Electric details

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CPC
H05K2201/07

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/07Electric details

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit module
- Patent number 12,363,821
- Issue date Jul 15, 2025
- Murata Manufacturing Co., Ltd.
- Ryota Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module
- Patent number 12,356,538
- Issue date Jul 8, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component
- Patent number 12,349,268
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of producing wiring board
- Patent number 12,342,473
- Issue date Jun 24, 2025
- TOPPAN INC.
- Takeshi Tamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board local electromagnetic shielding
- Patent number 12,317,409
- Issue date May 27, 2025
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surge protection module
- Patent number 12,309,986
- Issue date May 20, 2025
- CYBER POWER SYSTEMS, INC.
- Ho-Hsien Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-sided inductive charging coil
- Patent number 12,301,024
- Issue date May 13, 2025
- Microsoft Technology Licensing, LLC
- Casey Sean Callan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit systems
- Patent number 12,293,978
- Issue date May 6, 2025
- Snap Inc.
- Stephen Andrew Steger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module having a shield film and method of manufacturing the same
- Patent number 12,295,129
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Tetsuya Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transient voltage protection device
- Patent number 12,284,752
- Issue date Apr 22, 2025
- TDK Corporation
- Naoyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display module and manufacturing method therefor, and display device
- Patent number 12,284,863
- Issue date Apr 22, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Haotian Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring board, electronic module, and electronic apparatus
- Patent number 12,267,947
- Issue date Apr 1, 2025
- Canon Kabushiki Kaisha
- Makoto Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over-voltage circuit protection device
- Patent number 12,260,975
- Issue date Mar 25, 2025
- Fuzetec Technology Co., Ltd.
- Jack Jih-Sang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 12,250,768
- Issue date Mar 11, 2025
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Interconnect structure having conductor extending along dielectric...
- Patent number 12,245,361
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun-Yi Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board to which 3D formed electromagnetic shielding film is...
- Patent number 12,245,411
- Issue date Mar 4, 2025
- 3M Innovative Properties Company
- Chao Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave shielding film and shielded printed wiring board
- Patent number 12,232,306
- Issue date Feb 18, 2025
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Takahiko Katsuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power system and method for controlling power modules
- Patent number 12,225,657
- Issue date Feb 11, 2025
- Transportation IP Holdings, LLC
- Alvaro Jorge Mari Curbelo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Connection member and display device including same
- Patent number 12,219,707
- Issue date Feb 4, 2025
- Samsung Display Co., Ltd.
- Kyu Min Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery module printed circuit board assembly system and method
- Patent number 12,208,694
- Issue date Jan 28, 2025
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Low-loss transmission line structure comprising a dielectric layer...
- Patent number 12,212,033
- Issue date Jan 28, 2025
- Huazhong University of Science & Technology
- Xiaojun Bi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,193,147
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Ikuo Deguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,193,148
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with rigid portion and flexible portion having connec...
- Patent number 12,185,456
- Issue date Dec 31, 2024
- First Hi-tec Enterprise Co., Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,177,978
- Issue date Dec 24, 2024
- Toppan Printing Co., Ltd.
- Jun Onohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 12,177,964
- Issue date Dec 24, 2024
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat removal architecture for stack-type component carrier with emb...
- Patent number 12,167,529
- Issue date Dec 10, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,144,106
- Issue date Nov 12, 2024
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND DISPLAY APPARATUS
- Publication number 20250240872
- Publication date Jul 24, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuang LEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE-LEVEL THERMAL MANAGEMENT MECHANISM
- Publication number 20250234452
- Publication date Jul 17, 2025
- Micron Technology, Inc.
- Mark A. Tverdy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Automotive Electronic Control Unit
- Publication number 20250229763
- Publication date Jul 17, 2025
- Aptiv Technologies AG
- Pawel HEBDA
- B60 - VEHICLES IN GENERAL
Information Patent Application
CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE
- Publication number 20250223471
- Publication date Jul 10, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Tomohiro NAGATAKE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY
- Publication number 20250212317
- Publication date Jun 26, 2025
- NVIDIA Corporation
- Tibet Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING SHIELD CAN
- Publication number 20250212316
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Joosoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES FOR REDUCING CROSSTALK INSIDE A SHIELDED DEVICE
- Publication number 20250212315
- Publication date Jun 26, 2025
- Intel Corporation
- Lidar Glazer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISPLAY MODULE AND DISPLAY DEVICE
- Publication number 20250211663
- Publication date Jun 26, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Haotian YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20250203765
- Publication date Jun 19, 2025
- Murata Manufacturing Co., Ltd.
- Yui NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cable Impedance Matching Element and Display Device
- Publication number 20250194013
- Publication date Jun 12, 2025
- LG Display Co., Ltd.
- Yeonju Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE
- Publication number 20250185168
- Publication date Jun 5, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELD AND ELECTRONIC ASSEMBLY
- Publication number 20250168967
- Publication date May 22, 2025
- AMLOGIC (SHANGHAI) CO., LTD.
- Siwei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250159793
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Meng-Jen WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION LINE ASSEMBLY, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELE...
- Publication number 20250158262
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Bing LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE ELEMENT ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20250133650
- Publication date Apr 24, 2025
- GETAC TECHNOLOGY CORPORATION
- HUNG-CHAN CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250132224
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION MEMBER AND DISPLAY DEVICE INCLUDING SAME
- Publication number 20250133657
- Publication date Apr 24, 2025
- SAMSUNG DISPLAY CO., LTD.
- Kyu Min HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION
- Publication number 20250120008
- Publication date Apr 10, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250113438
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Tomoyuki SHIMODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD
- Publication number 20250113428
- Publication date Apr 3, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTENNA-INTEGRATED RADIO PRODUCT AND METHOD FOR PRODUCING THE SAME
- Publication number 20250106999
- Publication date Mar 27, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Xuejun Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250107055
- Publication date Mar 27, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS
- Publication number 20250096089
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Robert Grant SPURNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICAL MITIGATION OF NEUTRON SEE
- Publication number 20250087595
- Publication date Mar 13, 2025
- Rockwell Collins, Inc.
- Eric N. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
- Publication number 20250089154
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Shaul BRANCHEVSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION SHIELDING CONFORMAL COAT FOR PRINTED BOARD ASSEMBLY
- Publication number 20250079772
- Publication date Mar 6, 2025
- Honeywell International Inc.
- Pedro Luis Lebron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD
- Publication number 20250081360
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL DEVICE AND PRINTED WIRING BOARD
- Publication number 20250062061
- Publication date Feb 20, 2025
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Michi OGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME
- Publication number 20250056730
- Publication date Feb 13, 2025
- USI Science and Technology (Shenzhen) Co., Ltd.
- MING CHANG TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20250056712
- Publication date Feb 13, 2025
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Electric details

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit module

Electronic component module

Package component

Wiring board and method of producing wiring board

Circuit board local electromagnetic shielding

Mating backplane for high speed, high density electrical connector

Surge protection module

Two-sided inductive charging coil

Circuit systems

Module having a shield film and method of manufacturing the same

Transient voltage protection device

Display module and manufacturing method therefor, and display device

Wiring board, electronic module, and electronic apparatus

Over-voltage circuit protection device

Sensor interposer employing castellated through-vias

Interconnect structure having conductor extending along dielectric...

Circuit board to which 3D formed electromagnetic shielding film is...

Electromagnetic wave shielding film and shielded printed wiring board

Power system and method for controlling power modules

Connection member and display device including same

Battery module printed circuit board assembly system and method

Low-loss transmission line structure comprising a dielectric layer...

Electronic component

Module

Module

Circuit board with rigid portion and flexible portion having connec...

Circuit board

Circuit board and manufacturing method thereof and electronic device

Heat removal architecture for stack-type component carrier with emb...

Electronic device

Patents Applicationslast 30 patents

CIRCUIT BOARD AND DISPLAY APPARATUS

MODULE-LEVEL THERMAL MANAGEMENT MECHANISM

Automotive Electronic Control Unit

CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE

SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY

ELECTRONIC DEVICE INCLUDING SHIELD CAN

STRUCTURES FOR REDUCING CROSSTALK INSIDE A SHIELDED DEVICE

DISPLAY MODULE AND DISPLAY DEVICE

STRETCHABLE DEVICE

Cable Impedance Matching Element and Display Device

CIRCUIT MODULE

SHIELD AND ELECTRONIC ASSEMBLY

ELECTRONIC DEVICE

TRANSMISSION LINE ASSEMBLY, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELE...

STORAGE ELEMENT ASSEMBLY AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

CONNECTION MEMBER AND DISPLAY DEVICE INCLUDING SAME

PACKAGE CAPABLE OF ELIMINATING BUBBLE FORMATION

WIRING BOARD AND SEMICONDUCTOR DEVICE

TECHNOLOGIES FOR AN ELECTROMAGNETIC INTERFERENCE SHIELD

ANTENNA-INTEGRATED RADIO PRODUCT AND METHOD FOR PRODUCING THE SAME

ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY

CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS

MECHANICAL MITIGATION OF NEUTRON SEE

DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...

RADIATION SHIELDING CONFORMAL COAT FOR PRINTED BOARD ASSEMBLY

ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD

COIL DEVICE AND PRINTED WIRING BOARD

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

MANUFACTURING METHOD OF CIRCUIT BOARD