Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Industry

CPC
H01L2221/68381

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68381Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multi-chip integrated fan-out package
- Patent number 12,148,728
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pickup apparatus and method of using the same
- Patent number 12,142,499
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with fan-out feature
- Patent number 12,125,797
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selectively releasing a light-emitting diode chip and me...
- Patent number 12,125,735
- Issue date Oct 22, 2024
- ASTI GLOBAL INC., TAIWAN
- Te-Fu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for transferring a micro semiconductor element...
- Patent number 12,106,995
- Issue date Oct 1, 2024
- Quanzhou San'an Semiconductor Technology Co., Ltd.
- Zheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method, curable resin compositio...
- Patent number 12,084,599
- Issue date Sep 10, 2024
- Resonac Corporation
- Emi Miyazawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Nanofabrication and design techniques for 3D ICs and configurable A...
- Patent number 12,079,557
- Issue date Sep 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Formation method of chip package with fan-out structure
- Patent number 12,080,653
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shing-Chao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of placing a micro device to a receiver substrate
- Patent number 12,080,685
- Issue date Sep 3, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective transfer of micro devices
- Patent number 12,075,565
- Issue date Aug 27, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an optoelectronic light emitting device
- Patent number 12,074,145
- Issue date Aug 27, 2024
- Osram Opto Semiconductors GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 12,062,603
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier assisted substrate method of manufacturing an electronic de...
- Patent number 12,051,611
- Issue date Jul 30, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Positional error compensation in assembly of discrete components by...
- Patent number 12,046,504
- Issue date Jul 23, 2024
- KULICKE & SOFFA NETHERLANDS B.V.
- Matthew R. Semler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and methods forming the same
- Patent number 12,033,883
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,033,970
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Hun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multifunctional materials for temporary bonding
- Patent number 12,024,594
- Issue date Jul 2, 2024
- Brewer Science, Inc.
- Luke M. Prenger
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing package structure
- Patent number 12,021,037
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration of components onto compact devices using...
- Patent number 12,009,247
- Issue date Jun 11, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 11,996,395
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Jin Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,961,814
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods for forming the same
- Patent number 11,961,791
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,942,408
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,464
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic release tapes for assembly of discrete components
- Patent number 11,942,354
- Issue date Mar 26, 2024
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING LAMINATED ASSEMBLY
- Publication number 20240387229
- Publication date Nov 21, 2024
- Disco Corporation
- Fumihiro INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier Assisted Substrate Method of Manufacturing an Electronic De...
- Publication number 20240387230
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Roger St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240387206
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...
- Publication number 20240387308
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF
- Publication number 20240379514
- Publication date Nov 14, 2024
- Avago Technologies International Sales Pte. Limited
- Kwok Cheung Tsang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE TRANSFER OF MICRO DEVICES
- Publication number 20240381531
- Publication date Nov 14, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS
- Publication number 20240352281
- Publication date Oct 24, 2024
- NISSAN CHEMICAL CORPORATION
- Takahisa OKUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE
- Publication number 20240339361
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...
- Publication number 20240332056
- Publication date Oct 3, 2024
- Board of Regents, The University of Texas System
- Sidlgata V. Sreenivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME
- Publication number 20240321621
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MANUFACTURING METHOD, MANUFACTURING FILM, AND...
- Publication number 20240312848
- Publication date Sep 19, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Eiji Hayashishita
- G01 - MEASURING TESTING
Information Patent Application
DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...
- Publication number 20240308200
- Publication date Sep 19, 2024
- Skiileux Electricity Inc.
- SHENG-HSIANG YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Selective photo-induced transfer of good micro leds
- Publication number 20240290647
- Publication date Aug 29, 2024
- Aledia
- Christophe LINCHENEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER
- Publication number 20240282747
- Publication date Aug 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Chandrasekhar Mandalapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282760
- Publication date Aug 22, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jin Woo CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and member for handling an electronic device
- Publication number 20240274459
- Publication date Aug 15, 2024
- Aledia
- Christophe LINCHENEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266321
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS
- Publication number 20240266340
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chao CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD...
- Publication number 20240240061
- Publication date Jul 18, 2024
- Resonac Corporation
- Tatsuya MAKINO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MICRO-DEVICE SUBSTRATE STRUCTURES WITH POSTS AND INDENTATIONS
- Publication number 20240242998
- Publication date Jul 18, 2024
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240234302
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION
- Publication number 20240218215
- Publication date Jul 4, 2024
- DENKA COMPANY LIMITED
- Tometomo UCHIDA HAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20240222307
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION
- Publication number 20240222352
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Col., Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING P...
- Publication number 20240213072
- Publication date Jun 27, 2024
- NISSAN CHEMICAL CORPORATION
- Shunsuke MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING P...
- Publication number 20240208179
- Publication date Jun 27, 2024
- NISSAN CHEMICAL CORPORATION
- Hiroto OGATA
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES
- Publication number 20240213238
- Publication date Jun 27, 2024
- X Display Company Technology Limited
- Christopher Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203856
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUO-MAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multi-chip integrated fan-out package

Semiconductor packages and methods of forming same

Pickup apparatus and method of using the same

Package structure with fan-out feature

Method for selectively releasing a light-emitting diode chip and me...

Structure and method for transferring a micro semiconductor element...

Semiconductor device manufacturing method, curable resin compositio...

Nanofabrication and design techniques for 3D ICs and configurable A...

Formation method of chip package with fan-out structure

Method of placing a micro device to a receiver substrate

Methods and devices for fabricating and assembling printable semico...

Selective transfer of micro devices

Method for manufacturing an optoelectronic light emitting device

Semiconductor package having routable encapsulated conductive subst...

Semiconductor device having via sidewall adhesion with encapsulant

Carrier assisted substrate method of manufacturing an electronic de...

Positional error compensation in assembly of discrete components by...

Fan-out interconnect structure and methods forming the same

Semiconductor device and manufacturing method thereof

Multifunctional materials for temporary bonding

Method for manufacturing package structure

Heterogeneous integration of components onto compact devices using...

Display device and manufacturing method thereof

Packaged die and RDL with bonding structures therebetween

Integrated circuit package and method

Via for semiconductor device connection and methods of forming the...

Package structures and methods for forming the same

Semiconductor structure and manufacturing method thereof

Semiconductor package and method

Dynamic release tapes for assembly of discrete components

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING LAMINATED ASSEMBLY

Carrier Assisted Substrate Method of Manufacturing an Electronic De...

PICKUP APPARATUS AND METHOD OF USING THE SAME

MANUFACTURING METHOD OF PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTUR...

CORELESS SUBSTRATES AND MANUFACUTRING METHODS THEREOF

SELECTIVE TRANSFER OF MICRO DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS

METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE

HETEROGENEOUS INTEGRATION OF COMPONENTS ONTO COMPACT DEVICES USING...

FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME

ELECTRONIC COMPONENT MANUFACTURING METHOD, MANUFACTURING FILM, AND...

DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...

Selective photo-induced transfer of good micro leds

DBI TO SI BONDING FOR SIMPLIFIED HANDLE WAFER

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Method and member for handling an electronic device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH INTEGRATED CHIPS

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD...

MICRO-DEVICE SUBSTRATE STRUCTURES WITH POSTS AND INDENTATIONS

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

COMPOSITION

INTEGRATED CIRCUIT PACKAGES

LTHC AS CHARGING BARRIER IN INFO PACKAGE FORMATION

LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING P...

LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING P...

COMPOUND MICRO-ASSEMBLY STRATEGIES AND DEVICES

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF