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H01L2224/401

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/401Disposition

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring structure and semiconductor module
- Patent number 12,315,838
- Issue date May 27, 2025
- Fuji Electric Co., Ltd.
- Tadahiko Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor package and smart card having the same
- Patent number 12,294,000
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin semiconductor packaging unit having a plurality of bridging la...
- Patent number 12,288,737
- Issue date Apr 29, 2025
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacture of semiconductor de...
- Patent number 12,237,248
- Issue date Feb 25, 2025
- AOI Electronics Co., Ltd.
- Katsuhiro Takao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with vertical passive components
- Patent number 12,230,615
- Issue date Feb 18, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Jiraphat Charoenratpratoom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,224,231
- Issue date Feb 11, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,191,237
- Issue date Jan 7, 2025
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having mold locking feature
- Patent number 12,142,548
- Issue date Nov 12, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
- Patent number 12,113,002
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Hiroki Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with electrodes and heat sink and manufacturing method...
- Patent number 12,014,974
- Issue date Jun 18, 2024
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plate-shaped conductor
- Patent number 12,002,782
- Issue date Jun 4, 2024
- Kabushiki Kaisha Toshiba
- Shun Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low parasitic connection to passive device
- Patent number 11,973,063
- Issue date Apr 30, 2024
- Infineon Technologies AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,961,790
- Issue date Apr 16, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module with busbar having a leg with a foot for...
- Patent number 11,894,302
- Issue date Feb 6, 2024
- Danfoss Silicon Power GmbH
- Michael Tønnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
- Patent number 11,855,035
- Issue date Dec 26, 2023
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package having a conductiv...
- Patent number 11,848,254
- Issue date Dec 19, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with galvanically isolated semiconductor chips
- Patent number 11,837,531
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,830,856
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,784,155
- Issue date Oct 10, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT
- Publication number 20250183124
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo C Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH CHIP STACK
- Publication number 20250183219
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...
- Publication number 20250174521
- Publication date May 29, 2025
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157892
- Publication date May 15, 2025
- Fuji Electric Co., Ltd.
- Takahiro KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH CONNECTION PAD
- Publication number 20250140745
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JOSE ARVIN PLOMANTES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250140660
- Publication date May 1, 2025
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20250140659
- Publication date May 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Bonded Semiconductor Die Package
- Publication number 20250125231
- Publication date Apr 17, 2025
- Wolfspeed, Inc.
- Devarajan Balaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118699
- Publication date Apr 10, 2025
- Kabushiki Kaisha Toshiba
- Yoshiharu TAKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Manufacturing Semiconductor Pa...
- Publication number 20250112109
- Publication date Apr 3, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Mirko Bernardoni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CIRCUIT ARRANGEMENT FOR AN ELECTRIC MACHINE,...
- Publication number 20250112214
- Publication date Apr 3, 2025
- Audi AG
- Daniel RUPPERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP
- Publication number 20250105199
- Publication date Mar 27, 2025
- NEXPERIA B.V.
- Georgio El-Zammar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER
- Publication number 20250105200
- Publication date Mar 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seokbong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...
- Publication number 20250079386
- Publication date Mar 6, 2025
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250079413
- Publication date Mar 6, 2025
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...
- Publication number 20250079275
- Publication date Mar 6, 2025
- INFINEON TECHNOLOGIES AG
- Wolfgang SCHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SWITCHING POWER DEVICE
- Publication number 20250070101
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND VEHICLE
- Publication number 20250029928
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Tomohiro ISONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY
- Publication number 20250014973
- Publication date Jan 9, 2025
- Wolfspeed, Inc.
- Paul WHEELER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250014981
- Publication date Jan 9, 2025
- Fuji Electric Co., Ltd.
- Kensuke MATSUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20250006622
- Publication date Jan 2, 2025
- Fuji Electric Co., Ltd.
- Tatsuo NISHIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429139
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429138
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429154
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240413060
- Publication date Dec 12, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PADDLE
- Publication number 20240404923
- Publication date Dec 5, 2024
- NEXPERIA B.V.
- Ricardo Yandoc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO REDUCE CHIP SHIFT DURING ASSEMBLY
- Publication number 20240395758
- Publication date Nov 28, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- MC Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Single Integral Body Carrying Two Transistor Chips wit...
- Publication number 20240395676
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Marcus Böhm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT
- Publication number 20240387513
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Isao TAKOBE
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring structure and semiconductor module

Fingerprint sensor package and smart card having the same

Thin semiconductor packaging unit having a plurality of bridging la...

Semiconductor device and method for manufacture of semiconductor de...

Semiconductor packages with vertical passive components

Semiconductor module

Semiconductor module

Semiconductor package having mold locking feature

Package including multiple semiconductor devices

Plurality of transistors attached to a heat sink with a periphery n...

Semiconductor module

Semiconductor device

Semiconductor device

Semiconductor device and electronic device

Power module with electrodes and heat sink and manufacturing method...

Semiconductor device with plate-shaped conductor

Semiconductor device

Semiconductor packages using package in package systems and related...

Semiconductor package with low parasitic connection to passive device

Semiconductor module

Semiconductor module

Semiconductor module

Power semiconductor device with dual heat dissipation structures

Semiconductor package with solder standoff

Semiconductor power module with busbar having a leg with a foot for...

Stack of electrical components and method of producing the same

Method for manufacturing a semiconductor package having a conductiv...

Semiconductor device with galvanically isolated semiconductor chips

Semiconductor package and related methods

Systems and processes for increasing semiconductor device reliability

Patents Applicationslast 30 patents

MICROELECTRONIC PACKAGE WITH RAISED CONNECTOR FOR EXTERNAL COMPONENT

SEMICONDUCTOR PACKAGES WITH CHIP STACK

SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING S...

SEMICONDUCTOR DEVICE

DIE WITH CONNECTION PAD

SEMICONDUCTOR MODULE

PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES

Direct Bonded Semiconductor Die Package

SEMICONDUCTOR DEVICE

Semiconductor Package and Method for Manufacturing Semiconductor Pa...

METHOD FOR PRODUCING A CIRCUIT ARRANGEMENT FOR AN ELECTRIC MACHINE,...

CLIP

POWER MODULE STRUCTURE WITH CLIP SUBSTRATE MEMBER

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING COMPON...

POWER MODULE AND POWER CONVERSION APPARATUS

SEMICONDUCTOR DEVICE

PACKAGE WITH TRANSISTOR CHIP BETWEEN CARRIER AND CONDUCTIVE STRUCTU...

DUAL SWITCHING POWER DEVICE

SEMICONDUCTOR DEVICE AND VEHICLE

POWER PACKAGE CONFIGURED WITH ADDITIONAL FUNCTIONALITY

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

DIE PADDLE

STRUCTURE TO REDUCE CHIP SHIFT DURING ASSEMBLY

Package with Single Integral Body Carrying Two Transistor Chips wit...

SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT