Electric details

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CPC
H05K2201/07

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/07Electric details

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component
- Patent number 12,193,147
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Ikuo Deguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,148
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with rigid portion and flexible portion having connec...
- Patent number 12,185,456
- Issue date Dec 31, 2024
- First Hi-tec Enterprise Co., Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat removal architecture for stack-type component carrier with emb...
- Patent number 12,167,529
- Issue date Dec 10, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,144,106
- Issue date Nov 12, 2024
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board for high frequency transmission and shielding method
- Patent number 12,127,331
- Issue date Oct 22, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,101,874
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shield printed wiring board with ground member and ground member
- Patent number 12,101,872
- Issue date Sep 24, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Yuusuke Haruna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trans-vacuum printed flexible wiring apparatus
- Patent number 12,096,551
- Issue date Sep 17, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to metallization of ceramic substrates...
- Patent number 12,058,806
- Issue date Aug 6, 2024
- Skyworks Solutions, Inc.
- Shaul Branchevsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,048,088
- Issue date Jul 23, 2024
- GN HEARING A/S
- Thorvaldur Oli Bodvarsson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 12,028,967
- Issue date Jul 2, 2024
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit board, electronic device, and fabrication method t...
- Patent number 12,016,115
- Issue date Jun 18, 2024
- SHENNAN CIRCUITS CO., LTD.
- Beilei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit systems
- Patent number 12,009,311
- Issue date Jun 11, 2024
- Snap Inc.
- Stephen Andrew Steger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microstrip delay matching using printed dielectric material
- Patent number 11,991,819
- Issue date May 21, 2024
- Dell Products L.P.
- Bhyrav Mutnury
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package comprising a block device with a shield and method of fabri...
- Patent number 11,985,804
- Issue date May 14, 2024
- QUALCOMM Incorporated
- Anirudh Bhat
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems using composite materials
- Patent number 11,974,396
- Issue date Apr 30, 2024
- Advanced American Technologies, LLC
- Robert E. Grigsby
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and display device including the same
- Patent number 11,968,775
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Yeon Sun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board having conductive layer for shielding electronic component an...
- Patent number 11,943,862
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Bongchoon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Affixation film for printed wiring board
- Patent number 11,937,365
- Issue date Mar 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sougo Ishioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for circuit interconnects
- Patent number 11,937,368
- Issue date Mar 19, 2024
- OpenLight Photonics, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE
- Publication number 20250018798
- Publication date Jan 16, 2025
- CPS Technology Holdings LLC
- Matthew R. TYLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024599
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS, APPARATUSES, INTEGRATED CIRCUITS, AND PRINTED CIRCUIT BOAR...
- Publication number 20250016911
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Gregory Szczeszynski
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD
- Publication number 20240431083
- Publication date Dec 26, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD
- Yoshiharu YANAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD LOCAL ELECTROMAGNETIC SHIELDING
- Publication number 20240431019
- Publication date Dec 26, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING A PLURALITY OF FLEXIBLE PRINTED CIRCUIT...
- Publication number 20240431028
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Wonho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240431030
- Publication date Dec 26, 2024
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Potential-separating optical signal transmitting device
- Publication number 20240422897
- Publication date Dec 19, 2024
- Knick Elektronische Messgeräte GmbH & Co. KG
- Lars SCHWEIZER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
- Publication number 20240414839
- Publication date Dec 12, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS INCLUDING HEAT...
- Publication number 20240407076
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Jonggeun YOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...
- Publication number 20240397608
- Publication date Nov 28, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Wen LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED BALL GRID ARRAY PAD CAPACITANCE
- Publication number 20240389220
- Publication date Nov 21, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
- Publication number 20240381523
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Wanjae JU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CABLE ASSEMBLY WITH CROSSTALK BARRIER
- Publication number 20240373609
- Publication date Nov 7, 2024
- 3M Innovative Properties Company
- Alexander W. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240365465
- Publication date Oct 31, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SYSTEMS
- Publication number 20240312927
- Publication date Sep 19, 2024
- Snap Inc.
- Stephen Andrew Steger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURGE PROTECTION MODULE
- Publication number 20240306355
- Publication date Sep 12, 2024
- HO-HSIEN LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE
- Publication number 20240284596
- Publication date Aug 22, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Liang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDING STRUCTURE AND CIRCUIT BOARD
- Publication number 20240276634
- Publication date Aug 15, 2024
- ZTE CORPORATION
- Jinlong LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240268034
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jesang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...
- Publication number 20240237222
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- HYEONJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FO...
- Publication number 20240224410
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Jeongseok LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240224409
- Publication date Jul 4, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-LOSS TRANSMISSION LINE STRUCTURE
- Publication number 20240222834
- Publication date Jul 4, 2024
- HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Xiaojun Bi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240224413
- Publication date Jul 4, 2024
- Resonac Corporation
- Kosuke URASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPONENT
- Publication number 20240215150
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240206077
- Publication date Jun 20, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240196519
- Publication date Jun 13, 2024
- FUJIFILM CORPORATION
- Yusuke FUJII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20240196518
- Publication date Jun 13, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS

Electric details

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component

Module

Module

Circuit board with rigid portion and flexible portion having connec...

Circuit board

Circuit board and manufacturing method thereof and electronic device

Heat removal architecture for stack-type component carrier with emb...

Electronic device

Bus bar link for battery cell interconnections in a battery module

Circuit board for high frequency transmission and shielding method

Rigid flexible printed circuit board and electronic device includin...

Shield printed wiring board with ground member and ground member

Trans-vacuum printed flexible wiring apparatus

Electromagnetic wave transmission board comprising an inner board w...

Devices and methods related to metallization of ceramic substrates...

Circuit board

Method of manufacturing wiring substrate

Embedded circuit board, electronic device, and fabrication method t...

Circuit systems

Microstrip delay matching using printed dielectric material

Package comprising a block device with a shield and method of fabri...

Wiring board

Systems using composite materials

Printed circuit board and display device including the same

Sensor interposer employing castellated through-vias

Mating backplane for high speed, high density electrical connector

Board having conductive layer for shielding electronic component an...

Affixation film for printed wiring board

Structure for circuit interconnects

Package component and forming method thereof

Patents Applicationslast 30 patents

BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE

CERAMIC WIRING MEMBER

CERAMIC WIRING MEMBER

METHODS, APPARATUSES, INTEGRATED CIRCUITS, AND PRINTED CIRCUIT BOAR...

ELECTROMAGNETIC WAVE SHIELDING FILM AND SHIELDED PRINTED WIRING BOARD

CIRCUIT BOARD LOCAL ELECTROMAGNETIC SHIELDING

ELECTRONIC DEVICE INCLUDING A PLURALITY OF FLEXIBLE PRINTED CIRCUIT...

PRINTED WIRING BOARD

Potential-separating optical signal transmitting device

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

HEAT DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS INCLUDING HEAT...

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...

REDUCED BALL GRID ARRAY PAD CAPACITANCE

ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL

CABLE ASSEMBLY WITH CROSSTALK BARRIER

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

CIRCUIT SYSTEMS

SURGE PROTECTION MODULE

CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE

SHIELDING STRUCTURE AND CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

DRIVING CHIP ACCOMMODATING CIRCUIT BOARD AND DISPLAY DEVICE HAVING...

ELECTRONIC DEVICE INCLUDING SHIELDING MEMBER INCLUDING STRUCTURE FO...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

LOW-LOSS TRANSMISSION LINE STRUCTURE

WIRING SUBSTRATE

PACKAGE COMPONENT

MANUFACTURING METHOD OF ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR