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H01L2224/75355

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75355Design

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding tool, electronic component mounting apparatus, and manufact...
- Patent number 8,973,807
- Issue date Mar 10, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support device for resonator
- Patent number 8,353,442
- Issue date Jan 15, 2013
- Adwelds Corporation
- Seiya Nakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting method, component mounting apparatus, and ultras...
- Patent number 7,861,908
- Issue date Jan 4, 2011
- Panasonic Corporation
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting an electronic component and mounting apparatus
- Patent number 7,828,193
- Issue date Nov 9, 2010
- Fujitsu Limited
- Kuniko Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting apparatus and electronic component mo...
- Patent number 7,789,284
- Issue date Sep 7, 2010
- Panasonic Corporation
- Hiroshi Ebihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resonator, ultrasonic die bonding head, and ultrasonic die bonding...
- Patent number 7,595,582
- Issue date Sep 29, 2009
- Fujitsu Limited
- Yukio Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horn-holder pivot type bonding apparatus
- Patent number 7,578,421
- Issue date Aug 25, 2009
- Kabushiki Kaisha Shinkawa
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method and apparatus and ultrasonic b...
- Patent number 7,229,854
- Issue date Jun 12, 2007
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of ultrasonic-mounting electronic component and ultrasonic m...
- Patent number 7,208,059
- Issue date Apr 24, 2007
- Fujitsu Limited
- Takayoshi Matsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding method and device
- Patent number 7,017,791
- Issue date Mar 28, 2006
- Murata Manufacturing Co., Ltd.
- Yuzo Higashiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic horn, and ultrasonic bonding apparatus using the ultraso...
- Patent number 6,877,648
- Issue date Apr 12, 2005
- Murata Manufacturing Co., Ltd.
- Yuzo Higashiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration method and ultrasonic vibration apparatus
- Patent number 6,811,630
- Issue date Nov 2, 2004
- Sony Corporation
- Morio Tominaga
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Component bonder and bonding tool
- Patent number 6,743,331
- Issue date Jun 1, 2004
- Matsushita Electric Industrial Co., Ltd.
- Seiji Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump-joining method
- Patent number 6,572,005
- Issue date Jun 3, 2003
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding method
- Patent number 6,565,687
- Issue date May 20, 2003
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for mounting component
- Patent number 6,467,670
- Issue date Oct 22, 2002
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding method and ultrasonic bonding apparatus
- Patent number 6,460,591
- Issue date Oct 8, 2002
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump joining method
- Patent number 6,321,973
- Issue date Nov 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting method and apparatus
- Patent number 6,193,136
- Issue date Feb 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Kazushi Higashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METH...
- Publication number 20130026211
- Publication date Jan 31, 2013
- Panasonic Coporation
- Ryo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT DEVICE FOR RESONATOR
- Publication number 20110036897
- Publication date Feb 17, 2011
- Adwelds Corporation
- Seiya Nakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTUR...
- Publication number 20100126763
- Publication date May 27, 2010
- Fujitsu Limited
- Takayoshi Matsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MO...
- Publication number 20090277951
- Publication date Nov 12, 2009
- PANASONIC CORPORATION
- Hiroshi EBIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Horn-holder pivot type bonding apparatus
- Publication number 20090272498
- Publication date Nov 5, 2009
- KABUSHIKI KAISHA SHINKAWA
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of mounting an electronic component and mounting apparatus
- Publication number 20080203138
- Publication date Aug 28, 2008
- Fujitsu Limited
- Kuniko Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESONATOR, ULTRASONIC DIE BONDING HEAD, AND ULTRASONIC DIE BONDING...
- Publication number 20080087708
- Publication date Apr 17, 2008
- FUJITSU LIMITED
- Yukio Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Horn-holder pivot type bonding apparatus
- Publication number 20070205252
- Publication date Sep 6, 2007
- KABUSHIKI KAISHA SHINKAWA
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component mounting method, component mounting apparatus, and ultras...
- Publication number 20070187457
- Publication date Aug 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resonator, ultrasonic die bonding head, and ultrasonic die bonding...
- Publication number 20060169746
- Publication date Aug 3, 2006
- FUJITSU LIMITED
- Yukio Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of ultrasonic-mounting electronic component and ultrasonic m...
- Publication number 20060090833
- Publication date May 4, 2006
- FUJITSU LIMITED
- Takayoshi Matsumura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting method and apparatus and ultrasondic...
- Publication number 20050227429
- Publication date Oct 13, 2005
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultrasonic bonding method and device
- Publication number 20040041003
- Publication date Mar 4, 2004
- Murata Manufacturing Co., Ltd.
- Yuzo Higashiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump joining method
- Publication number 20030205607
- Publication date Nov 6, 2003
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrasonic horn, and ultrasonic bonding apparatus using the ultraso...
- Publication number 20030160084
- Publication date Aug 28, 2003
- Murata Manufacturing Co., Ltd.
- Yuzo Higashiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component bonder and bonding tool
- Publication number 20030136523
- Publication date Jul 24, 2003
- Seiji Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultrasonic bonding method
- Publication number 20030029543
- Publication date Feb 13, 2003
- TDK Corp.
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for ultrasonic vibration
- Publication number 20030019561
- Publication date Jan 30, 2003
- Morio Tominaga
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
Bump joining method
- Publication number 20020008132
- Publication date Jan 24, 2002
- Shozo Minamitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for mounting component
- Publication number 20010001469
- Publication date May 24, 2001
- Kazushi Higashi
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding tool, electronic component mounting apparatus, and manufact...

Support device for resonator

Component mounting method, component mounting apparatus, and ultras...

Method of mounting an electronic component and mounting apparatus

Electronic component mounting apparatus and electronic component mo...

Resonator, ultrasonic die bonding head, and ultrasonic die bonding...

Horn-holder pivot type bonding apparatus

Electronic component mounting method and apparatus and ultrasonic b...

Method of ultrasonic-mounting electronic component and ultrasonic m...

Ultrasonic bonding method and device

Ultrasonic horn, and ultrasonic bonding apparatus using the ultraso...

Ultrasonic vibration method and ultrasonic vibration apparatus

Component bonder and bonding tool

Bump-joining method

Ultrasonic bonding method

Method and apparatus for mounting component

Ultrasonic bonding method and ultrasonic bonding apparatus

Bump joining method

Component mounting method and apparatus

Patents Applicationslast 30 patents

BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METH...

SUPPORT DEVICE FOR RESONATOR

WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTUR...

ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MO...

Horn-holder pivot type bonding apparatus

Method of mounting an electronic component and mounting apparatus

RESONATOR, ULTRASONIC DIE BONDING HEAD, AND ULTRASONIC DIE BONDING...

Horn-holder pivot type bonding apparatus

Component mounting method, component mounting apparatus, and ultras...

Resonator, ultrasonic die bonding head, and ultrasonic die bonding...

Method of ultrasonic-mounting electronic component and ultrasonic m...

Electronic component mounting method and apparatus and ultrasondic...

Ultrasonic bonding method and device

Bump joining method

Ultrasonic horn, and ultrasonic bonding apparatus using the ultraso...

Component bonder and bonding tool

Ultrasonic bonding method

Method and device for ultrasonic vibration

Bump joining method

Method and apparatus for mounting component