Electrical connections formed on device or on substrate

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CPC
H01L2225/06524

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06524Electrical connections formed on device or on substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor device
- Patent number 12,327,818
- Issue date Jun 10, 2025
- TOHOKU-MICROTEC CO., LTD.
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric Stackup Structure for SoC package substrates
- Patent number 12,322,721
- Issue date Jun 3, 2025
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,844
- Issue date May 27, 2025
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and electronic system including the same
- Patent number 12,302,576
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Jeeyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and methods for forming the same
- Patent number 12,300,317
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Mingkang Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method
- Patent number 12,300,575
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PSPI-based patterning method for RDL
- Patent number 12,288,781
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,288,752
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symbiotic network on layers
- Patent number 12,283,572
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth package structure
- Patent number 12,278,166
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,261,151
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming three-dimensional memory devices
- Patent number 12,255,181
- Issue date Mar 18, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional circuit implementing machine trained network
- Patent number 12,248,869
- Issue date Mar 11, 2025
- Adeia Semiconductor Inc.
- Steven L. Teig
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 12,243,851
- Issue date Mar 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,218,102
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Youngkun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20250183208
- Publication date Jun 5, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250185237
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Changyoung Lee
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167178
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Youngkun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250157524
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Changyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE
- Publication number 20250151294
- Publication date May 8, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20250149512
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20250125196
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20250105181
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
- Publication number 20250104761
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250105216
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105116
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Publication number 20250105098
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...
- Publication number 20250096102
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096204
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING
- Publication number 20250079381
- Publication date Mar 6, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20250079405
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STOPPER LAYER AND ELECTRONIC SYSTEM...
- Publication number 20250072064
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Hyemi LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062283
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Seong Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062289
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054891
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SOURCE CONTACT
- Publication number 20250029972
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing warpage in a package of stacked integrated circuit dies
- Publication number 20250029948
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...
- Publication number 20250026920
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Minsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS
- Publication number 20250022775
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Shishir RAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...
- Publication number 20250022901
- Publication date Jan 16, 2025
- Hamamatsu Photonics K.K.
- Nao INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...
- Publication number 20250006251
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING

Electrical connections formed on device or on substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor device

Chip package and manufacturing method thereof

Wafer reconstitution and die-stitching

Asymmetric Stackup Structure for SoC package substrates

Semiconductor package using a coreless signal distribution structure

Semiconductor memory device

Package structure and manufacturing method thereof

Integrated circuit device and electronic system including the same

Three-dimensional memory device and methods for forming the same

Semiconductor package and method

Integrated circuit packages and methods of forming the same

PSPI-based patterning method for RDL

Semiconductor packages

Symbiotic network on layers

Integrated voltage regulator and passive components

High bandwidth package structure

Integrated circuit packages

Bond pads for semiconductor die assemblies and associated methods a...

Methods for forming three-dimensional memory devices

Three dimensional circuit implementing machine trained network

Devices, systems, and methods for stacked die packages

Offset pads over TSV

Semiconductor package and method for fabricating the same

Semiconductor package and related methods

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor package

TSV as pad

Oversized via as through-substrate-via (TSV) stop layer

Semiconductor device and manufacturing method thereof

Multi-die package structures including redistribution layers

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MEMORY DEVICE

WAFER RECONSTITUTION AND DIE-STITCHING

STORAGE DEVICE

SEMICONDUCTOR PACKAGE AND RELATED METHODS

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...

THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE INCLUDING STOPPER LAYER AND ELECTRONIC SYSTEM...

SEMICONDUCTOR PACKAGE

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUITS WITH CAPACITORS

THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SOURCE CONTACT

Reducing warpage in a package of stacked integrated circuit dies

LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...

3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC