Details of lead tips

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CPC
H05K2201/10795

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/10795Details of lead tips

Industries

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Patents Grantslast 30 patents

Information Patent Grant
FPCB assembly for battery module, its manufacturing method, and bat...
- Patent number 12,074,392
- Issue date Aug 27, 2024
- LG ENERGY SOLUTION, LTD.
- Sang-Eun Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,696,396
- Issue date Jul 4, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,674,977
- Issue date Jun 13, 2023
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- G01 - MEASURING TESTING
Information Patent Grant
Methods of making printed structures
- Patent number 11,540,398
- Issue date Dec 27, 2022
- X Display Company Technology Limited
- Christopher Andrew Bower
- B32 - LAYERED PRODUCTS
Information Patent Grant
Short interconnect assembly with strip elastomer
- Patent number 11,266,015
- Issue date Mar 1, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong Foong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for providing a high speed interconnect system...
- Patent number 10,925,151
- Issue date Feb 16, 2021
- Eagle Technology, LLC
- Michael T. DeRoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for providing a high speed interconnect system...
- Patent number 10,517,167
- Issue date Dec 24, 2019
- Eagle Technology, LLC
- Michael T. DeRoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete device
- Patent number 10,201,087
- Issue date Feb 5, 2019
- Infineon Technologies Austria AG
- Fabio Brucchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for connecting a wire to a feedthrough pin and apparatus in...
- Patent number 10,064,288
- Issue date Aug 28, 2018
- Advanced Bionics AG
- Lin Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Cortical implant system for brain stimulation and recording
- Patent number 9,949,376
- Issue date Apr 17, 2018
- Second Sight Medical Products, Inc.
- Robert J Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Pin connector structure and method
- Patent number 9,775,242
- Issue date Sep 26, 2017
- Intel Corporation
- Tsung-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-in-substrate, semiconductor device and module
- Patent number 9,508,639
- Issue date Nov 29, 2016
- Rohm Co., Ltd.
- Hirotoshi Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin connector structure and method
- Patent number 9,247,642
- Issue date Jan 26, 2016
- Intel Corporation
- Tsung-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar contact with solder
- Patent number 9,155,200
- Issue date Oct 6, 2015
- Interplex Industries, Inc.
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar contact with solder
- Patent number 8,497,429
- Issue date Jul 30, 2013
- Interplex Industries, Inc.
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board having lead pin, and lead pin
- Patent number 8,379,402
- Issue date Feb 19, 2013
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Oshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with the leads projected from sealing body
- Patent number 8,338,927
- Issue date Dec 25, 2012
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a semiconductor integrated circuit device
- Patent number 8,026,130
- Issue date Sep 27, 2011
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and lead frame used to manufacture semiconduct...
- Patent number 7,786,556
- Issue date Aug 31, 2010
- Seiko Instruments Inc.
- Tomoyuki Yoshino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mounting discharge tube has soldering tapers formed at peri...
- Patent number 7,719,174
- Issue date May 18, 2010
- Shinko Electric Industries Co., Ltd.
- Kazuhiko Machida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead(Pb)-free electronic component attachment
- Patent number 7,630,210
- Issue date Dec 8, 2009
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component with high density, low cost attachment
- Patent number 7,484,971
- Issue date Feb 3, 2009
- Amphenol Corporation
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector with contact
- Patent number 7,267,558
- Issue date Sep 11, 2007
- Hon Hai Precision Ind. Co., Ltd.
- Igor Polnyi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield structure for electronic circuit parts
- Patent number 6,593,523
- Issue date Jul 15, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Masaaki Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder tail and electric connector incorporating same
- Patent number 5,654,878
- Issue date Aug 5, 1997
- Molex Incorporated
- Masami Sasao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling components upon printed circuit boards
- Patent number 4,995,156
- Issue date Feb 26, 1991
- Texas Instruments Incorporated
- Giuseppe R. Pinnavaia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive component means for attaching electrical components to con...
- Patent number 4,818,823
- Issue date Apr 4, 1989
- Micro-Circuits, Inc.
- Robert F. Bradley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial connector with circuit board mounting features
- Patent number 4,659,156
- Issue date Apr 21, 1987
- AMP Incorporated
- Douglas M. Johnescu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MODULE
- Publication number 20230100404
- Publication date Mar 30, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MAKING PRINTED STRUCTURES
- Publication number 20230091571
- Publication date Mar 23, 2023
- X Display Company Technology Limited
- Christopher Andrew Bower
- B32 - LAYERED PRODUCTS
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20220390488
- Publication date Dec 8, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF MAKING PRINTED STRUCTURES
- Publication number 20220232707
- Publication date Jul 21, 2022
- X Display Company Technology Limited
- Christopher Andrew Bower
- B32 - LAYERED PRODUCTS
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20220151063
- Publication date May 12, 2022
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER
- Publication number 20210392746
- Publication date Dec 16, 2021
- JF Microtechnology Sdn. Bhd.
- Wei Kuong FOONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FPCB Assembly for Battery Module, Its Manufacturing Method, and Bat...
- Publication number 20210184379
- Publication date Jun 17, 2021
- LG CHEM, LTD.
- Sang-Eun Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MAKING PRINTED STRUCTURES
- Publication number 20200214141
- Publication date Jul 2, 2020
- X-Celeprint Limited
- Christopher Andrew Bower
- B32 - LAYERED PRODUCTS
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING A HIGH SPEED INTERCONNECT SYSTEM...
- Publication number 20200146139
- Publication date May 7, 2020
- Eagle Technology, LLC
- Michael T. DeRoy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISCRETE DEVICE
- Publication number 20180288878
- Publication date Oct 4, 2018
- Infineon Technologies Austria AG
- Fabio Brucchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN CONNECTOR STRUCTURE AND METHOD
- Publication number 20130342986
- Publication date Dec 26, 2013
- Tsung-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Planar Contact with Solder
- Publication number 20130283608
- Publication date Oct 31, 2013
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20110316137
- Publication date Dec 29, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroyuki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder and Lead Free Electronic Circuit and Method of Manufacturing...
- Publication number 20110299288
- Publication date Dec 8, 2011
- Carmen Rapisarda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110044040
- Publication date Feb 24, 2011
- WEN-CHUNG CHIN
- F21 - LIGHTING
Information Patent Application
PLANAR CONTACT WITH SOLDER
- Publication number 20100236815
- Publication date Sep 23, 2010
- Interplex Industries, Inc.
- Jack Seidler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD HAVING LEAD PIN, AND LEAD PIN
- Publication number 20100139970
- Publication date Jun 10, 2010
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Oshima
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20090317948
- Publication date Dec 24, 2009
- Renesas Technology Corp.
- Hiroyuki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LED and the promptly fabricating material structure and the connect...
- Publication number 20090201680
- Publication date Aug 13, 2009
- JOYIN TECHNOLOGY INC.
- Hsien-Ching Chang
- F21 - LIGHTING
Information Patent Application
Semiconductor device, lead frame, and manufacturing method for the...
- Publication number 20090008759
- Publication date Jan 8, 2009
- Tomoyuki Yoshino
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solderability Improvement Method for Leaded Semiconductor Package
- Publication number 20080006937
- Publication date Jan 10, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Akira Matsunami
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic component with high density, low cost attachment
- Publication number 20070207635
- Publication date Sep 6, 2007
- Mark W. Gailus
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Lead(Pb)-free electronic component attachment
- Publication number 20070205497
- Publication date Sep 6, 2007
- Mark W. Gailus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mounting discharge tube
- Publication number 20050285534
- Publication date Dec 29, 2005
- Shinko Electric Industries Co., Ltd.
- Kazuhiko Machida
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Shield structure for electronic circuit parts
- Publication number 20020096344
- Publication date Jul 25, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Masaaki Okada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Details of lead tips

