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H05K2203/02

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/02Details related to mechanical or acoustic processing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Device for temperature measurement
- Patent number 12,171,060
- Issue date Dec 17, 2024
- SMA Solar Technology AG
- Felix Muehlhausen
- G01 - MEASURING TESTING
Information Patent Grant
Wiring circuit board, producing method thereof, and wiring circuit...
- Patent number 12,167,544
- Issue date Dec 10, 2024
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED circuit board structure and LED testing and packaging method
- Patent number 12,150,242
- Issue date Nov 19, 2024
- Ingentec Corporation
- Yi-Chuan Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,144,108
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Naoko Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing textile with conductive yarns and integrate...
- Patent number 12,120,823
- Issue date Oct 15, 2024
- Myant Inc.
- Tony Chahine
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Grant
Method for manufacturing printed wiring board and resin sheet with...
- Patent number 12,120,827
- Issue date Oct 15, 2024
- Ajinomoto Co., Inc.
- Kazuhiko Tsurui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic welding systems, methods of using the same, and related...
- Patent number 12,070,814
- Issue date Aug 27, 2024
- Kulicke and Soffa Industries, Inc.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device and manufacturing method of display device
- Patent number 12,069,910
- Issue date Aug 20, 2024
- Samsung Display Co., Ltd.
- Joo-nyung Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component on flexible substrate
- Patent number 12,069,808
- Issue date Aug 20, 2024
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria De Kok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,036,776
- Issue date Jul 16, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,016,130
- Issue date Jun 18, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Laser cutting system
- Patent number 11,999,014
- Issue date Jun 4, 2024
- Medtronic, Inc.
- Xiangnan He
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,997,901
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution plate
- Patent number 11,997,789
- Issue date May 28, 2024
- Dominik Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressing method of a flexible printed circuit board and a substrate
- Patent number 11,991,834
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jae Uk Cho
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Machining station and method for machining workpieces
- Patent number 11,963,305
- Issue date Apr 16, 2024
- Skybrain Vermögensverwaltungs GmbH
- Markus Winterschladen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display device comprising same
- Patent number 11,917,760
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lead frame, packaged integrated circuit board, power chip, and circ...
- Patent number 11,887,918
- Issue date Jan 30, 2024
- Huawei Technologies Co., Ltd.
- Xuanwei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 11,871,523
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Ryohei Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling components implementing a pre-treatment of th...
- Patent number 11,855,038
- Issue date Dec 26, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Castany
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic welding systems, methods of using the same, and related...
- Patent number 11,850,676
- Issue date Dec 26, 2023
- Kulicke and Soffa Industries, Inc.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method for printed wiring board
- Patent number 11,849,546
- Issue date Dec 19, 2023
- Kyocera Corporation
- Atsuo Kawagoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Milling of flex foil with two conductive layers from both sides
- Patent number 11,849,544
- Issue date Dec 19, 2023
- Gentherm GmbH
- Jan Horzella
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 11,842,893
- Issue date Dec 12, 2023
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD OF MAKING MODULAR INTERCONNECTIONS FOR ELECTRO...
- Publication number 20240431036
- Publication date Dec 26, 2024
- University of South Florida
- Mohamed Mounir ABDIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...
- Publication number 20240422917
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240407077
- Publication date Dec 5, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe Waltrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electric Heating Device
- Publication number 20240407132
- Publication date Dec 5, 2024
- Eberspacher catem GmbH & Co. KG
- Michael Niederer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED...
- Publication number 20240359255
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...
- Publication number 20240352287
- Publication date Oct 24, 2024
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240306306
- Publication date Sep 12, 2024
- Canon Kabushiki Kaisha
- JUN TSUKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240298411
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PRESS APPARATUS AND PRESSING METHOD THEREOF
- Publication number 20240268035
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jae Uk CHO
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad...
- Publication number 20240244755
- Publication date Jul 18, 2024
- Qiang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240237195
- Publication date Jul 11, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240237200
- Publication date Jul 11, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240215155
- Publication date Jun 27, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE...
- Publication number 20240206075
- Publication date Jun 20, 2024
- DP Patterning AB
- Staffan Nordlinder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD GROUNDING
- Publication number 20240196516
- Publication date Jun 13, 2024
- AES Global Holdings PTE Ltd.
- Yihong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...
- Publication number 20240188228
- Publication date Jun 6, 2024
- IBIDEN CO., LTD.
- Yuji KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240172373
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Byung Woo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...
- Publication number 20240164012
- Publication date May 16, 2024
- Nikon Corporation
- Shohei KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible printed circuit, ink and method for obtaining flexible pri...
- Publication number 20240147618
- Publication date May 2, 2024
- UNIVERSIDADE DE COIMBRA
- Mahmoud TAVAKOLI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
- Publication number 20240147631
- Publication date May 2, 2024
- Liquid Wire, LLC
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...
- Publication number 20240130045
- Publication date Apr 18, 2024
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- G02 - OPTICS
Information Patent Application
BENDING APPARATUS AND BENDING METHOD USING THE SAME
- Publication number 20240130049
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- DONGWOO KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD
- Publication number 20240121932
- Publication date Apr 11, 2024
- Cisco Technology, Inc.
- Robert Gregory Twiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD
- Publication number 20240114625
- Publication date Apr 4, 2024
- SHENNAN CIRCUITS CO.,LTD.
- Dantian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240114632
- Publication date Apr 4, 2024
- Unimicron Technology Corp.
- Ming-Hao WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD
- Publication number 20240098902
- Publication date Mar 21, 2024
- ZTE Corporation
- Da CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Details related to mechanical or acoustic processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device for temperature measurement

Wiring circuit board, producing method thereof, and wiring circuit...

LED circuit board structure and LED testing and packaging method

Wiring board and method for manufacturing wiring board

Method for detecting and adjusting poor back drills in printed circ...

Method of manufacturing textile with conductive yarns and integrate...

Method for manufacturing printed wiring board and resin sheet with...

Printed circuit board

Ultrasonic welding systems, methods of using the same, and related...

Display device and manufacturing method of display device

Electronic component on flexible substrate

Resin multilayer substrate and method for manufacturing resin multi...

Method of manufacturing printed circuit board

Laser cutting system

Display apparatus having grooved terminals

Redistribution plate

Pressing method of a flexible printed circuit board and a substrate

Machining station and method for machining workpieces

Method for manufacturing printed wiring board

Display panel and display device comprising same

Lead frame, packaged integrated circuit board, power chip, and circ...

Electronic component module and method for manufacturing electronic...

Sn—Bi and copper powder conductive paste in through hole of insulat...

Method for assembling components implementing a pre-treatment of th...

Ultrasonic welding systems, methods of using the same, and related...

Printed wiring board and manufacturing method for printed wiring board

Milling of flex foil with two conductive layers from both sides

Printed circuit board and package substrate including same

Bonding apparatus and method of fabricating display device using th...

Substrate with buried component and manufacture method thereof

Patents Applicationslast 30 patents

APPARATUS AND METHOD OF MAKING MODULAR INTERCONNECTIONS FOR ELECTRO...

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

ELECTRICAL CIRCUIT FORMING METHOD AND ELECTRICAL CIRCUIT FORMING AP...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Electric Heating Device

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED...

CURABLE ADHESIVE COMPOSITION, FILMY ADHESIVE, METHOD FOR PRODUCING...

Ultra-Thin Sandwich Component

ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

PRESS APPARATUS AND PRESSING METHOD THEREOF

Metal Foil for Circuit Board, Metal Foil with Carrier, Copper-Clad...

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

A METHOD AND DEVICE FOR PRODUCING A PRODUCT COMPRISING A SUBSTRATE...

PRINTED CIRCUIT BOARD GROUNDING

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...

Flexible printed circuit, ink and method for obtaining flexible pri...

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...

LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...

BENDING APPARATUS AND BENDING METHOD USING THE SAME

SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD

CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD