Disposition

Industry

CPC
H01L2924/152

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/152Disposition

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate and manufacturing method thereof
- Patent number 12,199,027
- Issue date Jan 14, 2025
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical power plane module for semiconductor packages
- Patent number 11,342,289
- Issue date May 24, 2022
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package with flexible printed circuits
- Patent number 11,171,170
- Issue date Nov 9, 2021
- Sony Corporation
- Yuta Momiuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Dual bond pad structure for photonics
- Patent number 10,476,227
- Issue date Nov 12, 2019
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 10,332,826
- Issue date Jun 25, 2019
- Sony Corporation
- Kosuke Hareyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor pressure sensor
- Patent number 10,254,184
- Issue date Apr 9, 2019
- Fujikura Ltd.
- Naoki Takayama
- G01 - MEASURING TESTING
Information Patent Grant
Capacitor and capacitor-containing board
- Patent number 10,064,281
- Issue date Aug 28, 2018
- Murata Manufacturing Co., Ltd.
- Yasuo Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out panel level package and method of fabricating the same
- Patent number 9,892,980
- Issue date Feb 13, 2018
- Samsung Electronics Co., Ltd.
- Younghoon Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer-less stack die interconnect
- Patent number 9,761,533
- Issue date Sep 12, 2017
- Xilinx, Inc.
- Raghunandan Chaware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,698,072
- Issue date Jul 4, 2017
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a bridge interposer
- Patent number 9,431,371
- Issue date Aug 30, 2016
- Broadcom Corporation
- Sampath K. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-stress dual underfill packaging
- Patent number 9,373,559
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board and semiconductor package
- Patent number 9,357,652
- Issue date May 31, 2016
- Samsung Electronics Co., Ltd.
- Hee Jeong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact arrangements for stackable microelectronic package structur...
- Patent number 9,349,707
- Issue date May 24, 2016
- Invensas Corporation
- Zhuowen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with stand-off legs
- Patent number 9,076,776
- Issue date Jul 7, 2015
- Altera Corporation
- Ken Beng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged die for heat dissipation and method therefor
- Patent number 8,536,697
- Issue date Sep 17, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413072
- Publication date Dec 12, 2024
- Dyi-Chung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413125
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Seho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY
- Publication number 20240063127
- Publication date Feb 22, 2024
- Intel Corporation
- Jeremy D. ECTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20230282626
- Publication date Sep 7, 2023
- MEDIATEK INC.
- Tai-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES
- Publication number 20230268309
- Publication date Aug 24, 2023
- SUMITOMO CHEMICAL CO., LTD.
- Martin Humphries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20230260866
- Publication date Aug 17, 2023
- MEDIATEK INC.
- Yin-Fa CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230170267
- Publication date Jun 1, 2023
- JCET MANAGEMENT CO., LTD.
- CHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230170274
- Publication date Jun 1, 2023
- JCET MANAGEMENT CO., LTD.
- CHENG YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE PACKAGE AND ELECTRONIC...
- Publication number 20230135498
- Publication date May 4, 2023
- STMicroelectronics S.r.l.
- Yi Ming LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL POWER PLANE MODULE FOR SEMICONDUCTOR PACKAGES
- Publication number 20220068846
- Publication date Mar 3, 2022
- Intel Corporation
- Jenny Shio Yin ONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
- Publication number 20200014171
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PANEL LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20180096903
- Publication date Apr 5, 2018
- Samsung Electronics Co., Ltd.
- Younghoon Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PANEL LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170309523
- Publication date Oct 26, 2017
- Samsung Electronics Co., Ltd.
- Younghoon SOHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND CAPACITOR-CONTAINING BOARD
- Publication number 20170181288
- Publication date Jun 22, 2017
- Murata Manufacturing Co., Ltd.
- Yasuo FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
- Publication number 20170125974
- Publication date May 4, 2017
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER-LESS STACK DIE INTERCONNECT
- Publication number 20170110407
- Publication date Apr 20, 2017
- Xilinx, Inc.
- Raghunandan Chaware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND STACK PACKAGE MODULE INCLUDING THE SAME
- Publication number 20170005032
- Publication date Jan 5, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Jin Su KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PRESSURE SENSOR
- Publication number 20160209284
- Publication date Jul 21, 2016
- FUJIKURA LTD.
- Naoki TAKAYAMA
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING HETEROGENEOUS SOLDER JOINT STR...
- Publication number 20160148864
- Publication date May 26, 2016
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust and Reliable Power Semiconductor Package
- Publication number 20160104688
- Publication date Apr 14, 2016
- INTERNATIONAL RECTIFIER CORPORATION
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS DUAL UNDERFILL PACKAGING
- Publication number 20160049345
- Publication date Feb 18, 2016
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150380347
- Publication date Dec 31, 2015
- SONY CORPORATION
- Kosuke Hareyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURED WIDE I/O MEMORY MODULES AND PACKAGE ARCHITECTURES USIN...
- Publication number 20150364454
- Publication date Dec 17, 2015
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE
- Publication number 20150262841
- Publication date Sep 17, 2015
- Samsung Electronics Co., Ltd.
- Hee Jeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER
- Publication number 20150235992
- Publication date Aug 20, 2015
- BROADCOM CORPORATION
- Sampath K. KARIKALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with a Bridge Interposer
- Publication number 20130168854
- Publication date Jul 4, 2013
- BROADCOM CORPORATION
- Sampath K.V. Karikalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DIE FOR HEAT DISSIPATION AND METHOD THEREFOR
- Publication number 20130134575
- Publication date May 30, 2013
- YUAN YUAN
- H01 - BASIC ELECTRIC ELEMENTS

Disposition

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate and manufacturing method thereof

Vertical power plane module for semiconductor packages

Image sensor package with flexible printed circuits

Dual bond pad structure for photonics

Semiconductor device and method of manufacturing semiconductor device

Semiconductor pressure sensor

Capacitor and capacitor-containing board

Fan-out panel level package and method of fabricating the same

Interposer-less stack die interconnect

Low-stress dual underfill packaging

Semiconductor package with a bridge interposer

Low-stress dual underfill packaging

Method of manufacturing circuit board and semiconductor package

Contact arrangements for stackable microelectronic package structur...

Integrated circuit package with stand-off legs

Packaged die for heat dissipation and method therefor

Patents Applicationslast 30 patents

SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

CONFORMABLE DIE BOND FILM (DBF) IN GLASS CAVITY

HIGH-BANDWIDTH PACKAGE-ON-PACKAGE STRUCTURE

THERMALLY CONDUCTIVE MATERIAL FOR ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE PACKAGE AND ELECTRONIC...

VERTICAL POWER PLANE MODULE FOR SEMICONDUCTOR PACKAGES

DUAL BOND PAD STRUCTURE FOR PHOTONICS

FAN-OUT PANEL LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME

FAN-OUT PANEL LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME

CAPACITOR AND CAPACITOR-CONTAINING BOARD

DUAL BOND PAD STRUCTURE FOR PHOTONICS

INTERPOSER-LESS STACK DIE INTERCONNECT

LEAD FRAME AND STACK PACKAGE MODULE INCLUDING THE SAME

SEMICONDUCTOR PRESSURE SENSOR

INTEGRATED DEVICE PACKAGE COMPRISING HETEROGENEOUS SOLDER JOINT STR...

Robust and Reliable Power Semiconductor Package

LOW-STRESS DUAL UNDERFILL PACKAGING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

RECONFIGURED WIDE I/O MEMORY MODULES AND PACKAGE ARCHITECTURES USIN...

METHOD OF MANUFACTURING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH A BRIDGE INTERPOSER

Semiconductor Package with a Bridge Interposer

PACKAGED DIE FOR HEAT DISSIPATION AND METHOD THEREFOR