Disposition

Industry

CPC
H01L2224/401

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/401Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having mold locking feature
- Patent number 12,142,548
- Issue date Nov 12, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package including multiple semiconductor devices
- Patent number 12,142,551
- Issue date Nov 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
- Patent number 12,113,002
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Hiroki Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,057,426
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,046,549
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Maiko Hatano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module with electrodes and heat sink and manufacturing method...
- Patent number 12,014,974
- Issue date Jun 18, 2024
- Mitsubishi Electric Corporation
- Masakazu Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plate-shaped conductor
- Patent number 12,002,782
- Issue date Jun 4, 2024
- Kabushiki Kaisha Toshiba
- Shun Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with low parasitic connection to passive device
- Patent number 11,973,063
- Issue date Apr 30, 2024
- Infineon Technologies AG
- Urban Medic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,961,790
- Issue date Apr 16, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,451
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,955,452
- Issue date Apr 9, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module with busbar having a leg with a foot for...
- Patent number 11,894,302
- Issue date Feb 6, 2024
- Danfoss Silicon Power GmbH
- Michael Tønnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of electrical components and method of producing the same
- Patent number 11,855,035
- Issue date Dec 26, 2023
- TDK Corporation
- Yohei Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package having a conductiv...
- Patent number 11,848,254
- Issue date Dec 19, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with galvanically isolated semiconductor chips
- Patent number 11,837,531
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 11,830,856
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and processes for increasing semiconductor device reliability
- Patent number 11,784,155
- Issue date Oct 10, 2023
- Wolfspeed, Inc.
- Sung Chul Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,776,936
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous body on the side surface of a connector mounted to semicondu...
- Patent number 11,776,884
- Issue date Oct 3, 2023
- Kabushiki Kaisha Toshiba
- Yuning Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with laser-welded leadframe
- Patent number 11,749,633
- Issue date Sep 5, 2023
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bond solution for reducing thermal stress on an intermittent...
- Patent number 11,706,852
- Issue date Jul 18, 2023
- Illinois Tool Works Inc.
- Marco Carcano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor module using same
- Patent number 11,694,948
- Issue date Jul 4, 2023
- Mitsubishi Electric Corporation
- Masashi Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a lead frame including die paddles and...
- Patent number 11,688,671
- Issue date Jun 27, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL, LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,664,288
- Issue date May 30, 2023
- Mitsubishi Electric Corporation
- Kenta Nakahara
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT
- Publication number 20240387513
- Publication date Nov 21, 2024
- ROHM CO., LTD.
- Isao TAKOBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387326
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240387442
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Kensuke TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCU...
- Publication number 20240379510
- Publication date Nov 14, 2024
- ROHM CO., LTD.
- Katsuhiko YOSHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH BALANCED CURRENT FLOW
- Publication number 20240379526
- Publication date Nov 14, 2024
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH MOLDING CAVITY
- Publication number 20240371659
- Publication date Nov 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240355774
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Nozomi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH OVERLAPPING TERMINALS
- Publication number 20240332148
- Publication date Oct 3, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321693
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Tomohiro YASUNISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240321811
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Delay-Free Temperature Measurement Of Power Switches
- Publication number 20240319012
- Publication date Sep 26, 2024
- Vitesco Technologies GMBH
- Fadi Rifai
- G01 - MEASURING TESTING
Information Patent Application
CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...
- Publication number 20240312882
- Publication date Sep 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Junqing HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDWICH PACKAGE FOR MICROELECTRONICS
- Publication number 20240290757
- Publication date Aug 29, 2024
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240290759
- Publication date Aug 29, 2024
- Power Master Semiconductor Co., Ltd.
- Taekkeun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES
- Publication number 20240290676
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282692
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON...
- Publication number 20240250058
- Publication date Jul 25, 2024
- STMicroelectronics International N.V.
- Mauro MAZZOLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240250015
- Publication date Jul 25, 2024
- Fuji Electric Co., Ltd.
- Katsunori SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE
- Publication number 20240250056
- Publication date Jul 25, 2024
- Mohd Afiz Hashim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240244750
- Publication date Jul 18, 2024
- ROHM CO., LTD.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...
- Publication number 20240243095
- Publication date Jul 18, 2024
- CHONGQING ALPHA AND OMEGA SEMICONDUCTOR LIMITED
- LIMIN WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240243044
- Publication date Jul 18, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234361
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid Immersion-Cooled Power Module
- Publication number 20240222225
- Publication date Jul 4, 2024
- Hyundai Motor Company
- Suk Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LOW-WARPAGE CARRIER
- Publication number 20240222234
- Publication date Jul 4, 2024
- INFINEON TECHNOLOGIES AG
- Abdul Rahman MOHAMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213126
- Publication date Jun 27, 2024
- Power Master Semiconductor Co., Ltd.
- Jooyaung EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE LAYOUTS, STRUCTURES, AND/OR CONFIGURATION...
- Publication number 20240213124
- Publication date Jun 27, 2024
- Brice MCPHERSON
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package having mold locking feature

Package including multiple semiconductor devices

Plurality of transistors attached to a heat sink with a periphery n...

Semiconductor module

Semiconductor device

Semiconductor device

Semiconductor device and electronic device

Power module with electrodes and heat sink and manufacturing method...

Semiconductor device with plate-shaped conductor

Semiconductor device

Semiconductor packages using package in package systems and related...

Semiconductor package with low parasitic connection to passive device

Semiconductor module

Semiconductor module

Semiconductor module

Power semiconductor device with dual heat dissipation structures

Semiconductor package with solder standoff

Semiconductor power module with busbar having a leg with a foot for...

Stack of electrical components and method of producing the same

Method for manufacturing a semiconductor package having a conductiv...

Semiconductor device with galvanically isolated semiconductor chips

Semiconductor package and related methods

Systems and processes for increasing semiconductor device reliability

Semiconductor device

Porous body on the side surface of a connector mounted to semicondu...

Power semiconductor module with laser-welded leadframe

Ribbon bond solution for reducing thermal stress on an intermittent...

Semiconductor device and semiconductor module using same

Semiconductor package having a lead frame including die paddles and...

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE AND SEMICONDUCTOR UNIT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

CIRCUIT COMPONENT, ELECTRONIC DEVICE AND METHOD FOR PRODUCING CIRCU...

POWER MODULE WITH BALANCED CURRENT FLOW

PACKAGE WITH MOLDING CAVITY

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

POWER MODULE WITH OVERLAPPING TERMINALS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE

Delay-Free Temperature Measurement Of Power Switches

CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...

SANDWICH PACKAGE FOR MICROELECTRONICS

SEMICONDUCTOR DEVICE

SHIELDED LEAD PACKAGE FOR HIGH VOLTAGE DEVICES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING RIBBON...

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE HAVING A SOLDER WETTING STRUCTURE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SAME, AND A...

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

Liquid Immersion-Cooled Power Module

PACKAGE WITH LOW-WARPAGE CARRIER

SEMICONDUCTOR DEVICE

POWER ELECTRONICS PACKAGE LAYOUTS, STRUCTURES, AND/OR CONFIGURATION...