Details related to mechanical or acoustic processing

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CPC
H05K2203/02

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/02Details related to mechanical or acoustic processing

Industries

Patents Grantslast 30 patents

Information Patent Grant
Machining station and method for machining workpieces
- Patent number 11,963,305
- Issue date Apr 16, 2024
- Skybrain Vermögensverwaltungs GmbH
- Markus Winterschladen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 11,930,601
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yuji Kadowaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display device comprising same
- Patent number 11,917,760
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lead frame, packaged integrated circuit board, power chip, and circ...
- Patent number 11,887,918
- Issue date Jan 30, 2024
- Huawei Technologies Co., Ltd.
- Xuanwei Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 11,871,523
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Ryohei Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling components implementing a pre-treatment of th...
- Patent number 11,855,038
- Issue date Dec 26, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Castany
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic welding systems, methods of using the same, and related...
- Patent number 11,850,676
- Issue date Dec 26, 2023
- Kulicke and Soffa Industries, Inc.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method for printed wiring board
- Patent number 11,849,546
- Issue date Dec 19, 2023
- Kyocera Corporation
- Atsuo Kawagoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Milling of flex foil with two conductive layers from both sides
- Patent number 11,849,544
- Issue date Dec 19, 2023
- Gentherm GmbH
- Jan Horzella
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 11,842,893
- Issue date Dec 12, 2023
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal sublayer sensing in multi-layer workpiece hole drilling
- Patent number 11,792,940
- Issue date Oct 17, 2023
- DRILLIANT LTD
- Guy Soffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
UV fixing glue for assembly
- Patent number 11,778,753
- Issue date Oct 3, 2023
- Heraeus Deutschland GmbH & Co. KG
- Ilias Nikolaidis
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Wiring substrate device
- Patent number 11,749,590
- Issue date Sep 5, 2023
- Shinko Electric Industries Co., Ltd.
- Tatsuya Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual conductor laminated substrate
- Patent number 11,744,023
- Issue date Aug 29, 2023
- Gentherm GmbH
- Timothy Hughes
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Resistive PCB traces for improved stability
- Patent number 11,723,149
- Issue date Aug 8, 2023
- Kioxia Corporation
- Stephen Pardoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of creating exposed cavities in molded electronic devices
- Patent number 11,723,151
- Issue date Aug 8, 2023
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Unit unloading system
- Patent number 11,706,875
- Issue date Jul 18, 2023
- Rokko Systems Pte Ltd.
- Yun Suk Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED lighting systems and methods
- Patent number 11,690,172
- Issue date Jun 27, 2023
- Metrospec Technology, LLC
- Henry V. Holec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing composite circuit board
- Patent number 11,672,083
- Issue date Jun 6, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronics assemblies for downhole use
- Patent number 11,619,128
- Issue date Apr 4, 2023
- Baker Hughes Holdings LLC
- Silke Bramlage
- E21 - EARTH DRILLING MINING
Information Patent Grant
Ultrasonic tank and methods for uniform glass substrate etching
- Patent number 11,610,783
- Issue date Mar 21, 2023
- Corning Incorporated
- John Tyler Keech
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Light-emitting module
- Patent number 11,611,014
- Issue date Mar 21, 2023
- Nichia Corporation
- Eiko Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,605,697
- Issue date Mar 14, 2023
- Samsung Display Co., Ltd.
- Byoungyong Kim
- G02 - OPTICS
Information Patent Grant
Component embedded in component carrier and having an exposed side...
- Patent number 11,570,897
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Bettina Schuster
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...
- Publication number 20240164012
- Publication date May 16, 2024
- Nikon Corporation
- Shohei KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible printed circuit, ink and method for obtaining flexible pri...
- Publication number 20240147618
- Publication date May 2, 2024
- UNIVERSIDADE DE COIMBRA
- Mahmoud TAVAKOLI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...
- Publication number 20240147631
- Publication date May 2, 2024
- Liquid Wire, LLC
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...
- Publication number 20240130045
- Publication date Apr 18, 2024
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- G02 - OPTICS
Information Patent Application
BENDING APPARATUS AND BENDING METHOD USING THE SAME
- Publication number 20240130049
- Publication date Apr 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- DONGWOO KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD
- Publication number 20240121932
- Publication date Apr 11, 2024
- Cisco Technology, Inc.
- Robert Gregory Twiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD
- Publication number 20240114625
- Publication date Apr 4, 2024
- SHENNAN CIRCUITS CO.,LTD.
- Dantian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240114632
- Publication date Apr 4, 2024
- Unimicron Technology Corp.
- Ming-Hao WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD
- Publication number 20240098902
- Publication date Mar 21, 2024
- ZTE Corporation
- Da CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER VIA RESONANCE SUPPRESSION
- Publication number 20240098898
- Publication date Mar 21, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Melvin Kent Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD TO ELIMINATE VIA STRIPING
- Publication number 20240080978
- Publication date Mar 7, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...
- Publication number 20240080990
- Publication date Mar 7, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240040699
- Publication date Feb 1, 2024
- Murata Manufacturing Co., Ltd.
- Hiromitsu ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES
- Publication number 20240040703
- Publication date Feb 1, 2024
- Flex Ltd.
- Dongkai Shangguan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240040708
- Publication date Feb 1, 2024
- FUJIKURA PRINTED CIRCUITS LTD.
- Daisuke Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing a Sheet with Double-Sided Structured Condu...
- Publication number 20240032207
- Publication date Jan 25, 2024
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Antonio ALTANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE
- Publication number 20240015891
- Publication date Jan 11, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...
- Publication number 20240008170
- Publication date Jan 4, 2024
- INGENTEC CORPORATION
- Yi-Chuan HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
- Publication number 20230397333
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230389179
- Publication date Nov 30, 2023
- Nitto Denko Corporation
- Kazutoshi KINOSHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TAPE AND MANUFACTURING METHOD THEREOF
- Publication number 20230380072
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Yi-Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...
- Publication number 20230328900
- Publication date Oct 12, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20230328877
- Publication date Oct 12, 2023
- MURATA MANUFACTURING CO., LTD.
- Yukiya YAMAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnection of printed circuit boards with nanowires
- Publication number 20230319976
- Publication date Oct 5, 2023
- Klaus Haimlinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...
- Publication number 20230309239
- Publication date Sep 28, 2023
- Canon Kabushiki Kaisha
- Minoru Kambegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20230247768
- Publication date Aug 3, 2023
- Canon Kabushiki Kaisha
- JUN TSUKANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230232527
- Publication date Jul 20, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD EDGE ELECTRICAL CONTACT STRUCTURES
- Publication number 20230232533
- Publication date Jul 20, 2023
- Nokia Solutions and Networks Oy
- David NORTH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20230217599
- Publication date Jul 6, 2023
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Details related to mechanical or acoustic processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Machining station and method for machining workpieces

