TREA

Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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Industry

  • CPC
  • H01L2221/68381
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer
Industries