The present invention relates to an easy-to-assembly Light Emitting Diode (LED) and a substrate for installing said LED.
To assemble a conventional LED is usually by wiring on the back of the substrate or welding, assemble method usually can be categorized in:
Although described methods have their drawbacks, it won't cause any difficulty for conventional use which required only few LEDs for indication or arranging a specific figure. However, LED becoming the illumination device of next generation is foreseeable, application of LED in consuming or custom product is increasing, LED of different types or colors are usually applied into the same product, mentioned methods will limit the development and popularization of the LED. Complex wiring and special skill required, high cost and misconnection problems plus defect of future maintenance or replacement, therefore a easier or instant assembly LED with convenient assembled structure which can simplify the installation becomes the main objective of the present invention.
The present invention relates to a solderless LED and assembling substrate providing instant assembly, fast replacement and interchangeable LED arrangement. Said LED and substrate provide faster LED installation, easy maintenance and replacement, allowing any person with skill or not can arrange the LEDs into the figures, letters or symbols as desired.
An easy-to-assembly LED and substrate, specified in faster LED installation, easy maintenance and replacement comprise:
an assembling substrate (1) having sandwich structure consisting essentially of a plurality of conducting layer (10) and a plurality of non-conductive layer (11);
a plurality of LED (3) having at least one lead is partially insulated, all conductive and insulated sections of said LEDs (3) will match the arrangement of the conductive layers (10) and non-conductive layers (11) of said assembling substrate (1); and
a power source (4).
Said assembling substrate (1) is for disposing the LED (3), the conductive layers (10) are for connecting the conductive point of LED (3) with the power source (4); said assembling substrate (1) is in a sandwich structure having a plurality of conductive layers (10) and a plurality of non-conductive layers (11), said conductive layers (10) can be made of metal net, aluminum foil or conductive fabric, said non-conductive layers (11) can be made of insulating foam, rubber foam or rubber. The assembling substrate (1) can be made into any shape or as specific shape to match a product it can also be made with the primary material of the product to couple with said product directly.
Said LED (3) can be a first type LED (31), having at least one lead not insulated or a second type LED (32). The insulated process of said first type LED (31) can be made by applying an insulated treatment on the surface of the lead and encapsulation molding or a single-pin adapter for a second type LED (32).
Said first type LED (31) as described above is characterized in that each lead has different length and all leads are partially insulated except the first conductive layer lead (311). Said second type LED (32) is characterized in that both single-pin conductive section (321) and single-pin insulated section (322) will match the sandwich-like arrangement of conductive layers (10) and non-conductive layers (11) of the assembling substrate (1). The epoxy encapsulation of said LED (3) can be the shape of a typical cylindrical encapsulation or a special shape such as letter, figure or number.
Said power source (4) as mentioned above can connect electrically with a power connector (2), the conductive and insulated area of said power connector (2) will match the conductive layer (10) and non-conductive layer (11) of the assembling substrate (1); Said conductive layer (10) can be maintain as a single section or divided into plurality of independent sections where each sections can connect with equal or different standards of power source (4). The power connector (2) can connect electrically said power source (4) with said assembling substrate (1), it can also electrically connect one assembling substrate (1) with another.
Said first type LED (31) can be selected from a dual-leads LED (31A) having a first conductive layer lead (311) not insulated and another lead partially insulated or a multi-leads LED (31B) having all leads partially insulated except the first conductive layer lead (311).
Said second type LED (32) can be selected from a single-pin/dual-poles LED (32A), having its single-pin conductive section (321) and single-pin insulated section (322) in sandwich-like arrangement to match the arrangement of conductive layer (10) and non-conductive layer (11) of the assemble substrate (1) or a single-pin/multi-poles LED (32B), having its single-pin conductive section (321) and single-pin insulated section (322) in sandwich-like arrangement to match the arrangement of conductive layer (10) and non-conductive layer (11) of the assembling substrate (1).
An alternative single-pin LED (32C) and alternative single-pin/multi-poles LED are two types of second type LED (32) by using single-pin adapter. The alternative single-pin LED (32C) is formed by connecting a conventional lead LED (33) with a single-pin/dual-poles adapter (34), the single-pin conductive section (321) and single-pin insulated section (322) of said single-pin/dual-poles adapter (34) are arranged in sandwich-like structure and match the arrangement of conductive layer (10) and non-conductive layer (11) of the assemble substrate (1); an alternative single-pin/multi-poles LED consists essentially of a multi-leads LED (31B) with a single-pin/multi-poles adapter, the single-pin conductive section and single-pin insulated section of said single-pin/multi-poles adapter are arranged in sandwich-like structure and match the arrangement of conductive layer (10) and non-conductive layer (11) of the assembling substrate (1).
Moreover, a single-pin SMD LED (32D) is another type of the second type LED (32). A single-pin SMD LED (32D) consists essentially of a single-pin SMD adapter (36), a light shield (37) disposed on top of said single-pin SMD adapter (36) and a SMD LED (35) disposed between said single-pin SMD adapter (36) and light shield (37); the conductive and insulated portion of said single-pin SMD adapter (36) have a sandwich-like structure and match the arrangement of conductive layer (10) and non-conductive layer (11) of the assembling substrate (1).
The conductive point (313) and insulated lead (312) of the LED (3) will match the conductive layer (10) and non-conductive layer (11) of the assembling substrate (1), when a LED (3) is inserted vertically and completely into said assembling substrate (1), the LED (3) will be provided with electricity without wiring or welding. If each conductive layer (10) is provided with sufficient and adequate power, the LED (3) can be lighting and controlled, the connection of the power source (4) is provided by the power connector (2) which possesses similar leads structure as said LED (3).
Furthermore, the assembling substrate (1) provides fast assembly of LED (3), the plurality of conductive layer (10) are for connecting non-insulated lead with power source (4), each conductive layer (10) can be divided into plurality of independent sections for splitting the current and controlling purpose.
Said assembling substrate (1) can be manufactured as any geometry figures, letters, symbols and shapes or a specific shape to match a product, it can also be as primary material of the product. The power which connects with each conductive layer (10) or each independent section can have the same or different voltages; the power also can be synchronous or asynchronous. Therefore LED (3) with different standard, color and encapsulation shape can be applied on the same assembling substrate (1).
The LED (3) having at least one lead partially insulated can prevent the short circuit causing by connecting electrically with inappropriate conductive layer (10), when the LED (3) is inserted into the assembling substrate (1). The type of LED (3) can be selected from a first type LED (31) or a second type LED (32) or other similar types of LED (3). The encapsulation of said LED (3) can be made into a typical cylindrical encapsulation or a special shape such as letter, figure or number.
Comparing with the prior art, the present invention possesses following advantages:
As shown in
An assembling substrate (1) having sandwich structure consists essentially of a plurality of conductive layers (10) and a plurality of non-conductive layers (11), connected with a power source (4) through a power connector (2). Therefore, when an east-to-assembly LED is plugged into said assembling substrate (1) it can illuminate instantly.
Said non-conductive layer (11) of the substrate (1) can be made of penetrable insulated material (e.g. insulated foam, rubber foam or rubber etc.), it can also be made of impenetrable insulated material (e.g. plastic or PMMA etc.) with pre-perforated position holes or be made of any material which can provide insulation when the lead of LED (3) passing through.
Said conductive layer (10) can be made of penetrable conductive material (e.g. metal net, aluminum foil or conductive fabric etc.), it can also be made of impenetrable conductive material (e.g. copper or aluminum plate etc.) with pre-perforated position holes. Said conductive layer (10) can be divided into plurality of independent sections. As shown in
A plurality of LED (3) having at least one lead partially insulated, said partially insulated lead will prevent any short circuit when a LED (3) is plugged into the substrate (1) and connected with inappropriate conductive layer (10).
The LED (3) having at least one lead partially insulated can be a first type LED (31) with insulation process on partial of majority of leads, a second type LED (32) or other type of LED (3) having similar character. Said insulation process can be made by applying an insulating treatment on exterior of the lead for the first type LED (31), encapsulation molding or plugged the LED (3) into an adapter for the second type LED (32) (
As shown in
As shown in
A power source (4) which can electrically connected to a power connector (2) for conducting electricity to the assembling substrate (1); a first connecting area (21) of said power connector (2) has the same lead structure as the LED (3), which it can have one or more partially-insulated lead and a conductive lead as the first type LED (31) or multiple conductive and insulated sections as the second type LED (32). Both lead structures will match the arrangement of conductive layer (10) and non-conductive layer (11) of the assembling substrate (1). Said partially insulated lead and non-insulated lead of the power connector (2) provide fast connection of conductive layer (10) with the power source (4) or an assembling substrate (1) with another. A second connecting area is for connecting the power source (4) and a control device (1), the type of connection is not limited in the embodiment.
As shown in
As shown in
The first type LED (31) of the embodiment can also function with the assembling substrate (1) having more than three conductive layers (10). As shown in
Furthermore, the power source (4) can also connect with a control device (41) to provide each conductive layer (10) with synchronous or asynchronous power supply, permitting LED (3) having more illuminating effect.
Said assembling substrate (1) having more than 3 conductive layers (10) can also be connected with same standard of power source (4) for connection of LEDs (3) with same standard.
As shown in
In
In
An alternative single-pin/multi-poles LED (not shown) can also be applied according the above description, by jointing a multi-leads LED (31B) with a single-pin/multi-poles adapter (not shown), the single-pin conductive section and single-pin insulated section of said single-pin/multi-poles adapter are arranged in sandwich-like structure and match the arrangement of conductive layer (10) and non-conductive layer (11) of the assemble substrate (1)
It is preferable to have the first conductive layer (101) as ground or cathode and conductive layer (10) close to the LED (3) is provided with power supply having low voltage to increase the safety of unplugging a LED (3) when conductive layer (10) possesses electricity.
The power connector can also be utilized to connect between one assembling substrate (1) with another.
Embodiment of the present invention as disclosed above provides an easy-to-assembly method to install/uninstall LED on a substrate with no wiring or welding procedure required, coupled with design of assembling substrate (1) having sandwich-like structure of conductive layers (10) and non-conductive layer (11), it allows LEDs of same or different standards can be disposed and lighted on the same substrate. Its abilities of fast-assembly, simple maintenance may increase the economic value and popularization of the LED with lower cost.
What are disclosed above are only the preferred embodiments of the present invention and it is therefore not intended that the present invention be limited to particular embodiments disclosed. It will be understood by those skilled in the art that various equivalent changes may be made depending on specification and drawings of present invention without departing from the scope of the present invention.
Number | Date | Country | Kind |
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097202665 | Feb 2008 | TW | national |