,842
Issue date
Oct 3, 2023
EV Group E. Thallner GmbH
Markus Wimplinger
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Methods of forming SOI substrates
Patent number
11,764,054
Issue date
Sep 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Alex Usenko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for bond wave propagation control
Patent number
11,742,321
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Xin-Hua Huang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Carrier-Assisted Method for Parting Crystalline Material Along Lase...
Publication number
20240128085
Publication date
Apr 18, 2024
Wolfspeed, Inc.
Matthew Donofrio
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SOURCE/DRAIN FORMATION WITH REDUCED SELECTIVE LOSS DEFECTS
Publication number
20240113205
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chiang Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN SI...
Publication number
20240112908
Publication date
Apr 4, 2024
SOITEC
Hugo Biard
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240099009
Publication date
Mar 21, 2024
KIOXIA Corporation
Mariko SUMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Forming One or More Covered Voids in a Semiconductor Sub...
Publication number
20240087948
Publication date
Mar 14, 2024
Micron Technology, Inc.
David H. Wells
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR SUBSTRATE
Publication number
20240079244
Publication date
Mar 7, 2024
FILNEX INC.
Mitsuhiko OGIHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED OBJECT PRODUCTION METHOD AND PRODUCTION METHOD FOR CERAMIC C...
Publication number
20240079238
Publication date
Mar 7, 2024
Kabushiki Kaisha Toshiba
Hiromasa KATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OXIDE COMPOSITIONS AND METHODS OF DEPOSITING EPITAXIAL LAYERS
Publication number
20240072206
Publication date
Feb 29, 2024
Silanna UV Technologies Pte Ltd
Petar Atanackovic
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OXIDE SEMICONDUCTOR STRUCTURES AND DEVICES
Publication number
20240072207
Publication date
Feb 29, 2024
Silanna UV Technologies Pte Ltd
Petar Atanackovic
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME
Publication number
20240072752
Publication date
Feb 29, 2024
Shenzhen Newsonic Technologies Co., Ltd.
Guojun WENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BATCH PROCESSING APPARATUS, SYSTEMS, AND RELATED METHODS AND STRUCT...
Publication number
20240021444
Publication date
Jan 18, 2024
Applied Materials, Inc.
Manjunath SUBBANNA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20240014272
Publication date
Jan 11, 2024
DENSO CORPORATION
Seiya HASEGAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF FORMING SOI SUBSTRATES
Publication number
20230369038
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Alex Usenko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOI Structures with Carbon in Body Regions for Improved RF-SOI Swit...
Publication number
20230360962
Publication date
Nov 9, 2023
Newport Fab, LLC dba Tower Semiconductor Newport Beach
Kurt Moen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE STRIPPING METHOD FOR SEMICONDUCTOR STRUCTURE
Publication number
20230317873
Publication date
Oct 5, 2023
ENKRIS SEMICONDUCTOR, INC.
Kai CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR
Publication number
20230309286
Publication date
Sep 28, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Xingsong SU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUITS HAVING SOURCE/DRAIN STRUCTURE AND METHOD OF MAKING
Publication number
20230298891
Publication date
Sep 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Hsien HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IMAGING DEVICE
Publication number
20230282678
Publication date
Sep 7, 2023
Sony Semiconductor Solutions Corporation
Hidenobu TSUGAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR FORMING BACKSIDE POWER RAILS
Publication number
20230260825
Publication date
Aug 17, 2023
He REN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR ADJUSTING THERMAL FIELD OF SILICON CARBIDE SINGLE CRYSTA...
Publication number
20230227998
Publication date
Jul 20, 2023
NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
HSUEH-I CHEN
C30 - CRYSTAL GROWTH
Information
Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
Publication number
20230207322
Publication date
Jun 29, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUFFER LAYER ON SILICON CARBIDE SUBSTRATE, AND METHOD FOR FORMING B...
Publication number
20230118623
Publication date
Apr 20, 2023
SEMICONDUCTOR MANUFACTURING ELECTRONICS (SHAOXING) CORPORATION
Xiang LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INCREASING TRANSISTOR GAIN USING METAMATERIAL ELECTRODES
Publication number
20230124695
Publication date
Apr 20, 2023
Board of Trustees of the University of Arkansas
Amirreza Ghadimi Avval
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES
Publication number
20230117625
Publication date
Apr 20, 2023
EV GROUP E. THALLNER GMBH
Markus Wimplinger
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ON INSULATOR STRUCTURE COMPRISING A BURIED HIGH RESIS...
Publication number
20230072964
Publication date
Mar 9, 2023
GLOBALWAFERS CO., LTD.
Igor Peidous
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER CARRIER ASSEMBLY WITH PEDESTAL AND COVER RESTRAINT ARRANGEMEN...
Publication number
20230060609
Publication date
Mar 2, 2023
VEECO INSTRUMENTS INC.
Sandeep Krishnan
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
NANOROD PRODUCTION METHOD AND NANOROD PRODUCED THEREBY
Publication number
20230056417
Publication date
Feb 23, 2023
SAMSUNG DISPLAY CO., LTD.
Young Rag DO
B82 - NANO-TECHNOLOGY
Information
Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
Publication number
20230026661
Publication date
Jan 26, 2023
TOKYO ELECTRON LIMITED
Takashi Nakamitsu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING EPITAXIAL WAFER AND EPITAXIAL WAFER
Publication number
20230028127
Publication date
Jan 26, 2023
Shin-Etsu Handotai Co., Ltd.
Katsuyoshi SUZUKI
C30 - CRYSTAL GROWTH
Information
Patent Application
CONTROL DEVICE AND CONTROL METHOD FOR SINGLE-WAFER PROCESSING EPITA...
Publication number
20220406599
Publication date
Dec 22, 2022
SUMCO CORPORATION
Naoyuki WADA
H01 - BASIC ELECTRIC ELEMENTS