Dissolving the filler without dissolving the matrix material Dissolving the matrix material without dissolving the filler

Industry

CPC
H05K2203/0773

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0773Dissolving the filler without dissolving the matrix material Dissolving the matrix material without dissolving the filler

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 9,929,097
- Issue date Mar 27, 2018
- Intel Corporation
- Ravi Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive film with networked nano-material
- Patent number 9,462,681
- Issue date Oct 4, 2016
- LG Electronics Inc.
- Yangwook Hur
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition for solder bump formation, solder bump formation...
- Patent number 9,415,469
- Issue date Aug 16, 2016
- San-ei Kagaku Co., Ltd.
- Yasuhiro Takase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 9,040,842
- Issue date May 26, 2015
- Intel Corporation
- Ravi Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, build-up multi-layer board, and production me...
- Patent number 8,866,022
- Issue date Oct 21, 2014
- Panasonic Corporation
- Yoshito Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,822,830
- Issue date Sep 2, 2014
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,822,828
- Issue date Sep 2, 2014
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multi-layer printed circuit board
- Patent number 8,782,882
- Issue date Jul 22, 2014
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multi-layer printed circuit board
- Patent number 8,745,863
- Issue date Jun 10, 2014
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanical adhesion of copper metallization to dielectric with part...
- Patent number 8,425,785
- Issue date Apr 23, 2013
- Intel Corporation
- Ravi Nalla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,288,664
- Issue date Oct 16, 2012
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,288,665
- Issue date Oct 16, 2012
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 8,283,573
- Issue date Oct 9, 2012
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered printed circuit board and manufacturing method thereof
- Patent number 8,148,643
- Issue date Apr 3, 2012
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cleaning surface of resin layer
- Patent number 8,034,188
- Issue date Oct 11, 2011
- Shinko Electric Industries Co., Ltd.
- Yoji Asahi
- B08 - CLEANING
Information Patent Grant
Multi-layer printed circuit board and method of manufacturing multi...
- Patent number 7,985,930
- Issue date Jul 26, 2011
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayered printed circuit board
- Patent number 7,832,098
- Issue date Nov 16, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 7,800,917
- Issue date Sep 21, 2010
- Meiko Electronics Co., Ltd.
- Hiroshi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayered circuit board
- Patent number 7,415,761
- Issue date Aug 26, 2008
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing porous polyimide resin and porous polymide resin
- Patent number 7,022,377
- Issue date Apr 4, 2006
- Nitto Denko Corporation
- Mitsuhiro Kanada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing a multi-layer printer wiring board
- Patent number 6,881,293
- Issue date Apr 19, 2005
- Ajinomoto Co., Inc.
- Shigeo Nakamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat-resistant film base-material-inserted B-stage resin compositio...
- Patent number 6,866,919
- Issue date Mar 15, 2005
- Mitsubishi Gas Chemical Company, Inc.
- Nobuyuki Ikeguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board and method of manufacturing multila...
- Patent number 6,828,510
- Issue date Dec 7, 2004
- Ibiden Co., Ltd.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric structure
- Patent number 6,819,540
- Issue date Nov 16, 2004
- Shipley Company, L.L.C.
- Craig S. Allen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal film bonded body, bonding agent layer and bonding agent
- Patent number 6,607,825
- Issue date Aug 19, 2003
- Ibiden Co., Ltd.
- Dong Dong Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of a multilayered printed circuit board having...
- Patent number 6,591,495
- Issue date Jul 15, 2003
- Ibiden Co., Ltd.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Curable resin composition, multilayer printed circuit board manufac...
- Patent number 6,586,526
- Issue date Jul 1, 2003
- Taiyo Ink Manufacturing Co., Ltd.
- Akio Sekimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Composition of epoxy resins and curing agent capable of being coars...
- Patent number 6,518,331
- Issue date Feb 11, 2003
- Taiyo Ink Manufacturing Co., Ltd.
- Akio Sekimoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composites and method for producing the same
- Patent number 6,451,932
- Issue date Sep 17, 2002
- Ibiden Co., Ltd.
- Dong Dong Wang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Porous article and process for producing porous article
- Patent number 6,387,969
- Issue date May 14, 2002
- Nitto Denko Corporation
- Takayuki Yamamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE FILM, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC...
- Publication number 20140290992
- Publication date Oct 2, 2014
- Yangwook HUR
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140166347
- Publication date Jun 19, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yoon Su Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...
- Publication number 20130299226
- Publication date Nov 14, 2013
- Ravi Nalla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BOD...
- Publication number 20130288041
- Publication date Oct 31, 2013
- Nobuhiro GOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
DIELECTRIC COMPOSITION, MULTILAYERED PRINTED CIRCUIT BOARD COMPRISI...
- Publication number 20130000965
- Publication date Jan 3, 2013
- Samsung Electro-Mechanics CO., LTD.
- Dong Joo SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20120186867
- Publication date Jul 26, 2012
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, BUILD-UP MULTI-LAYER BOARD, AND PRODUCTION ME...
- Publication number 20120152599
- Publication date Jun 21, 2012
- PANASONIC CORPORATION
- Yoshito Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120125680
- Publication date May 24, 2012
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20110252641
- Publication date Oct 20, 2011
- IBIDEN, CO., LTD.
- Motoo ASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20110253306
- Publication date Oct 20, 2011
- IBIDEN, CO., LTD.
- Motoo ASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20110192637
- Publication date Aug 11, 2011
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BOD...
- Publication number 20110189432
- Publication date Aug 4, 2011
- Sekisui Chemical Co., Ltd
- Nobuhiro Goto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20110036626
- Publication date Feb 17, 2011
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20110024164
- Publication date Feb 3, 2011
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20100122840
- Publication date May 20, 2010
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...
- Publication number 20090242109
- Publication date Oct 1, 2009
- Ravi Nalla
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090029506
- Publication date Jan 29, 2009
- Shinko Electric Industries Co., Ltd.
- Tomoharu Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Forming Electroconductive Circuit
- Publication number 20090000951
- Publication date Jan 1, 2009
- Tetsuo Yumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...
- Publication number 20080277148
- Publication date Nov 13, 2008
- IBIDEN CO., LTD.
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080189943
- Publication date Aug 14, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20080173473
- Publication date Jul 24, 2008
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CLEANING SURFACE OF RESIN LAYER
- Publication number 20070131243
- Publication date Jun 14, 2007
- Shinko Electric Industries Co., Ltd.
- Yoji Asahi
- B08 - CLEANING
Information Patent Application
Printed wiring board and production method therefor
- Publication number 20070025091
- Publication date Feb 1, 2007
- Victor Company of Japan, Ltd. a corporation of Japan
- Hiroshi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for producing a multi-layer printer wiring board
- Publication number 20050178501
- Publication date Aug 18, 2005
- AJINOMOTO CO., INC.
- Shigeo Nakamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Multi-layer printed circuit board and method of manufacturing multi...
- Publication number 20050039948
- Publication date Feb 24, 2005
- Motoo Asai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for producing porous polyimide resin and porous polymide resin
- Publication number 20040101626
- Publication date May 27, 2004
- Mitsuhiro Kanada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Multilayered printed circuit board and manufacturing method therefor
- Publication number 20040025333
- Publication date Feb 12, 2004
- IBIDEN CO., LTD.
- Naohiro Hirose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat-resistant film base-material-inserted B-stage resin compositio...
- Publication number 20030162006
- Publication date Aug 28, 2003
- Nobuyuki Ikeguchi
- B32 - LAYERED PRODUCTS
Information Patent Application
Dielectric structure
- Publication number 20030128496
- Publication date Jul 10, 2003
- Shipley Company, L.L.C.
- Craig S. Allen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for producing a multi-layer printer wiring board
- Publication number 20020076539
- Publication date Jun 20, 2002
- Shigeo Nakamura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Dissolving the filler without dissolving the matrix material Dissolving the matrix material without dissolving the filler

