dividing the wafer into individual chips

Industry

CPC
B41J2/1635

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B41Printing, stamps B41JTYPEWRITERS SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed

Current Industry

B41J2/1635dividing the wafer into individual chips

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of narrow type inkjet print head chip
- Patent number 12,005,711
- Issue date Jun 11, 2024
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wafer structure
- Patent number 11,813,863
- Issue date Nov 14, 2023
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wafer structure
- Patent number 11,731,424
- Issue date Aug 22, 2023
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wafer structure
- Patent number 11,731,423
- Issue date Aug 22, 2023
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure
- Patent number 11,718,094
- Issue date Aug 8, 2023
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wafer structure
- Patent number 11,701,884
- Issue date Jul 18, 2023
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wafer structure
- Patent number 11,639,054
- Issue date May 2, 2023
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Piezoelectric element, piezoelectric element application device, an...
- Patent number 11,417,828
- Issue date Aug 16, 2022
- Seiko Epson Corporation
- Tomohiro Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS device, liquid ejecting head, liquid ejecting apparatus, manuf...
- Patent number 11,390,079
- Issue date Jul 19, 2022
- Seiko Epson Corporation
- Daisuke Yamada
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing substrate laminated body, substrate for liq...
- Patent number 11,305,539
- Issue date Apr 19, 2022
- Canon Kabushiki Kaisha
- Taichi Yonemoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of manufacturing MEMS device and MEMS device
- Patent number 11,114,604
- Issue date Sep 7, 2021
- Seiko Epson Corporation
- Yoshiki Sugawara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printhead
- Patent number 11,020,967
- Issue date Jun 1, 2021
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Piezoelectric element and piezoelectric element-based device
- Patent number 10,916,693
- Issue date Feb 9, 2021
- Seiko Epson Corporation
- Takayuki Yonemura
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Method of manufacturing substrate and semiconductor device
- Patent number 10,861,703
- Issue date Dec 8, 2020
- Canon Kabushiki Kaisha
- Hirohisa Fujita
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Piezoelectric element and method for manufacturing same
- Patent number 10,833,244
- Issue date Nov 10, 2020
- Seiko Epson Corporation
- Takayuki Yonemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted TIJ
- Patent number 10,780,698
- Issue date Sep 22, 2020
- Hewlett-Packard Development Company, L.P.
- Michael W Cumbie
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Piezoelectric element and piezoelectric element application device
- Patent number 10,756,250
- Issue date Aug 25, 2020
- Seiko Epson Corporation
- Tetsuya Isshiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing liquid ejection head and method of manufact...
- Patent number 10,744,771
- Issue date Aug 18, 2020
- Canon Kabushiki Kaisha
- Keiji Matsumoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printheads and methods of fabricating a printhead
- Patent number 10,661,567
- Issue date May 26, 2020
- Hewlett-Packard Development Company, L.P.
- Michael W. Cumbie
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Perforated substrate processing method and liquid ejection head man...
- Patent number 10,632,754
- Issue date Apr 28, 2020
- Canon Kabushiki Kaisha
- Masaya Uyama
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printhead
- Patent number 10,603,911
- Issue date Mar 31, 2020
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of manufacturing inkjet printhead
- Patent number 10,525,701
- Issue date Jan 7, 2020
- Memjet Technology Limited
- Jason Thelander
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for manufacturing liquid ejection head
- Patent number 10,500,861
- Issue date Dec 10, 2019
- Canon Kabushiki Kaisha
- Kunihito Uohashi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Nozzle substrate, ink-jet print head, and method for producing nozz...
- Patent number 10,500,857
- Issue date Dec 10, 2019
- Rohm Co., Ltd.
- Nobufumi Matsuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Print head substrate and method of manufacturing the same, and semi...
- Patent number 10,479,075
- Issue date Nov 19, 2019
- Canon Kabushiki Kaisha
- Ryo Kasai
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for manufacturing liquid ejection head
- Patent number 10,479,084
- Issue date Nov 19, 2019
- Canon Kabushiki Kaisha
- Seiichiro Yaginuma
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printhead
- Patent number 10,471,714
- Issue date Nov 12, 2019
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Nozzle substrate, ink-jet print head, and method for producing nozz...
- Patent number 10,457,046
- Issue date Oct 29, 2019
- Rohm Co., Ltd.
- Eitaro Kurokawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for manufacturing liquid ejection head
- Patent number 10,442,201
- Issue date Oct 15, 2019
- Canon Kabushiki Kaisha
- Satoshi Ibe
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluid ejection device
- Patent number 10,421,275
- Issue date Sep 24, 2019
- Hewlett-Packard Development Company, L.P.
- Donald W Schulte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER, AND LIQUID EJECTION CHIP
- Publication number 20240190132
- Publication date Jun 13, 2024
- Canon Kabushiki Kaisha
- RYOTARO MURAKAMI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CHANNEL-FORMING SUBSTRATE, PRINT HEAD, AND METHOD OF MANUFACTURING...
- Publication number 20240140094
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- MANABU OTSUKA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WAFER DICING METHOD AND LIQUID EJECTION HEAD
- Publication number 20240145310
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- TAKASHI TERAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIQUID DISCHARGING HEAD AND LIQUID DISCHARG...
- Publication number 20240123731
- Publication date Apr 18, 2024
- Canon Kabushiki Kaisha
- NAOYUKI KAMANO
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTION HEAD INSPECTION METHOD, LIQUID EJECTION HEAD INSPEC...
- Publication number 20240042758
- Publication date Feb 8, 2024
- Canon Kabushiki Kaisha
- SATORU TAKAHASHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WAFER STRUCTURE
- Publication number 20220219456
- Publication date Jul 14, 2022
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WAFER STRUCTURE
- Publication number 20220161556
- Publication date May 26, 2022
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WAFER STRUCTURE
- Publication number 20220134747
- Publication date May 5, 2022
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WAFER STRUCTURE
- Publication number 20220134748
- Publication date May 5, 2022
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MANUFACTURING METHOD OF NARROW TYPE INKJET PRINT HEAD CHIP
- Publication number 20210291525
- Publication date Sep 23, 2021
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, MANUF...
- Publication number 20210129535
- Publication date May 6, 2021
- SEIKO EPSON CORPORATION SEIKO EPSON CORPORATION SEIKO EPSON CORPORATION
- Daisuke YAMADA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE LAMINATED BODY, SUBSTRATE FOR LIQ...
- Publication number 20210031524
- Publication date Feb 4, 2021
- Canon Kabushiki Kaisha
- Taichi Yonemoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD
- Publication number 20200031126
- Publication date Jan 30, 2020
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ELEMENT APPLICATION DEVICE, AN...
- Publication number 20200035905
- Publication date Jan 30, 2020
- SEIKO EPSON CORPORATION
- Tomohiro SAKAI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF MANUFACTURING INKJET PRINTHEAD
- Publication number 20190308409
- Publication date Oct 10, 2019
- MEMJET TECHNOLOGY LIMITED
- Jason Thelander
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LEAD-FREE PIEZO PRINTHEAD USING THINNED BULK MATERIAL
- Publication number 20190232658
- Publication date Aug 1, 2019
- Xerox Corporation
- Peter J. Nystrom
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INVERTED TIJ
- Publication number 20190111680
- Publication date Apr 18, 2019
- Hewlett-Packard Development Company, L.P.
- Michael W Cumbie
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PERFORATED SUBSTRATE PROCESSING METHOD AND LIQUID EJECTION HEAD MAN...
- Publication number 20190111682
- Publication date Apr 18, 2019
- Canon Kabushiki Kaisha
- Masaya Uyama
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METAL ALLOY SHIM FOR MOUNTING PRINTHEAD CHIPS WITH HIGH BONDING STR...
- Publication number 20180370223
- Publication date Dec 27, 2018
- MEMJET TECHNOLOGY LIMITED
- Jason Thelander
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
FLUID EJECTION DIE AND PLASTIC-BASED SUBSTRATE
- Publication number 20180354268
- Publication date Dec 13, 2018
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINT HEAD SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEM...
- Publication number 20180326725
- Publication date Nov 15, 2018
- Canon Kabushiki Kaisha
- Ryo Kasai
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MANUFACTURING METHOD OF LIQUID EJECTING HEAD CHIP
- Publication number 20180272714
- Publication date Sep 27, 2018
- SII PRINTEK INC.
- Hitoshi NAKAYAMA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PIEZOELECTRIC ELEMENT AND PIEZOELECTRIC ELEMENT-BASED DEVICE
- Publication number 20180277742
- Publication date Sep 27, 2018
- SEIKO EPSON CORPORATION
- Takayuki YONEMURA
- C01 - INORGANIC CHEMISTRY
Information Patent Application
PRESSING METHOD FOR SURFACE OF RESIN LAYER
- Publication number 20180250937
- Publication date Sep 6, 2018
- Canon Kabushiki Kaisha
- Masafumi Morisue
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MEMBER, LIQUID EJECTING HEAD CHIP, LIQUID EJECTING HEAD, LIQUID EJE...
- Publication number 20180222209
- Publication date Aug 9, 2018
- SII PRINTEK INC.
- Yuzuru KUBOTA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD
- Publication number 20180222194
- Publication date Aug 9, 2018
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEADS AND METHODS OF FABRICATING A PRINTHEAD
- Publication number 20180222201
- Publication date Aug 9, 2018
- Hewlett-Packard Development Company, L.P.
- Michael W. Cumbie
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND LIQUID EJECTING HEAD
- Publication number 20180086079
- Publication date Mar 29, 2018
- SEIKO EPSON CORPORATION
- Hitoshi TAKAAI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR CHIPS FOR LIQUID DISCHARGE HEAD
- Publication number 20170361616
- Publication date Dec 21, 2017
- Canon Kabushiki Kaisha
- Tomohiro Takahashi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF MAKING INKJET PRINT HEADS BY FILLING RESIDUAL SLOTTED REC...
- Publication number 20170326878
- Publication date Nov 16, 2017
- STMicroelectronics, Inc.
- Kenneth J. Stewart
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

dividing the wafer into individual chips

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of narrow type inkjet print head chip

Wafer structure

Wafer structure

Wafer structure

Wafer structure

Wafer structure

Wafer structure

Piezoelectric element, piezoelectric element application device, an...

MEMS device, liquid ejecting head, liquid ejecting apparatus, manuf...

Method of manufacturing substrate laminated body, substrate for liq...

Method of manufacturing MEMS device and MEMS device

Printhead

Piezoelectric element and piezoelectric element-based device

Method of manufacturing substrate and semiconductor device

Piezoelectric element and method for manufacturing same

Inverted TIJ

Piezoelectric element and piezoelectric element application device

Method of manufacturing liquid ejection head and method of manufact...

Printheads and methods of fabricating a printhead

Perforated substrate processing method and liquid ejection head man...

Printhead

Method of manufacturing inkjet printhead

Method for manufacturing liquid ejection head

Nozzle substrate, ink-jet print head, and method for producing nozz...

Print head substrate and method of manufacturing the same, and semi...

Method for manufacturing liquid ejection head

Printhead

Nozzle substrate, ink-jet print head, and method for producing nozz...

Method for manufacturing liquid ejection head

Fluid ejection device

Patents Applicationslast 30 patents

WAFER, AND LIQUID EJECTION CHIP

CHANNEL-FORMING SUBSTRATE, PRINT HEAD, AND METHOD OF MANUFACTURING...

WAFER DICING METHOD AND LIQUID EJECTION HEAD

METHOD OF MANUFACTURING LIQUID DISCHARGING HEAD AND LIQUID DISCHARG...

LIQUID EJECTION HEAD INSPECTION METHOD, LIQUID EJECTION HEAD INSPEC...

WAFER STRUCTURE

WAFER STRUCTURE

WAFER STRUCTURE

WAFER STRUCTURE

MANUFACTURING METHOD OF NARROW TYPE INKJET PRINT HEAD CHIP

MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, MANUF...

METHOD OF MANUFACTURING SUBSTRATE LAMINATED BODY, SUBSTRATE FOR LIQ...

PRINTHEAD

PIEZOELECTRIC ELEMENT, PIEZOELECTRIC ELEMENT APPLICATION DEVICE, AN...

METHOD OF MANUFACTURING INKJET PRINTHEAD

LEAD-FREE PIEZO PRINTHEAD USING THINNED BULK MATERIAL

INVERTED TIJ

PERFORATED SUBSTRATE PROCESSING METHOD AND LIQUID EJECTION HEAD MAN...

METAL ALLOY SHIM FOR MOUNTING PRINTHEAD CHIPS WITH HIGH BONDING STR...

FLUID EJECTION DIE AND PLASTIC-BASED SUBSTRATE

PRINT HEAD SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEM...

MANUFACTURING METHOD OF LIQUID EJECTING HEAD CHIP

PIEZOELECTRIC ELEMENT AND PIEZOELECTRIC ELEMENT-BASED DEVICE

PRESSING METHOD FOR SURFACE OF RESIN LAYER

MEMBER, LIQUID EJECTING HEAD CHIP, LIQUID EJECTING HEAD, LIQUID EJE...

PRINTHEAD

PRINTHEADS AND METHODS OF FABRICATING A PRINTHEAD

METHOD FOR MANUFACTURING LIQUID EJECTING HEAD AND LIQUID EJECTING HEAD

METHOD OF MANUFACTURING SEMICONDUCTOR CHIPS FOR LIQUID DISCHARGE HEAD

METHOD OF MAKING INKJET PRINT HEADS BY FILLING RESIDUAL SLOTTED REC...