Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Industry

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H01L2221/68381

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively transferring semiconductor device
- Patent number 12,369,431
- Issue date Jul 22, 2025
- Epistar Corporation
- Hao-Min Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 12,347,731
- Issue date Jul 1, 2025
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microdevice integration into system substrate
- Patent number 12,349,527
- Issue date Jul 1, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Massive parallel assembly method
- Patent number 12,327,751
- Issue date Jun 10, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Hermann Oppermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing display device using semiconductor light em...
- Patent number 12,328,979
- Issue date Jun 10, 2025
- LG Electronics Inc.
- Mihee Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination processes and fabrication of thin film devices thereby
- Patent number 12,322,635
- Issue date Jun 3, 2025
- Purdue Research Foundation
- Chi Hwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layers around...
- Patent number 12,322,725
- Issue date Jun 3, 2025
- Semtech Corporation
- Satyamoorthi Chinnusamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,308,275
- Issue date May 20, 2025
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
DBI to SI bonding for simplified handle wafer
- Patent number 12,300,662
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet
- Patent number 12,286,569
- Issue date Apr 29, 2025
- Nitto Denko Corporation
- Shusaku Ueno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for preparing a self-supporting substrate from a film base s...
- Patent number 12,281,408
- Issue date Apr 22, 2025
- Yiguan Information Technology (Shanghai) Co., Ltd.
- Tao Jiang
- C30 - CRYSTAL GROWTH
Information Patent Grant
Adhesive tapes for receiving discrete components
- Patent number 12,266,558
- Issue date Apr 1, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit and associated packaging method
- Patent number 12,266,583
- Issue date Apr 1, 2025
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer
- Patent number 12,255,086
- Issue date Mar 18, 2025
- Disco Corporation
- Kohei Tsujimoto
- B24 - GRINDING POLISHING
Information Patent Grant
Multi-level micro-device tethers
- Patent number 12,249,532
- Issue date Mar 11, 2025
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure
- Patent number 12,249,531
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating electronic devices having a back layer and app...
- Patent number 12,224,208
- Issue date Feb 11, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure having molding layer
- Patent number 12,218,095
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of microdevices into system substrate
- Patent number 12,211,860
- Issue date Jan 28, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 12,211,730
- Issue date Jan 28, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 12,199,058
- Issue date Jan 14, 2025
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING MICRO DEVICE PANEL
- Publication number 20250239470
- Publication date Jul 24, 2025
- PlayNitride Display Co., Ltd.
- Yun-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...
- Publication number 20250232977
- Publication date Jul 17, 2025
- II-VI Delaware, Inc.
- Jeremy Andre Turcaud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...
- Publication number 20250233002
- Publication date Jul 17, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Workpiece Processing Method
- Publication number 20250226229
- Publication date Jul 10, 2025
- LINTEC CORPORATION
- Hayato Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT
- Publication number 20250218850
- Publication date Jul 3, 2025
- EPISTAR CORPORATION
- Chang-Tai HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT PROCESSING APPARATUS
- Publication number 20250218830
- Publication date Jul 3, 2025
- PlayNitride Display Co., Ltd.
- Yen-Mu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...
- Publication number 20250219020
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Junho CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS
- Publication number 20250218849
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Sangjun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250210401
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE TAPES FOR RECEIVING DISCRETE COMPONENTS
- Publication number 20250210404
- Publication date Jun 26, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250201762
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Sungmin MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR WORKPIECE PROCESSING AND MANUFACTURING METHOD OF PROCESSE...
- Publication number 20250201619
- Publication date Jun 19, 2025
- LINTEC CORPORATION
- Akio FUKUMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE
- Publication number 20250201620
- Publication date Jun 19, 2025
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250201753
- Publication date Jun 19, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20250176105
- Publication date May 29, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER
- Publication number 20250167158
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160096
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE
- Publication number 20250160095
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE
- Publication number 20250126887
- Publication date Apr 17, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...
- Publication number 20250112188
- Publication date Apr 3, 2025
- Intel Corporation
- Georgios C. Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES
- Publication number 20250112210
- Publication date Apr 3, 2025
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES
- Publication number 20250112216
- Publication date Apr 3, 2025
- Intel Corporation
- Qiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105077
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LAYER TRANSFER
- Publication number 20250105046
- Publication date Mar 27, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250096107
- Publication date Mar 20, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20250054801
- Publication date Feb 13, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jong Hyup KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE AND SEPARATION METHOD
- Publication number 20250038036
- Publication date Jan 30, 2025
- Nichia Corporation.
- Hiroaki KAGEYAMA
- H01 - BASIC ELECTRIC ELEMENTS

Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming semiconductor packages

Method of selectively transferring semiconductor device

Method for fabricating a chip package

Semiconductor components having conductive vias with aligned back s...

Microdevice integration into system substrate

Lthc as charging barrier in info package formation

Semiconductor device and manufacturing method thereof

Massive parallel assembly method

Method of manufacturing display device using semiconductor light em...

Delamination processes and fabrication of thin film devices thereby

Semiconductor package using a coreless signal distribution structure

Semiconductor device and method of forming insulating layers around...

Heterogeneous integration of components onto compact devices using...

DBI to SI bonding for simplified handle wafer

Adhesive sheet

Method for preparing a self-supporting substrate from a film base s...

Adhesive tapes for receiving discrete components

Flip chip package unit and associated packaging method

Semiconductor packages with an intermetallic layer

Processing method of wafer

Multi-level micro-device tethers

Method for forming semiconductor structure

Dummy structure of stacked and bonded semiconductor device

Integrated circuit structure

Package device

Method of separating electronic devices having a back layer and app...

Chip package structure having molding layer

Integration of microdevices into system substrate

Dynamic release tapes for assembly of discrete components

Selective micro device transfer to receiver substrate

Patents Applicationslast 30 patents

METHOD OF FABRICATING MICRO DEVICE PANEL

IMPLANTATION PROCESS TO MITIGATE BOWING OF WAFERS INTRODUCED BY SPL...

MATERIAL FOR POSITIONAL ERROR COMPENSATION IN ASSEMBLY OF DISCRETE...

Workpiece Processing Method

SEMICONDUCTOR DEVICE ARRANGEMENT

COMPONENT PROCESSING APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE BY USING CARRIER SUBS...

WAFER BONDING APPARATUS

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

ADHESIVE TAPES FOR RECEIVING DISCRETE COMPONENTS

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

SHEET FOR WORKPIECE PROCESSING AND MANUFACTURING METHOD OF PROCESSE...

PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SELECTIVE TRANSFER OF MICRO DEVICES

CHIP PACKAGE STRUCTURE HAVING MOLDING LAYER

MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE

MICRODEVICE INTEGRATION INTO SYSTEM SUBSTRATE

INTEGRATED CIRCUIT STRUCTURE

MANUFACTURING METHOD OF PACKAGE DEVICE

INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY ANTENNAS, INTERCONNECTS,...

FINE-GRAIN INTEGRATION OF GROUP III-V DEVICES

FINE-GRAIN INTEGRATION OF RADIO FREQUENCY AND HIGH-VOLTAGE DEVICES

PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SELECTIVE LAYER TRANSFER

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

METHOD OF FABRICATING DISPLAY PANEL

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE AND SEPARATION METHOD