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H01L2224/3702

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3702Disposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power substrate assembly with reduced warpage
- Patent number 12,308,338
- Issue date May 20, 2025
- Littelfuse, Inc.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and semiconductor arrangement having thermally conduct...
- Patent number 12,068,213
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip stack module and method of fabricating the same
- Patent number 11,984,432
- Issue date May 14, 2024
- Unity Power Technology Limited
- Kuk Fong Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer, semiconductor wafer, c...
- Patent number 11,756,917
- Issue date Sep 12, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,727,163
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Junji Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching element with a series-connected junction FET (JFET) and M...
- Patent number 9,502,388
- Issue date Nov 22, 2016
- Renesas Electronics Corporation
- Takamitsu Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching element with a series-connected junction FET (JFET) and M...
- Patent number 9,263,435
- Issue date Feb 16, 2016
- Renesas Electronics Corporation
- Takamitsu Kanazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric device package and method of making an electric device pac...
- Patent number 8,824,145
- Issue date Sep 2, 2014
- Infineon Technologies AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of mounting a circuit component and joint structure therefor
- Patent number 6,822,331
- Issue date Nov 23, 2004
- Delphi Technologies, Inc.
- Charles T. Eytcheson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low thermal resistance, low stress semiconductor package
- Patent number 4,278,990
- Issue date Jul 14, 1981
- General Electric Company
- Julie Y. Fichot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having strengthening and sealing upper chamber
- Patent number 4,249,034
- Issue date Feb 3, 1981
- General Electric Company
- Julie Y. Fichot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud-type semiconductor device
- Patent number 4,143,395
- Issue date Mar 6, 1979
- Tokyo Shibaura Electric Co., Ltd.
- Toshinobu Sekiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3869703
- Patent number 3,869,703
- Issue date Mar 4, 1975
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS
- Publication number 20250022831
- Publication date Jan 16, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Nam Khong THEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...
- Publication number 20250014972
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...
- Publication number 20240363501
- Publication date Oct 31, 2024
- Shenzhen STS Microelectronics Co., Ltd.
- Qian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...
- Publication number 20240332133
- Publication date Oct 3, 2024
- ams-OSRAM International GmbH
- Michael Zitzlsperger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240332144
- Publication date Oct 3, 2024
- NEXPERIA B.V.
- Hiu Hay Nichole Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE LAYER STACK FLIP-CHIP MOUNTED TO A LEADFRAME BY USE OF A COPP...
- Publication number 20240162125
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUBSTRATE ASSEMBLY WITH REDUCED WARPAGE
- Publication number 20240021568
- Publication date Jan 18, 2024
- LITTELFUSE, INC.
- Tiburcio A. Maldo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240006357
- Publication date Jan 4, 2024
- Rohm Co., Ltd.
- Takayuki OSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
- Publication number 20230411336
- Publication date Dec 21, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20230187404
- Publication date Jun 15, 2023
- WUXI LEAPERS SEMICONDUCTOR CO., LTD.
- Xiaoguang LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG CLIP WITH MOUNT COMPOUND ARRESTER
- Publication number 20230170322
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ernesto Pentecostes Rafael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACK MODULE AND METHOD OF FABRICATING THE SAME
- Publication number 20230163105
- Publication date May 25, 2023
- Unity Power Technology Limited
- Kuk Fong YIP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230111921
- Publication date Apr 13, 2023
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE, SEMICONDUCTOR ARRANGEMENT, METHOD OF FORMING A CHIP P...
- Publication number 20220173006
- Publication date Jun 2, 2022
- Thai Kee Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...
- Publication number 20210305198
- Publication date Sep 30, 2021
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140231829
- Publication date Aug 21, 2014
- Takamitsu KANAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electric Device Package and Method of Making an Electric Device Pac...
- Publication number 20130329365
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMIFINISHED PRODUCT AND METHOD FOR PRODUCING A LIGHT-EMITTING DIODE
- Publication number 20130193475
- Publication date Aug 1, 2013
- Evonik Goldschmidt GmbH
- Volker Arning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rectifier diode of electric generator
- Publication number 20060268590
- Publication date Nov 30, 2006
- Charng-Geng Sheen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of mounting a circuit component and joint structure therefor
- Publication number 20050093115
- Publication date May 5, 2005
- DELPHI TECHNOLOGIES, INC.
- Charles T. Eytcheson
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of mounting a circuit component and joint structure therefor
- Publication number 20020190388
- Publication date Dec 19, 2002
- Charles Tyler Eytcheson
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power substrate assembly with reduced warpage

Chip package and semiconductor arrangement having thermally conduct...

Semiconductor chip stack module and method of fabricating the same

Method for processing a semiconductor wafer, semiconductor wafer, c...

Semiconductor device

Semiconductor device having multiple contact clips

Switching element with a series-connected junction FET (JFET) and M...

Switching element with a series-connected junction FET (JFET) and M...

Electric device package and method of making an electric device pac...

Method of mounting a circuit component and joint structure therefor

Low thermal resistance, low stress semiconductor package

Semiconductor package having strengthening and sealing upper chamber

Stud-type semiconductor device

3869703

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS

PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION...

SEMICONDUCTOR PACKAGE, METHOD OF FORMING SEMICONDUCTOR PACKAGE, AND...

CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD F...

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

DIODE LAYER STACK FLIP-CHIP MOUNTED TO A LEADFRAME BY USE OF A COPP...

POWER SUBSTRATE ASSEMBLY WITH REDUCED WARPAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

GANG CLIP WITH MOUNT COMPOUND ARRESTER

SEMICONDUCTOR CHIP STACK MODULE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

CHIP PACKAGE, SEMICONDUCTOR ARRANGEMENT, METHOD OF FORMING A CHIP P...

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...

SEMICONDUCTOR DEVICE

Electric Device Package and Method of Making an Electric Device Pac...

SEMIFINISHED PRODUCT AND METHOD FOR PRODUCING A LIGHT-EMITTING DIODE

Rectifier diode of electric generator

Method of mounting a circuit component and joint structure therefor

Method of mounting a circuit component and joint structure therefor