TREA

Dissolving the filler without dissolving the matrix material Dissolving the matrix material without dissolving the filler

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Industry

  • CPC
  • H05K2203/0773
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0773Dissolving the filler without dissolving the matrix material Dissolving the matrix material without dissolving the filler
Industries