Details of chemical or physical process used for separating the auxiliary support from a device or wafer

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CPC
H01L2221/68381

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,961,814
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods for forming the same
- Patent number 11,961,791
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,942,408
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,464
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 11,942,354
- Issue date Mar 26, 2024
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including binding agent adhering an integrated...
- Patent number 11,929,345
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RF devices with enhanced performance including at...
- Patent number 11,923,238
- Issue date Mar 5, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LTHC as charging barrier in info package formation
- Patent number 11,923,353
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon handler with laser-release layers
- Patent number 11,908,723
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support substrates, methods of fabricating semiconductor packages u...
- Patent number 11,908,727
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Kunsil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively transferring semiconductor device
- Patent number 11,901,478
- Issue date Feb 13, 2024
- Epistar Corporation
- Hao-Min Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,881,471
- Issue date Jan 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,874,513
- Issue date Jan 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,869,879
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,855,007
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with selective component removal
- Patent number 11,854,855
- Issue date Dec 26, 2023
- X Display Company Technology Limited
- Erich Radauscher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device structures and double-sided electrical te...
- Patent number 11,854,894
- Issue date Dec 26, 2023
- Intel Corporation
- Valluri R. Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor element
- Patent number 11,854,856
- Issue date Dec 26, 2023
- Mitsubishi Electric Corporation
- Masahiro Fujikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method, curable resin compositio...
- Patent number 11,840,648
- Issue date Dec 12, 2023
- Resonac Corporation
- Emi Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 11,830,745
- Issue date Nov 28, 2023
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing a wafer
- Patent number 11,830,724
- Issue date Nov 28, 2023
- STMicroelectronics S.r.l.
- Ruggero Anzalone
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing carrier
- Patent number 11,823,965
- Issue date Nov 21, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel assembly of discrete components onto a substrate
- Patent number 11,804,397
- Issue date Oct 31, 2023
- KULICKE & SOFFA NETHERLANDS B.V.
- Val Marinov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,804,461
- Issue date Oct 31, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Ping Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction for semiconductor devices based on wafer bonding
- Patent number 11,798,838
- Issue date Oct 24, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-debondable composition, laminate thereof, and laser-debonding...
- Patent number 11,794,381
- Issue date Oct 24, 2023
- Daxin Materials Corporation
- Shih-Yun Chiu
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF
- Publication number 20240120230
- Publication date Apr 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Tae Hee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUCTION ASSISTANCE DEVICE
- Publication number 20240112943
- Publication date Apr 4, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...
- Publication number 20240093059
- Publication date Mar 21, 2024
- Resonac Corporation
- Emi MIYAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...
- Publication number 20240088002
- Publication date Mar 14, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE WITH CHIPS, AND SUBSTRATE PROCES...
- Publication number 20240079403
- Publication date Mar 7, 2024
- TOKYO ELECTRON LIMITED
- Yoshihisa MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20240071753
- Publication date Feb 29, 2024
- Disco Corporation
- Shunsuke TERANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING DISPLAY PANEL
- Publication number 20240072027
- Publication date Feb 29, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jeong Won HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...
- Publication number 20240063207
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SELF-SUPPORTING GALLIUM NITRIDE SUBSTRATE
- Publication number 20240063016
- Publication date Feb 22, 2024
- SINO NITRIDE SEMICONDUCTOR CO., LTD.
- Junjie REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240063163
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WORKPIECE
- Publication number 20240030068
- Publication date Jan 25, 2024
- Disco Corporation
- Hiroyuki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PROCESSING
- Publication number 20240021572
- Publication date Jan 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20240021461
- Publication date Jan 18, 2024
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240006218
- Publication date Jan 4, 2024
- INFINEON TECHNOLOGIES AG
- Gregor Langer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
- Publication number 20230420284
- Publication date Dec 28, 2023
- Nichia Corporation.
- Kensuke YAMAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT TRANSFER BY LEVITATION
- Publication number 20230402302
- Publication date Dec 14, 2023
- NEXPERIA B.V.
- Joep Stokkermans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE
- Publication number 20230395418
- Publication date Dec 7, 2023
- EV GROUP E. THALLNER GMBH
- Boris Povazay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING SEMICONDUCTOR DEVICES
- Publication number 20230386888
- Publication date Nov 30, 2023
- STATS ChipPAC Pte Ltd.
- GunHyuck LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED WAFER DEBONDING AND CLEANING APPARATUS AND DEBONDING AND...
- Publication number 20230386885
- Publication date Nov 30, 2023
- GRAND PROCESS TECHNOLOGY CORPORATION
- Chih-cheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH FAN-OUT STRUCTURES
- Publication number 20230378078
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20230377936
- Publication date Nov 23, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20230360946
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-PRECISION PRINTED STRUCTURES AND METHODS OF MAKING
- Publication number 20230360948
- Publication date Nov 9, 2023
- X-CELEPRINT LIMITED
- Ruggero Loi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LEVEL MICRO-DEVICE TETHERS
- Publication number 20230343630
- Publication date Oct 26, 2023
- X Display Company Technology Limited
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Transfer Method, Device Transfer Machine, Target Object Tran...
- Publication number 20230343625
- Publication date Oct 26, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroshi Yamaoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE
- Publication number 20230326937
- Publication date Oct 12, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20230317497
- Publication date Oct 5, 2023
- AUO Corporation
- Bo-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-ASSISTED DIE EJECTION SYSTEM
- Publication number 20230317500
- Publication date Oct 5, 2023
- Intel Corporation
- Chetan Harsha EDARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE PROCESSING CARRIER
- Publication number 20230307301
- Publication date Sep 28, 2023
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS

Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Via for semiconductor device connection and methods of forming the...

Integrated circuit package and method

Package structures and methods for forming the same

Semiconductor structure and manufacturing method thereof

Semiconductor package and method

Dynamic release tapes for assembly of discrete components

Semiconductor device including binding agent adhering an integrated...

Method of forming RF devices with enhanced performance including at...

LTHC as charging barrier in info package formation

Method for fabricating a chip package

Silicon handler with laser-release layers

Support substrates, methods of fabricating semiconductor packages u...

Method of selectively transferring semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Package structure

Semiconductor components having conductive vias with aligned back s...

Semiconductor package using a coreless signal distribution structure

Semiconductor structure

Micro-transfer printing with selective component removal

Integrated circuit device structures and double-sided electrical te...

Method of manufacturing semiconductor element

Semiconductor device manufacturing method, curable resin compositio...

3D packages and methods for forming the same

Apparatus and method for manufacturing a wafer

Substrate processing carrier

Parallel assembly of discrete components onto a substrate

Semiconductor package structure and method of manufacturing the same

Capacitance reduction for semiconductor devices based on wafer bonding

Laser-debondable composition, laminate thereof, and laser-debonding...

Patents Applicationslast 30 patents

APPARATUS FOR FABRICATING DISPLAY PANEL AND FABRICATING METHOD THEREOF

DIE SUCTION ASSISTANCE DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITIO...

SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...

METHOD FOR MANUFACTURING SUBSTRATE WITH CHIPS, AND SUBSTRATE PROCES...

PROCESSING METHOD OF WAFER

METHOD OF FABRICATING DISPLAY PANEL

METHODS FOR FUSION BONDING SEMICONDUCTOR DEVICES TO TEMPORARY CARRI...

METHOD FOR MANUFACTURING SELF-SUPPORTING GALLIUM NITRIDE SUBSTRATE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PROCESSING METHOD OF WORKPIECE

DIE PROCESSING

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE

ELECTRONIC COMPONENT TRANSFER BY LEVITATION

METHOD FOR THE SEPARATION OF STRUCTURES FROM A SUBSTRATE

METHODS FOR MAKING SEMICONDUCTOR DEVICES

INTEGRATED WAFER DEBONDING AND CLEANING APPARATUS AND DEBONDING AND...

PACKAGE WITH FAN-OUT STRUCTURES

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

HIGH-PRECISION PRINTED STRUCTURES AND METHODS OF MAKING

MULTI-LEVEL MICRO-DEVICE TETHERS

Device Transfer Method, Device Transfer Machine, Target Object Tran...

INTEGRATION OF MICRODEVICES INTO SYSTEM SUBSTRATE

DISPLAY APPARATUS

HEAT-ASSISTED DIE EJECTION SYSTEM

SUBSTRATE PROCESSING CARRIER