3869703

Information

• Patent Grant
• 3869703

• References
• Source

• Patent Number

  3,869,703

• Date Filed

  Not available

• Date Issued

  Tuesday, March 4, 1975
  50 years ago

• CPC

  • H01L24/01 - Means for bonding being attached to, or being formed on, the surface to be connected
  • H01L23/049 - the other leads being perpendicular to the base
  • H01L23/488 - consisting of soldered or bonded constructions
  • H01L24/45 - of an individual wire connector
  • H01L2224/37026 - being mutually engaged together
  • H01L2224/45139 - Silver (Ag) as principal constituent
  • H01L2224/4554 - Coating
  • H01L2224/45644 - Gold (Au) as principal constituent
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01014 - Silicon [Si]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01028 - Nickel [Ni]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01032 - Germanium [Ge]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01042 - Molybdenum [Mo]
  • H01L2924/01047 - Silver [Ag]
  • H01L2924/0105 - Tin [Sn]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01079 - Gold [Au]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/01322 - Eutectic Alloys
  • H01L2924/12043 - Photo diode
  • H01L2924/1301 - Thyristor

• US Classifications

  • 257 - Active solid-state devices