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

FPCB assembly for battery module, its manufacturing method, and bat...

Short interconnect assembly with strip elastomer

Short interconnect assembly with strip elastomer

Methods of making printed structures

Short interconnect assembly with strip elastomer

Systems and methods for providing a high speed interconnect system...

Systems and methods for providing a high speed interconnect system...

Discrete device

Methods for connecting a wire to a feedthrough pin and apparatus in...

Cortical implant system for brain stimulation and recording

Pin connector structure and method

Package-in-substrate, semiconductor device and module

Pin connector structure and method

Planar contact with solder

Planar contact with solder

Wiring board having lead pin, and lead pin

Semiconductor device with the leads projected from sealing body

Method for manufacturing a semiconductor integrated circuit device

Semiconductor device and lead frame used to manufacture semiconduct...

Surface mounting discharge tube has soldering tapers formed at peri...

Lead(Pb)-free electronic component attachment

Electronic component with high density, low cost attachment

Electrical connector with contact

Shield structure for electronic circuit parts

Solder tail and electric connector incorporating same

Method for assembling components upon printed circuit boards

Adhesive component means for attaching electrical components to con...

Coaxial connector with circuit board mounting features

Patents Applicationslast 30 patents

MODULE

METHODS OF MAKING PRINTED STRUCTURES

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

METHODS OF MAKING PRINTED STRUCTURES

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

SHORT INTERCONNECT ASSEMBLY WITH STRIP ELASTOMER

FPCB Assembly for Battery Module, Its Manufacturing Method, and Bat...

METHODS OF MAKING PRINTED STRUCTURES

SYSTEMS AND METHODS FOR PROVIDING A HIGH SPEED INTERCONNECT SYSTEM...

DISCRETE DEVICE

PIN CONNECTOR STRUCTURE AND METHOD

Planar Contact with Solder

METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Solder and Lead Free Electronic Circuit and Method of Manufacturing...

LIGHTING DEVICE AND MANUFACTURING METHOD THEREOF

PLANAR CONTACT WITH SOLDER

WIRING BOARD HAVING LEAD PIN, AND LEAD PIN

METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

LED and the promptly fabricating material structure and the connect...

Semiconductor device, lead frame, and manufacturing method for the...

Solderability Improvement Method for Leaded Semiconductor Package

Electronic component with high density, low cost attachment

Lead(Pb)-free electronic component attachment

Surface mounting discharge tube

Shield structure for electronic circuit parts