Details of adjacent, not connected vias

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING BOARD

    • Publication number 20250185157
    • Publication date Jun 5, 2025
    • KYOCERA CORPORATION
    • Suguru KADOWAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20250151195
    • Publication date May 8, 2025
    • IBIDEN CO., LTD.
    • Masashi KUWABARA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Stamping Surface Profile in Design Layer and Filling an Indentation...

    • Publication number 20250142736
    • Publication date May 1, 2025
    • AT&S Austria Technologie & Systemtechnik AG
    • Heinrich TRISCHLER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM

    • Publication number 20250142725
    • Publication date May 1, 2025
    • SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
    • Huali ZHOU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD ASSEMBLY

    • Publication number 20250133652
    • Publication date Apr 24, 2025
    • Cisco Technology, Inc.
    • Yuqing Zhu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD DEVICE AND ITS CIRCUIT MODULE

    • Publication number 20250113432
    • Publication date Apr 3, 2025
    • Global Unichip Corporation
    • Huan-Yi LIAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE

    • Publication number 20250089167
    • Publication date Mar 13, 2025
    • IBIDEN CO., LTD.
    • Shunsuke SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD

    • Publication number 20250031299
    • Publication date Jan 23, 2025
    • Sumitomo Electric Industries, Ltd.
    • Shun IGARASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

    • Publication number 20250024602
    • Publication date Jan 16, 2025
    • Amphenol Corporation
    • Marc B. Cartier
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME

    • Publication number 20240321711
    • Publication date Sep 26, 2024
    • Chengdu Monolithic Power Systems Co., Ltd.
    • Yingjiang Pu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

    • Publication number 20240260188
    • Publication date Aug 1, 2024
    • HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
    • Brian Mark Hostetler
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS

    • Publication number 20240107661
    • Publication date Mar 28, 2024
    • KYOCERA DOCUMENT SOLUTIONS INC.
    • Shotaro Ikegami
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATES WITH CONTINUOUS SLOT VIAS

    • Publication number 20240074055
    • Publication date Feb 29, 2024
    • Micron Technology, Inc.
    • Walter L. Moden
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER WIRING BOARD

    • Publication number 20230422412
    • Publication date Dec 28, 2023
    • TOPPAN INC.
    • Akihiro HAYASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

    • Publication number 20230363082
    • Publication date Nov 9, 2023
    • Samsung Electronics Co., Ltd.
    • Byeongkeol KIM
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    CAPACITOR IN A SUBSTRATE VIA

    • Publication number 20230319997
    • Publication date Oct 5, 2023
    • Intel Corporation
    • Aslam HASWAREY
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT MODULE AND COMMUNICATION DEVICE

    • Publication number 20230199940
    • Publication date Jun 22, 2023
    • Sumitomo Electric Industries, Ltd.
    • Noriyoshi SUDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD

    • Publication number 20230095087
    • Publication date Mar 30, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Jae Han PARK
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    QUAD-TRACE STRUCTURES FOR HIGH-SPEED SIGNALING

    • Publication number 20230031615
    • Publication date Feb 2, 2023
    • DELL PRODUCTS, L.P.
    • Sandor Farkas
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SLOTTED VIAS FOR CIRCUIT BOARDS

    • Publication number 20220369452
    • Publication date Nov 17, 2022
    • Dell Products L.P.
    • Jason PRITCHARD
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Power Divider

    • Publication number 20220077557
    • Publication date Mar 10, 2022
    • Ampleon Netherlands B.V.
    • Mohadig Widha Rousstia
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR CROSS-TALK REDUCTION TECHNIQUE WITH FINE PITCH VIAS

    • Publication number 20200375024
    • Publication date Nov 26, 2020
    • Cray Inc.
    • HYUNJUN KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MAKING CIRCUIT BOARD

    • Publication number 20200163229
    • Publication date May 21, 2020
    • Qi Ding Technology Qinhuangdao Co., Ltd.
    • SHIH-FU HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTORS FOR LOW COST, HIGH SPEED PRINTED CIRCUIT BOARDS

    • Publication number 20200083625
    • Publication date Mar 12, 2020
    • FCI USA LLC
    • Steven E. Minich
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FO...

    • Publication number 20200072871
    • Publication date Mar 5, 2020
    • Intel Corporation
    • Pooya Tadayon
    • G01 - MEASURING TESTING
  • Information Patent Application

    WIRING BOARD

    • Publication number 20190373727
    • Publication date Dec 5, 2019
    • NGK Spark Plug Co., Ltd.
    • Takahiro HAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TRACE/VIA HYBRID STRUCTURE MULTICHIP CARRIER

    • Publication number 20190327833
    • Publication date Oct 24, 2019
    • International Business Machines Corporation
    • Chad M. Albertson
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH SPEED SIGNAL FAN-OUT METHOD FOR BGA AND PRINTED CIRCUIT BOARD...

    • Publication number 20190208618
    • Publication date Jul 4, 2019
    • CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LT D
    • JIWEI WEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...

    • Publication number 20180343748
    • Publication date Nov 29, 2018
    • Fujitsu Limited
    • Yoshikazu Hirano
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier and Manufacturing Method

    • Publication number 20180288879
    • Publication date Oct 4, 2018
    • Mikael Tuominen
    • H01 - BASIC ELECTRIC ELEMENTS