Disposition

Industry

CPC
H01L2924/172

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/172Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages and method of manufacturing semiconductor pa...
- Patent number 11,569,563
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,315,842
- Issue date Apr 26, 2022
- Mitsubishi Electric Corporation
- Hiromitsu Utsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,403,616
- Issue date Sep 3, 2019
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 9,991,242
- Issue date Jun 5, 2018
- Fuji Electric Co., Ltd.
- Kenichiro Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolator with reduced susceptibility to parasitic coupling
- Patent number 9,960,671
- Issue date May 1, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Dominique Ho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
No-flow underfill for package with interposer frame
- Patent number 8,946,072
- Issue date Feb 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379609
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PROTECTION DEVICE
- Publication number 20240096748
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED EMBEDDED DIE PACKAGE
- Publication number 20240038619
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20230378092
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED S...
- Publication number 20230290738
- Publication date Sep 14, 2023
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20230005801
- Publication date Jan 5, 2023
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING SEMICONDUCTOR PA...
- Publication number 20220006173
- Publication date Jan 6, 2022
- Samsung Electronics Co., Ltd.
- Yongkoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20180254267
- Publication date Sep 6, 2018
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR WITH REDUCED SUSCEPTIBILITY TO PARASITIC COUPLING
- Publication number 20160190918
- Publication date Jun 30, 2016
- Dominique Ho
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Robust and Reliable Power Semiconductor Package
- Publication number 20160104688
- Publication date Apr 14, 2016
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...
- Publication number 20150255444
- Publication date Sep 10, 2015
- Fuji Electric Co., Ltd.
- Kenichiro SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-FLOW UNDERFILL FOR PACKAGE WITH INTERPOSER FRAME
- Publication number 20150123272
- Publication date May 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-FLOW UNDERFILL FOR PACKAGE WITH INTERPOSER FRAME
- Publication number 20130200513
- Publication date Aug 8, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages and method of manufacturing semiconductor pa...

Semiconductor package

Method of manufacturing a semiconductor device

Semiconductor device, method of manufacturing a semiconductor devic...

Isolator with reduced susceptibility to parasitic coupling

No-flow underfill for package with interposer frame

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PROTECTION DEVICE

THERMALLY ENHANCED EMBEDDED DIE PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR SYSTEMS WITH ANTI-WARPAGE MECHANISMS AND ASSOCIATED S...

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING SEMICONDUCTOR PA...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

ISOLATOR WITH REDUCED SUSCEPTIBILITY TO PARASITIC COUPLING

Robust and Reliable Power Semiconductor Package

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...

NO-FLOW UNDERFILL FOR PACKAGE WITH INTERPOSER FRAME

NO-FLOW UNDERFILL FOR PACKAGE WITH INTERPOSER FRAME