The present disclosure relates to a module.
A method of forming an electromagnetic shield is disclosed in Japanese Patent Laid-Open No. 2003-318592 (PTL 1). PTL 1 discloses a bag-shaped shield pack. This shield pack has a two-layer structure of: an insulating layer made of a thermosetting resin material; and a metal layer formed on the insulating layer. A printed circuit board on which electronic components are mounted is inserted into the shield pack, which is then vacuumed by suction to thereby bring the shield pack into close contact with the printed circuit board. At this time, the shield pack is broken and pierced through by a tip end of a ground connection terminal provided on the printed circuit board, and then, the ground connection terminal comes into contact with the metal layer to thereby form an electromagnetic shield.
PTL 1: Japanese Patent Laid-Open No. 2003-318592
According to the method of forming an electromagnetic shield disclosed in PTL 1, the fractured surface of the metal layer comes into contact with a bottom portion of the ground connection terminal to thereby establish electrical connection, and thus, the connection state becomes unstable, so that the shielding performance also becomes unstable.
Thus, it is a possible benefit of the present disclosure to provide a module capable of achieving stable shielding performance.
In order to achieve the above-mentioned possible benefit, a module according to the present disclosure includes: a substrate having a first surface; a first component mounted on the first surface; a first protruding electrode disposed on the first surface; a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode; and a first shield film formed to overlap with the first resin film. The first protruding electrode includes a first sharpened portion. In at least a part of the first sharpened portion, the first protruding electrode is exposed from the first resin film.
The first shield film is electrically connected to the first protruding electrode by covering a portion where the first protruding electrode is exposed from the first resin film.
According to the present disclosure, the first shield film covers a portion where the first sharpened portion is exposed from the first resin film, to thereby establish electrical connection between the first shield film and the first protruding electrode, so that stable shielding performance can be achieved.
The dimensional ratios shown in figures do not necessarily represent actual dimensions faithfully, and may be exaggerated for convenience of explanation. In the description below, when reference is made to the concepts “upward” or “downward” do not necessarily mean the absolute “upward” or “downward” direction, but may mean a relative “upward” or “downward” direction in a posture shown in each figure.
The following describes a module according to the first embodiment of the present disclosure with reference to
Module 101 includes: a substrate 1 having a first surface 1a; a first component 3a mounted on first surface 1a; a first protruding electrode 4a disposed on first surface 1a; a first resin film 5a covering first component 3a along the shape of first component 3a, covering at least a part of first surface 1a, and partially covering first protruding electrode 4a; and a first shield film 8a formed to overlap with first resin film 5a. Substrate 1 has a second surface 1b facing opposite to first surface 1a.
First protruding electrode 4a is grounded by a wiring line (not shown). The wiring line for grounding is disposed on the surface of substrate 1 or disposed inside substrate 1.
An inner-layer ground electrode 7 is disposed inside substrate 1. In addition to first component 3a, components 3c and 3d and a connector 13 are mounted on first surface 1a of substrate 1. Similarly to first component 3a, components 3c and 3d are covered with first resin film 5a and first shield film 8a, but connector 13 is not covered with first resin film 5a and first shield film 8a.
As shown in
An antenna 12 is disposed on second surface 1b of substrate 1. One of side surfaces of substrate 1 is covered with first shield film 8a. Through this side surface, inner-layer ground electrode 7 and first shield film 8a are electrically connected to each other. The shape, the number, and the arrangement of components 3c, 3d and the like are shown merely by way of example and are not limited to the above example. In the present embodiment, for convenience of description, a component denoted by a symbol “3a” in
In the present embodiment, as shown in
As shown in the present embodiment, first protruding electrode 4a preferably has flat portion 23. First protruding electrode 4a configured to have flat portion 23 allows easy vacuum absorption of first protruding electrode 4a with the help of flat portion 23, so that first protruding electrode 4a can be easily handled. In the case where first protruding electrode 4a is fabricated in advance as a metal member and then mounted on first surface 1a of substrate 1, it is conceivable to carry first protruding electrode 4a to a desired position on the surface of substrate 1 while first protruding electrode 4a is held by a vacuum chuck.
As shown in the present embodiment, it is preferable that flat portion 23 is also exposed from first resin film 5a and first shield film 8a is electrically connected to first protruding electrode 4a in flat portion 23. Employing such a configuration can achieve more stable shielding performance.
As shown in the present embodiment, first sharpened portion 21a preferably has a blade shape. First sharpened portion 21a illustrated in
As shown in the present embodiment, a component mounted on first surface 1a and not covered with first resin film 5a and first shield film 8a, i.e., an exposed component, may be provided. By employing such a configuration, a component to be used while being directly exposed to the outside can be used in this module. For obtaining a configuration having an exposed component in this way, for example, a mask may be in advance placed to cover a region where first resin film 5a and first shield film 8a should not be formed, in which state first resin film 5a and first shield film 8a may be formed, from which the mask may be removed, on which an exposed component may then be mounted.
Further, the exposed component may be a connector or a sensor. The present embodiment shows an example in which the exposed component is connector 13 (see
As shown in the present embodiment, antenna 12 may be disposed on at least one of first surface 1a and second surface 1b. Employing such a configuration allows wireless communication with the outside using antenna 12. In the example shown in
In the examples shown in
The structure around first protruding electrode 4a in module 101 (see
As to protruding electrodes such as first protruding electrode 4a, a protruding electrode fabricated in advance as a metal member having a desired shape as described above may be introduced and mounted, but may be formed by plating on first surface 1a of substrate 1. These protruding electrodes may be formed by a single plating process or may be formed by repeating a plurality of plating processes. Further, first protruding electrode 4a to be provided in advance as a metal member having a desired shape may be provided as a combination of a plurality of metal materials. First protruding electrode 4a is not necessarily entirely formed of metal, but may be a composite member formed of a combination of a resin member and a metal member.
First protruding electrode 4a formed of a combination of a resin member and a metal member may be prepared in advance as a member having a desired shape, and then, may be introduced and mounted on substrate 1.
The following describes a module according to the second embodiment of the present disclosure with reference to
Protruding electrode 41 includes two sharpened portions 211 and one flat portion 23. Sharpened portion 211 has a blade shape. Flat portion 23 is disposed to be sandwiched between two sharpened portions 211. The number and the length of sharpened portion 211 are not limited to the above example. The number of sharpened portions 211 may be one or may be three or more. In the example shown in
Also in the present embodiment, the effect as described in the first embodiment can be achieved. First resin film 5a and first shield film 8a adhere to protruding electrode 41 as shown in
On the other hand, as a modification of the present embodiment, a protruding electrode 42 shown in
In the present example, a portion where first shield film 8a contacts protruding electrode 41 is as shown in
The following describes a module according to the third embodiment of the present disclosure with reference to
Protruding electrode 43 shown in this case includes a base portion 24 and a sharpened portion 213. Protruding electrode 43 does not have flat portion 23. Such a configuration may also be adopted.
Also in the present embodiment, the effect as described in the first embodiment can be achieved.
Further, if the protruding electrode is not fabricated in advance as an independent metal member before mounting, but if the protruding electrode is formed on first surface 1a of substrate 1 by a method such as plating, a lack of flat portion 23 causes no problem.
The following describes a module according to the fourth embodiment of the present disclosure with reference to
Protruding electrode 44 shown in this case includes a base portion 24 and a sharpened portion 214. Sharpened portion 214 of protruding electrode 44 has a conical shape rather than a blade shape. In protruding electrode 44, a plurality of sharpened portions 214 are connected side by side in a line. The shape of each sharpened portion 214 included in protruding electrode 44 may be a conical shape or a pyramid shape.
