Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

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H01L2924/40

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/40Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device and method for manufacturing the same
- Patent number 12,315,855
- Issue date May 27, 2025
- Japan Display Inc.
- Kenichi Takemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding capillary
- Patent number 12,269,109
- Issue date Apr 8, 2025
- CRAFTSTECH, INC.
- Jeffrey C. Roberts
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for the alignment of substrates
- Patent number 12,199,062
- Issue date Jan 14, 2025
- EV Group E. Thallner GmbH
- Dominik Zinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and securing assembly therefor
- Patent number 12,074,133
- Issue date Aug 27, 2024
- GUANGZHOU AIFO LIGHT COMMUNICATION TECHNOLOGY COMPANY LTD.
- Guoqiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,427
- Issue date Aug 6, 2024
- Shinkawa Ltd.
- Osamu Kakutani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus, and method of manufacturing...
- Patent number 11,823,924
- Issue date Nov 21, 2023
- Kioxia Corporation
- Aoi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging device, chip packaging method, and package chip
- Patent number 11,764,184
- Issue date Sep 19, 2023
- HOSIN GLOBAL ELECTRONICS CO., LTD
- Chen-Nan Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-beam laser de-bonding apparatus and method thereof
- Patent number 11,699,676
- Issue date Jul 11, 2023
- LASERSSEL CO., LTD.
- Jae-Joon Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell and method of manufacturing the same
- Patent number 11,404,597
- Issue date Aug 2, 2022
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method
- Patent number 11,114,341
- Issue date Sep 7, 2021
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,950,517
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package structure, optical module, and method for manufactu...
- Patent number 10,720,751
- Issue date Jul 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Yu-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices f...
- Patent number 10,636,770
- Issue date Apr 28, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for transfer of semiconductor devices
- Patent number 10,622,337
- Issue date Apr 14, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,615,153
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Semiconductor device on glass substrate
- Patent number 10,615,152
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Printed circuit board and semiconductor package
- Patent number 10,586,748
- Issue date Mar 10, 2020
- Samsung Electronics Co., Ltd.
- Soo-Jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,566,319
- Issue date Feb 18, 2020
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices
- Patent number 10,490,532
- Issue date Nov 26, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Laser welding method
- Patent number 10,442,035
- Issue date Oct 15, 2019
- Fuji Electric Co., Ltd.
- Yuta Tamai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for multi-direct transfer of semiconductors
- Patent number 10,373,937
- Issue date Aug 6, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Substrate with array of LEDs for backlighting a display device
- Patent number 10,361,176
- Issue date Jul 23, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support substrate for transfer of semiconductor devices
- Patent number 10,354,895
- Issue date Jul 16, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device on string circuit and method of making the same
- Patent number 10,325,885
- Issue date Jun 18, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS
- Publication number 20250149497
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITION ALIGNMENT DEVICE, POSITION ALIGNMENT METHOD, BONDING DEVIC...
- Publication number 20250149498
- Publication date May 8, 2025
- CANON MACHINERY INC.
- Shinya KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING EQUIPMENT, BONDING EQUIPMENT, POSITIONING METHOD AND BO...
- Publication number 20250140736
- Publication date May 1, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- RYO FUJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DIE BONDING
- Publication number 20250140592
- Publication date May 1, 2025
- Canon Kabushiki Kaisha
- Nilabh K ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE
- Publication number 20250118589
- Publication date Apr 10, 2025
- Silicon Box, Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus, Mounting Method, and Method for Manufacturin...
- Publication number 20250096188
- Publication date Mar 20, 2025
- Fasford Technology Co., Ltd.
- Keita YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OPTIC BRIDGE CHIPS FOR CHIP-TO-CHIP COMMUNICATION
- Publication number 20250096142
- Publication date Mar 20, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Jae Kyu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANU...
- Publication number 20250087624
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFERRING AND BONDING DEVICE, AND CHIP TRANSFERRING AND BON...
- Publication number 20250087626
- Publication date Mar 13, 2025
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20250079395
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND ITS OPERATING METHOD
- Publication number 20250038147
- Publication date Jan 30, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jong Hyup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD AND BONDING SYSTEM
- Publication number 20250029950
- Publication date Jan 23, 2025
- TOKYO ELECTRON LIMITED
- Yuji MIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP BONDING DEVICE
- Publication number 20240404985
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- BONGKEN YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF BONDING SE...
- Publication number 20240395764
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Gyeongjae JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM
- Publication number 20240304594
- Publication date Sep 12, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240297045
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...
- Publication number 20240258134
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Masayuki NISHIYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT CHUCK EDGE RING
- Publication number 20240250059
- Publication date Jul 25, 2024
- TOKYO ELECTRON LIMITED
- Christopher NETZBAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240234215
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...
- Publication number 20240194531
- Publication date Jun 13, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Anna ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20240186278
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Masato KAJINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20240153906
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Byeongtak PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING AN ADHESION FORCE
- Publication number 20240136231
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Donggap SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240128229
- Publication date Apr 18, 2024
- Samsung Electronics Co., LTD
- Byungkeun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20240120311
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- FUTOSHI YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE
- Publication number 20240105497
- Publication date Mar 28, 2024
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER...
- Publication number 20240088089
- Publication date Mar 14, 2024
- SHINKAWA LTD.
- Tsutomu KIYONO
- H01 - BASIC ELECTRIC ELEMENTS

Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method for manufacturing the same

Wire bonding capillary

Device and method for the alignment of substrates

Chip bonding apparatus and securing assembly therefor

Wire bonding apparatus

Semiconductor device

Semiconductor manufacturing apparatus, and method of manufacturing...

Chip packaging device, chip packaging method, and package chip

Multi-beam laser de-bonding apparatus and method thereof

Systems for direct transfer of semiconductor device die

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Solar cell and method of manufacturing the same

Method for improved transfer of semiconductor die

Laser processing method

Printed circuit board and semiconductor package

Apparatus for direct transfer of semiconductor device die

Optical package structure, optical module, and method for manufactu...

Apparatus and method for direct transfer of semiconductor devices f...

Method and apparatus for transfer of semiconductor devices

Apparatus for direct transfer of semiconductor device die

Semiconductor device on glass substrate

Printed circuit board and semiconductor package

Apparatus for direct transfer of semiconductor device die

Apparatus and method for direct transfer of semiconductor devices

Laser welding method

Apparatus for multi-direct transfer of semiconductors

Substrate with array of LEDs for backlighting a display device

Support substrate for transfer of semiconductor devices

Semiconductor device on string circuit and method of making the same

Patents Applicationslast 30 patents

BONDING TOOL AND CHIP-ON-WAFER BONDING PROCESS

POSITION ALIGNMENT DEVICE, POSITION ALIGNMENT METHOD, BONDING DEVIC...

POSITIONING EQUIPMENT, BONDING EQUIPMENT, POSITIONING METHOD AND BO...

METHOD AND SYSTEM FOR DIE BONDING

DIE TRANSFER METHOD AND APPARATUS FOR MULTI-CHIP MODULE

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

Die Bonding Apparatus, Mounting Method, and Method for Manufacturin...

ELECTRO-OPTIC BRIDGE CHIPS FOR CHIP-TO-CHIP COMMUNICATION

SEMICONDUCTOR CHIP BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANU...

CHIP TRANSFERRING AND BONDING DEVICE, AND CHIP TRANSFERRING AND BON...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

BONDING DEVICE AND ITS OPERATING METHOD

BONDING METHOD AND BONDING SYSTEM

SEMICONDUCTOR CHIP BONDING DEVICE

BONDING APPARATUS FOR SEMICONDUCTOR DEVICE AND METHOD OF BONDING SE...

BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING...

COMPLIANT CHUCK EDGE RING

APPARATUS FOR MEASURING AN ADHESION FORCE

THREE-DIMENSIONALLY INTEGRATED STRUCTURE AND METHOD FOR FABRICATING...

MOUNTING DEVICE AND MOUNTING METHOD

SUBSTRATE BONDING APPARATUS

APPARATUS FOR MEASURING AN ADHESION FORCE

SOLDER REFLOW APPARATUS

BONDING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER...