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H05K2201/09636

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09636Details of adjacent, not connected vias

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 11,792,916
- Issue date Oct 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Han Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for break out of interconnections for high-dens...
- Patent number 11,778,731
- Issue date Oct 3, 2023
- Raytheon Company
- Thanh Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slotted vias for circuit boards
- Patent number 11,758,644
- Issue date Sep 12, 2023
- Dell Products L.P.
- Jason Pritchard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Quad-trace structures for high-speed signaling
- Patent number 11,751,323
- Issue date Sep 5, 2023
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 11,122,686
- Issue date Sep 14, 2021
- Ibiden Co., Ltd.
- Yasuki Kimishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board having thermal through...
- Patent number 11,116,071
- Issue date Sep 7, 2021
- ZKW GROUP GMBH
- Erik Edlinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and optical transceiver with the printed circ...
- Patent number 11,057,986
- Issue date Jul 6, 2021
- Lumentum Japan, Inc.
- Osamu Kagaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cross-talk reduction technique with fine pitch vias
- Patent number 10,966,311
- Issue date Mar 30, 2021
- Hewlett Packard Enterprise Development LP
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connectors for low cost, high speed printed circuit boards
- Patent number 10,958,001
- Issue date Mar 23, 2021
- FCI USA LLC
- Steven E. Minich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 10,905,008
- Issue date Jan 26, 2021
- NGK Spark Plug Co., Ltd.
- Takahiro Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed signal fan-out method for BGA and printed circuit board...
- Patent number 10,897,810
- Issue date Jan 19, 2021
- CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD.
- Jiwei Wen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Trace/via hybrid structure multichip carrier
- Patent number 10,791,628
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with non-plated hole interposed between plated holes...
- Patent number 10,631,407
- Issue date Apr 21, 2020
- Cisco Technology, Inc.
- Jennifer Oliver
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB with minimized crosstalk
- Patent number 10,595,394
- Issue date Mar 17, 2020
- Cray Inc.
- Hyunjun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and manufacturing method
- Patent number 10,595,414
- Issue date Mar 17, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and optical transceiver with the printed circ...
- Patent number 10,470,293
- Issue date Nov 5, 2019
- Lumentum Japan, Inc.
- Osamu Kagaya
- G02 - OPTICS
Information Patent Grant
Trace/via hybrid structure multichip carrier
- Patent number 10,426,030
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus, fabrication method therefor and electronic part
- Patent number 10,383,229
- Issue date Aug 13, 2019
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly architecture employing organic support for compact and imp...
- Patent number 10,368,439
- Issue date Jul 30, 2019
- Intel Corporation
- Adel A. Elsherbini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate on which electronic component is soldered, electronic dev...
- Patent number 10,299,387
- Issue date May 21, 2019
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device
- Patent number 10,283,688
- Issue date May 7, 2019
- Nichia Corporation
- Akira Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crosstalk reduction in electrical interconnects
- Patent number 10,263,380
- Issue date Apr 16, 2019
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-drill printed circuit board via
- Patent number 10,251,270
- Issue date Apr 2, 2019
- Innovium, Inc.
- Yongming Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming micro via in printed circuit board
- Patent number 10,111,343
- Issue date Oct 23, 2018
- Finisar Corporation
- Henry Meyer Daghighian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board via configurations for high frequency signaling
- Patent number 9,986,634
- Issue date May 29, 2018
- Curtis-Wright Controls, Inc.
- Michael Rose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layer-layer registration coupon for printed circuit boards
- Patent number 9,958,496
- Issue date May 1, 2018
- Oracle International Corporation
- Stephanie Moran
- G01 - MEASURING TESTING
Information Patent Grant
Interconnect topology with staggered vias for interconnecting diffe...
- Patent number 9,936,570
- Issue date Apr 3, 2018
- Intel Corporation
- Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Breakout via system
- Patent number 9,769,926
- Issue date Sep 19, 2017
- Dell Products L.P.
- Kevin Warren Mundt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Crosstalk reduction in electrical interconnects
- Patent number 9,755,391
- Issue date Sep 5, 2017
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency signal line
- Patent number 9,583,809
- Issue date Feb 28, 2017
- Murata Manufacturing Co., Ltd.
- Noboru Kato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321711
- Publication date Sep 26, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
- Publication number 20240260188
- Publication date Aug 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Brian Mark Hostetler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS
- Publication number 20240107661
- Publication date Mar 28, 2024
- KYOCERA DOCUMENT SOLUTIONS INC.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATES WITH CONTINUOUS SLOT VIAS
- Publication number 20240074055
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20230422412
- Publication date Dec 28, 2023
- TOPPAN INC.
- Akihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20230363082
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Byeongkeol KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAPACITOR IN A SUBSTRATE VIA
- Publication number 20230319997
- Publication date Oct 5, 2023
- Intel Corporation
- Aslam HASWAREY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND COMMUNICATION DEVICE
- Publication number 20230199940
- Publication date Jun 22, 2023
- Sumitomo Electric Industries, Ltd.
- Noriyoshi SUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230095087
- Publication date Mar 30, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Jae Han PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
QUAD-TRACE STRUCTURES FOR HIGH-SPEED SIGNALING
- Publication number 20230031615
- Publication date Feb 2, 2023
- DELL PRODUCTS, L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLOTTED VIAS FOR CIRCUIT BOARDS
- Publication number 20220369452
- Publication date Nov 17, 2022
- Dell Products L.P.
- Jason PRITCHARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Divider
- Publication number 20220077557
- Publication date Mar 10, 2022
- Ampleon Netherlands B.V.
- Mohadig Widha Rousstia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CROSS-TALK REDUCTION TECHNIQUE WITH FINE PITCH VIAS
- Publication number 20200375024
- Publication date Nov 26, 2020
- Cray Inc.
- HYUNJUN KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MAKING CIRCUIT BOARD
- Publication number 20200163229
- Publication date May 21, 2020
- Qi Ding Technology Qinhuangdao Co., Ltd.
- SHIH-FU HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTORS FOR LOW COST, HIGH SPEED PRINTED CIRCUIT BOARDS
- Publication number 20200083625
- Publication date Mar 12, 2020
- FCI USA LLC
- Steven E. Minich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FO...
- Publication number 20200072871
- Publication date Mar 5, 2020
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Application
WIRING BOARD
- Publication number 20190373727
- Publication date Dec 5, 2019
- NGK Spark Plug Co., Ltd.
- Takahiro HAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE/VIA HYBRID STRUCTURE MULTICHIP CARRIER
- Publication number 20190327833
- Publication date Oct 24, 2019
- International Business Machines Corporation
- Chad M. Albertson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED SIGNAL FAN-OUT METHOD FOR BGA AND PRINTED CIRCUIT BOARD...
- Publication number 20190208618
- Publication date Jul 4, 2019
- CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LT D
- JIWEI WEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...
- Publication number 20180343748
- Publication date Nov 29, 2018
- Fujitsu Limited
- Yoshikazu Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Manufacturing Method
- Publication number 20180288879
- Publication date Oct 4, 2018
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS, FABRICATION METHOD THEREFOR AND ELECTRONIC PART
- Publication number 20180279476
- Publication date Sep 27, 2018
- Fujitsu Limited
- Taiki UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CROSSTALK REDUCTION IN ELECTRICAL INTERCONNECTS
- Publication number 20170324208
- Publication date Nov 9, 2017
- Oracle International Corporation
- DARKO R. POPOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD VIA CONFIGURATIONS FOR HIGH FREQUENCY SIGNALING
- Publication number 20170181270
- Publication date Jun 22, 2017
- Curtiss-Wright Controls, Inc.
- Michael Rose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160242293
- Publication date Aug 18, 2016
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...
- Publication number 20140266549
- Publication date Sep 18, 2014
- TRIPOD TECHNOLOGY CORPORATION
- Bo-Shiung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS
- Publication number 20140182891
- Publication date Jul 3, 2014
- Madhumitha Rengarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for Differential Far-End Crosstalk Reduction
- Publication number 20140179162
- Publication date Jun 26, 2014
- Raul Enriquez Shibayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR SUPPRESSING POWER PLANE NOISE
- Publication number 20130326871
- Publication date Dec 12, 2013
- Micron Technology, Inc.
- Houfei Chen
- G11 - INFORMATION STORAGE
Information Patent Application
PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD
- Publication number 20130279134
- Publication date Oct 24, 2013
- Canon Kabushiki Kaisha
- Seiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS

Details of adjacent, not connected vias

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Systems and methods for break out of interconnections for high-dens...

Slotted vias for circuit boards

Quad-trace structures for high-speed signaling

Wiring substrate

Method for producing a printed circuit board having thermal through...

Printed circuit board and optical transceiver with the printed circ...

Method for cross-talk reduction technique with fine pitch vias

Connectors for low cost, high speed printed circuit boards

Wiring board

High speed signal fan-out method for BGA and printed circuit board...

Trace/via hybrid structure multichip carrier

Circuit board with non-plated hole interposed between plated holes...

PCB with minimized crosstalk

Component carrier and manufacturing method

Printed circuit board and optical transceiver with the printed circ...

Trace/via hybrid structure multichip carrier

Electronic apparatus, fabrication method therefor and electronic part

Assembly architecture employing organic support for compact and imp...

Substrate on which electronic component is soldered, electronic dev...

Light emitting device

Crosstalk reduction in electrical interconnects

Dual-drill printed circuit board via

Method of forming micro via in printed circuit board

Circuit board via configurations for high frequency signaling

Layer-layer registration coupon for printed circuit boards

Interconnect topology with staggered vias for interconnecting diffe...

Breakout via system

Crosstalk reduction in electrical interconnects

High-frequency signal line

Patents Applicationslast 30 patents

SUBSTRATE AND A METHOD FOR MANUFACTURING THE SAME

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS

SUBSTRATES WITH CONTINUOUS SLOT VIAS

MULTILAYER WIRING BOARD

CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

CAPACITOR IN A SUBSTRATE VIA

CIRCUIT MODULE AND COMMUNICATION DEVICE

PRINTED CIRCUIT BOARD

QUAD-TRACE STRUCTURES FOR HIGH-SPEED SIGNALING

SLOTTED VIAS FOR CIRCUIT BOARDS

Power Divider

METHOD FOR CROSS-TALK REDUCTION TECHNIQUE WITH FINE PITCH VIAS

CIRCUIT BOARD AND METHOD OF MAKING CIRCUIT BOARD

CONNECTORS FOR LOW COST, HIGH SPEED PRINTED CIRCUIT BOARDS

ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FO...

WIRING BOARD

TRACE/VIA HYBRID STRUCTURE MULTICHIP CARRIER

HIGH SPEED SIGNAL FAN-OUT METHOD FOR BGA AND PRINTED CIRCUIT BOARD...

SUBSTRATE ON WHICH ELECTRONIC COMPONENT IS SOLDERED, ELECTRONIC DEV...

Component Carrier and Manufacturing Method

ELECTRONIC APPARATUS, FABRICATION METHOD THEREFOR AND ELECTRONIC PART

CROSSTALK REDUCTION IN ELECTRICAL INTERCONNECTS

CIRCUIT BOARD VIA CONFIGURATIONS FOR HIGH FREQUENCY SIGNALING

CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD TH...

GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS

Apparatus for Differential Far-End Crosstalk Reduction

METHODS FOR SUPPRESSING POWER PLANE NOISE

PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD