Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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H01L2221/68381

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 12,224,208
- Issue date Feb 11, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of microdevices into system substrate
- Patent number 12,211,860
- Issue date Jan 28, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 12,211,730
- Issue date Jan 28, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Integrated fan-out package, package-on-package structure, and manuf...
- Patent number 12,198,996
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 12,198,950
- Issue date Jan 14, 2025
- Semes Co., Ltd.
- Myung A Jeon
- B08 - CLEANING
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,199,024
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of parallel transfer of micro-devices using treatment
- Patent number 12,176,384
- Issue date Dec 24, 2024
- Applied Materials, Inc.
- Manivannan Thothadri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel assembly of discrete components onto a substrate
- Patent number 12,176,239
- Issue date Dec 24, 2024
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 12,165,900
- Issue date Dec 10, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED manufacturing device
- Patent number 12,154,816
- Issue date Nov 26, 2024
- HARDRAM CO., LTD.
- Sung Wook Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pickup apparatus and method of using the same
- Patent number 12,142,499
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selectively releasing a light-emitting diode chip and me...
- Patent number 12,125,735
- Issue date Oct 22, 2024
- ASTI GLOBAL INC., TAIWAN
- Te-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for transferring a micro semiconductor element...
- Patent number 12,106,995
- Issue date Oct 1, 2024
- Quanzhou San'an Semiconductor Technology Co., Ltd.
- Zheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method, curable resin compositio...
- Patent number 12,084,599
- Issue date Sep 10, 2024
- Resonac Corporation
- Emi Miyazawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Nanofabrication and design techniques for 3D ICs and configurable A...
- Patent number 12,079,557
- Issue date Sep 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of placing a micro device to a receiver substrate
- Patent number 12,080,685
- Issue date Sep 3, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an optoelectronic light emitting device
- Patent number 12,074,145
- Issue date Aug 27, 2024
- Osram Opto Semiconductors GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 12,062,603
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20250054801
- Publication date Feb 13, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jong Hyup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE AND SEPARATION METHOD
- Publication number 20250038036
- Publication date Jan 30, 2025
- Nichia Corporation.
- Hiroaki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Manufacture
- Publication number 20250022763
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
- Publication number 20250015030
- Publication date Jan 9, 2025
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER DEVICE AND TRANSFER METHOD
- Publication number 20250014936
- Publication date Jan 9, 2025
- TORAY ENGINEERING CO., LTD.
- Koichi KAZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006686
- Publication date Jan 2, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Hun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WET TRANSFER METHOD AND EQUIPMENT USING MAGNETIC FORCE
- Publication number 20250006542
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Youngtek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY
- Publication number 20250006543
- Publication date Jan 2, 2025
- ams-OSRAM International GmbH
- Daniel Leisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...
- Publication number 20250006520
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413121
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHIH-TING LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...
- Publication number 20240413129
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Wonsik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET RELEASE APPARATUS
- Publication number 20240404847
- Publication date Dec 5, 2024
- Tokyo Seimitsu Co., Ltd.
- Hitoshi AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATED ASSEMBLY
- Publication number 20240387229
- Publication date Nov 21, 2024
- Disco Corporation
- Fumihiro INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20240387230
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240387206
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...
- Publication number 20240387308
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF
- Publication number 20240379514
- Publication date Nov 14, 2024
- Avago Technologies International Sales Pte. Limited
- Kwok Cheung Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS
- Publication number 20240352281
- Publication date Oct 24, 2024
- NISSAN CHEMICAL CORPORATION
- Takahisa OKUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE
- Publication number 20240339361
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...
- Publication number 20240332056
- Publication date Oct 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME
- Publication number 20240321621
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MANUFACTURING METHOD, MANUFACTURING FILM, AND...
- Publication number 20240312848
- Publication date Sep 19, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Eiji Hayashishita
- G01 - MEASURING TESTING
Information Patent Application
DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...
- Publication number 20240308200
- Publication date Sep 19, 2024
- Skiileux Electricity Inc.
- SHENG-HSIANG YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Selective photo-induced transfer of good micro leds
- Publication number 20240290647
- Publication date Aug 29, 2024
- Aledia
- Christophe LINCHENEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282760
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and member for handling an electronic device
- Publication number 20240274459
- Publication date Aug 15, 2024
- Aledia
- Christophe LINCHENEAU
- H01 - BASIC ELECTRIC ELEMENTS

Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package device

Method of separating electronic devices having a back layer and app...

Chip package structure having molding layer

Integration of microdevices into system substrate

Dynamic release tapes for assembly of discrete components

Selective micro device transfer to receiver substrate

Integrated fan-out package, package-on-package structure, and manuf...

Apparatus and method for processing substrate

Semiconductor device and method of manufacture

Methods of parallel transfer of micro-devices using treatment

Parallel assembly of discrete components onto a substrate

Method for separating dies from a semiconductor substrate

Method of mechanical separation for a double layer transfer

Semiconductor package with front side and back side redistribution...

Micro-LED manufacturing device

Multi-chip integrated fan-out package

Semiconductor packages and methods of forming same

Pickup apparatus and method of using the same

Method for selectively releasing a light-emitting diode chip and me...

Package structure with fan-out feature

Structure and method for transferring a micro semiconductor element...

Semiconductor device manufacturing method, curable resin compositio...

Nanofabrication and design techniques for 3D ICs and configurable A...

Formation method of chip package with fan-out structure

Method of placing a micro device to a receiver substrate

Methods and devices for fabricating and assembling printable semico...

Selective transfer of micro devices

Method for manufacturing an optoelectronic light emitting device

Semiconductor package having routable encapsulated conductive subst...

Semiconductor device having via sidewall adhesion with encapsulant

Patents Applicationslast 30 patents

METHOD OF FABRICATING DISPLAY PANEL

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE AND SEPARATION METHOD

Semiconductor Device and Methods of Manufacture

SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE

TRANSFER DEVICE AND TRANSFER METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHIP WET TRANSFER METHOD AND EQUIPMENT USING MAGNETIC FORCE

METHOD FOR PRODUCING AN OPTOELECTRONIC ASSEMBLY

APPARATUS FOR SEPARATING SINGULATED DIE FROM SUBSTRATE DICING TAPE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

TRANSFER SUBSTRATE AND LIGHT EMITTING DIODE TRANSFER METHOD USING T...

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

SHEET RELEASE APPARATUS

METHOD OF MANUFACTURING LAMINATED ASSEMBLY

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

PICKUP APPARATUS AND METHOD OF USING THE SAME

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...

CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF

SELECTIVE TRANSFER OF MICRO DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS

METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...

FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME

ELECTRONIC COMPONENT MANUFACTURING METHOD, MANUFACTURING FILM, AND...

DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...

Selective photo-induced transfer of good micro leds

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Method and member for handling an electronic device