Method for manufacturing printed wiring board

Display panel and display device comprising same

Lead frame, packaged integrated circuit board, power chip, and circ...

Electronic component module and method for manufacturing electronic...

Sn—Bi and copper powder conductive paste in through hole of insulat...

Method for assembling components implementing a pre-treatment of th...

Ultrasonic welding systems, methods of using the same, and related...

Printed wiring board and manufacturing method for printed wiring board

Milling of flex foil with two conductive layers from both sides

Printed circuit board and package substrate including same

Bonding apparatus and method of fabricating display device using th...

Substrate with buried component and manufacture method thereof

Metal sublayer sensing in multi-layer workpiece hole drilling

Process and device for low-temperature pressure sintering

UV fixing glue for assembly

Wiring substrate device

Dual conductor laminated substrate

Resistive PCB traces for improved stability

Methods of creating exposed cavities in molded electronic devices

Unit unloading system

LED lighting systems and methods

Method of manufacturing composite circuit board

Electroless and electrolytic deposition process for forming traces...

Process and device for low-temperature pressure sintering

Electronics assemblies for downhole use

Ultrasonic tank and methods for uniform glass substrate etching

Light-emitting module

Display apparatus having grooved terminals

Component embedded in component carrier and having an exposed side...

Patents Applicationslast 30 patents

METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...

Flexible printed circuit, ink and method for obtaining flexible pri...

DEVICES, SYSTEMS, AND METHODS FOR MAKING AND USING HIGHLY SUSTAINAB...

LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...

BENDING APPARATUS AND BENDING METHOD USING THE SAME

SELF-EQUALIZING FRAME FOR THERMAL MANAGEMENT DEVICE PRELOAD

CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

THERMOFORMING DEVICE AND METHOD FOR FLEXIBLE CIRCUIT BOARD

POWER VIA RESONANCE SUPPRESSION

SYSTEM AND METHOD TO ELIMINATE VIA STRIPING

WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

METHODS OF CREATING EXPOSED CAVITIES IN MOLDED ELECTRONIC DEVICES

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

Method for Manufacturing a Sheet with Double-Sided Structured Condu...

METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE

LED CIRCUIT BOARD STRUCTURE, LED TESTING AND PACKAGING METHOD AND L...

ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

TAPE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...

HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

Interconnection of printed circuit boards with nanowires

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

MULTI-PATTERN SUBSTRATE, FUNCTIONAL MODULE, AND PRODUCTION METHOD F...

ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME

BOARD EDGE ELECTRICAL CONTACT STRUCTURES

ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC...