Electrical connections formed on device or on substrate

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CPC
H01L2225/06524

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06524Electrical connections formed on device or on substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,368,122
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Jinhee Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding layer and process of making
- Patent number 12,362,304
- Issue date Jul 15, 2025
- Tokyo Electron Limited
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising semiconductor chip with stepped po...
- Patent number 12,362,318
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,261
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic chip stacking using a die with double-sided interconnect...
- Patent number 12,362,325
- Issue date Jul 15, 2025
- Intel Corporation
- Anup Pancholi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device using EMC wafer support system and fabricating...
- Patent number 12,362,343
- Issue date Jul 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete three-dimensional processor
- Patent number 12,355,023
- Issue date Jul 8, 2025
- Hong Kong HaiCun Technology Co., Limited
- Guobiao Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal routing between memory die and logic die for performing oper...
- Patent number 12,354,649
- Issue date Jul 8, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 12,354,980
- Issue date Jul 8, 2025
- Samsung Electronics Co., Ltd.
- Boin Noh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-underfill encapsulation for packaging and methods of forming t...
- Patent number 12,347,758
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jing-Ye Juang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,341,131
- Issue date Jun 24, 2025
- Samsung Electronics Co., Ltd.
- Hyunmog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,334,424
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device
- Patent number 12,327,818
- Issue date Jun 10, 2025
- TOHOKU-MICROTEC CO., LTD.
- Makoto Motoyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Asymmetric Stackup Structure for SoC package substrates
- Patent number 12,322,721
- Issue date Jun 3, 2025
- Apple Inc.
- Yikang Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 12,322,731
- Issue date Jun 3, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 12,315,844
- Issue date May 27, 2025
- Kioxia Corporation
- Tomoya Sanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and electronic system including the same
- Patent number 12,302,576
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Jeeyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and methods for forming the same
- Patent number 12,300,317
- Issue date May 13, 2025
- Yangtze Memory Technologies Co., Ltd.
- Mingkang Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package and method
- Patent number 12,300,575
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,293,985
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PSPI-based patterning method for RDL
- Patent number 12,288,781
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,288,752
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symbiotic network on layers
- Patent number 12,283,572
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth package structure
- Patent number 12,278,166
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Haklay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 12,261,151
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for semiconductor die assemblies and associated methods a...
- Patent number 12,255,163
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250239536
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239554
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250239278
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Kohji Kanamori
- G11 - INFORMATION STORAGE
Information Patent Application
Discrete Three-Dimensional Processor
- Publication number 20250239580
- Publication date Jul 24, 2025
- ShenZhen CunDi Technology Co., Ltd.
- Guobiao ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250233112
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- HsiaoYun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226283
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Wooseup HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...
- Publication number 20250218990
- Publication date Jul 3, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC S...
- Publication number 20250218470
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Haemin LEE
- G11 - INFORMATION STORAGE
Information Patent Application
LEADFRAME WITH RETAINING FEATURES
- Publication number 20250218907
- Publication date Jul 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jefferson LUGUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250210594
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Soohwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250210571
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
- Publication number 20250183208
- Publication date Jun 5, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250185237
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Changyoung Lee
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167178
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Youngkun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20250157524
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Changyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE
- Publication number 20250151294
- Publication date May 8, 2025
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Shunpei YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20250149512
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE
- Publication number 20250125196
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20250105181
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
- Publication number 20250104761
- Publication date Mar 27, 2025
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250105216
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105116
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Publication number 20250105098
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...
- Publication number 20250096102
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kazuma HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096204
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING
- Publication number 20250079381
- Publication date Mar 6, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20250079405
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STOPPER LAYER AND ELECTRONIC SYSTEM...
- Publication number 20250072064
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Hyemi LEE
- G11 - INFORMATION STORAGE

Electrical connections formed on device or on substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Bonding layer and process of making

Semiconductor package comprising semiconductor chip with stepped po...

Semiconductor device and method of manufacture

Monolithic chip stacking using a die with double-sided interconnect...

Semiconductor device using EMC wafer support system and fabricating...

Discrete three-dimensional processor

Signal routing between memory die and logic die for performing oper...

Semiconductor package

Dual-underfill encapsulation for packaging and methods of forming t...

Semiconductor package

Package structure and manufacturing method thereof

Stacked semiconductor device

Chip package and manufacturing method thereof

Wafer reconstitution and die-stitching

Asymmetric Stackup Structure for SoC package substrates

Semiconductor package using a coreless signal distribution structure

Semiconductor memory device

Package structure and manufacturing method thereof

Integrated circuit device and electronic system including the same

Three-dimensional memory device and methods for forming the same

Semiconductor package and method

Integrated circuit packages and methods of forming the same

PSPI-based patterning method for RDL

Semiconductor packages

Symbiotic network on layers

Integrated voltage regulator and passive components

High bandwidth package structure

Integrated circuit packages

Bond pads for semiconductor die assemblies and associated methods a...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

MEMORY DEVICE

Discrete Three-Dimensional Processor

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

BOND PADS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIATED METHODS A...

THREE-DIMENSIONAL (3D) SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC S...

LEADFRAME WITH RETAINING FEATURES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MEMORY DEVICE

WAFER RECONSTITUTION AND DIE-STITCHING

STORAGE DEVICE

SEMICONDUCTOR PACKAGE AND RELATED METHODS

MICROELECTRONIC ASSEMBLY FROM PROCESSED SUBSTRATE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

SEMICONDUCTOR STORAGE DEVICE AND METHOD OF HEATING SEMICONDUCTOR ST...

THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE INCLUDING STOPPER LAYER AND ELECTRONIC SYSTEM...