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mechanical adhesion of copper metallization to dielectric with part...

Conductive film with networked nano-material

Resin composition for solder bump formation, solder bump formation...

Mechanical adhesion of copper metallization to dielectric with part...

Printed wiring board, build-up multi-layer board, and production me...

Multi-layer printed circuit board and method of manufacturing multi...

Multi-layer printed circuit board and method of manufacturing multi...

Method of manufacturing multi-layer printed circuit board

Method of manufacturing multi-layer printed circuit board

Mechanical adhesion of copper metallization to dielectric with part...

Multi-layer printed circuit board and method of manufacturing multi...

Multi-layer printed circuit board and method of manufacturing multi...

Multi-layer printed circuit board and method of manufacturing multi...

Multilayered printed circuit board and manufacturing method thereof

Method for cleaning surface of resin layer

Multi-layer printed circuit board and method of manufacturing multi...

Method of manufacturing a multilayered printed circuit board

Printed wiring board

Method of manufacturing multilayered circuit board

Method for producing porous polyimide resin and porous polymide resin

Process for producing a multi-layer printer wiring board

Heat-resistant film base-material-inserted B-stage resin compositio...

Multilayer printed wiring board and method of manufacturing multila...

Dielectric structure

Metal film bonded body, bonding agent layer and bonding agent

Manufacturing method of a multilayered printed circuit board having...

Curable resin composition, multilayer printed circuit board manufac...

Composition of epoxy resins and curing agent capable of being coars...

Resin composites and method for producing the same

Porous article and process for producing porous article

Patents Applicationslast 30 patents

CONDUCTIVE FILM, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...

EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BOD...

DIELECTRIC COMPOSITION, MULTILAYERED PRINTED CIRCUIT BOARD COMPRISI...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

PRINTED WIRING BOARD, BUILD-UP MULTI-LAYER BOARD, AND PRODUCTION ME...

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

EPOXY RESIN COMPOSITION, PREPREG, CURED BODY, SHEET-LIKE MOLDED BOD...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MECHANICAL ADHESION OF COPPER METALLIZATION TO DIELECTRIC WITH PART...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for Forming Electroconductive Circuit

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI...

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

MULTILAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD FOR CLEANING SURFACE OF RESIN LAYER

Printed wiring board and production method therefor

Process for producing a multi-layer printer wiring board

Multi-layer printed circuit board and method of manufacturing multi...

Process for producing porous polyimide resin and porous polymide resin

Multilayered printed circuit board and manufacturing method therefor

Heat-resistant film base-material-inserted B-stage resin compositio...

Dielectric structure

Process for producing a multi-layer printer wiring board