Also in the present embodiment, the effect as described in the first embodiment can be achieved. Protruding electrode 44 has a conical shape. Thus, one point of the tip end of this protruding electrode 44 is pierced through first resin film 5a to provide a hole in first resin film 5a, and a portion around this hole is expanded by tensile stress toward the periphery, so that protruding electrode 44 is exposed. Through this exposed portion, protruding electrode 44 and first shield film 8a can be electrically connected to each other. Although protruding electrode 44 configured to have a plurality of conical sharpened portions 214 continuously arranged is exemplified in this case, a protruding electrode provided with a single conical sharpened portion 214 may also be used.
The following describes a module according to the fifth embodiment of the present disclosure with reference to
Protruding electrode 45 shown in this case includes a base portion 24 and a sharpened portion 215. Sharpened portion 215 of protruding electrode 45 has a flat plate shape. Protruding electrode 45 has a shape like a saw blade. Protruding electrode 45 has a structure in which a plurality of sharpened portions 215 are continuously arranged. In the example shown in
The effect as described in the first embodiment can be achieved also in the present embodiment.
The following describes a module according to the sixth embodiment of the present disclosure with reference to
Module 102 has the configuration as described in the first embodiment and additionally has the following configuration.
Module 102 has a double-sided mounting structure. In other words, in module 102, substrate 1 has second surface 1b facing opposite to first surface 1a, and module 102 includes second component 3b mounted on second surface 1b. More specifically, in module 102, substrate 1 has second surface 1b facing opposite to first surface 1a, and an antenna 12 is disposed on at least one of first surface 1a and second surface 1b.
Module 102 includes: a second protruding electrode 4b disposed on second surface 1b; a second resin film 5b covering second component 3b along the shape of second component 3b, covering at least a part of second surface 1b, and partially covering second protruding electrode 4b; and a second shield film 8b formed to overlap with second resin film 5b.
A partial region of second surface 1b of substrate 1 is not covered with second resin film 5b and second shield film 8b. Antenna 12 is disposed in the region where second surface 1b is exposed in this way.
As to the detailed shape of second protruding electrode 4b and conceivable modifications thereof, the concept as described above about the first protruding electrode in the previous embodiments can be applicable.
Since a double-sided mounting structure is adopted in the present embodiment, a large number of components can be mounted on substrate 1 having a limited area, so that a highly functional module can be achieved. The present embodiment illustrates an example in which protruding electrodes are disposed on both first surface 1a and second surface 1b, but the protruding electrode may be disposed on only one of the surfaces.
Among the above-described embodiments, a plurality of embodiments may be employed in an appropriate combination.
The above-described embodiments disclosed herein are illustrative in all respects and should not be construed as being restrictive. The scope of the present disclosure is defined by the terms of the claims, and is intended to include any modifications within the meaning and scope equivalent to the terms of the claims.
1 substrate, 1a first surface, 1b second surface, 3a first component, 3b second component, 3c, 3d, 3e component, 4a first protruding electrode, 4b second protruding electrode, 5a first resin film, 5b second resin film, 7 inner-layer ground electrode, 8a first shield film, 8b second shield film, 12 antenna, 13 connector, 18 pad electrode, 21a first sharpened portion, 21b second sharpened portion, 23 flat portion, 24 base portion, 25 first inclined surface, 26 second inclined surface, 31 first inclined surface, 32 second inclined surface, 41, 42, 43, 44, 45 protruding electrode, 91 arrow, 101, 102 module, 211, 212, 213, 214, 215 sharpened portion.
Number | Date | Country | Kind |
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2020-101570 | Jun 2020 | JP | national |
This is a continuation of International Application No. PCT/JP2021/020864 filed on Jun. 1, 2021 which claims priority from Japanese Patent Application No. 2020-101570 filed on Jun. 11, 2020. The contents of these applications are incorporated herein by reference in their entireties.
Number | Date | Country | |
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Parent | PCT/JP2021/020864 | Jun 2021 | US |
Child | 18062048 | US |