Electrical connections formed on device or on substrate

Industry

CPC
H01L2225/06524

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06524Electrical connections formed on device or on substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Devices, systems, and methods for stacked die packages
- Patent number 12,243,850
- Issue date Mar 4, 2025
- Flex Ltd.
- Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset pads over TSV
- Patent number 12,243,851
- Issue date Mar 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Bongsub Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,237,253
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jun Hyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and related methods
- Patent number 12,230,606
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,218,092
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Moonyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,218,102
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Youngkun Jee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,205,875
- Issue date Jan 21, 2025
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of three-dimensional stacking structure
- Patent number 12,191,283
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,664
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including stopper layer and electronic system...
- Patent number 12,176,389
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Hyemi Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Dicing die attach film, and semiconductor package using the same an...
- Patent number 12,176,314
- Issue date Dec 24, 2024
- Furukawa Electric Co., Ltd.
- Minoru Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,170,259
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Ju Bin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,159,856
- Issue date Dec 3, 2024
- Kioxia Corporation
- Satoshi Tsukiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,148,735
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional bonding scheme and associated systems and methods
- Patent number 12,148,736
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,142,544
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Taehwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interposer in which one or more die...
- Patent number 12,136,597
- Issue date Nov 5, 2024
- Mediatek Inc.
- Yi-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with backside source contact
- Patent number 12,136,618
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating passive devices in package structures
- Patent number 12,132,029
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test bumps
- Patent number 12,125,753
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Taehyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extendable inner lead for leaded package
- Patent number 12,125,780
- Issue date Oct 22, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING
- Publication number 20250079381
- Publication date Mar 6, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20250079405
- Publication date Mar 6, 2025
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STOPPER LAYER AND ELECTRONIC SYSTEM...
- Publication number 20250072064
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Hyemi LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062283
- Publication date Feb 20, 2025
- SK HYNIX INC.
- Seong Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062289
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250054891
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Ju Bin SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SOURCE CONTACT
- Publication number 20250029972
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Kun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing warpage in a package of stacked integrated circuit dies
- Publication number 20250029948
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...
- Publication number 20250026920
- Publication date Jan 23, 2025
- SK HYNIX INC.
- Minsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS
- Publication number 20250022775
- Publication date Jan 16, 2025
- Murata Manufacturing Co., Ltd.
- Shishir RAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...
- Publication number 20250022901
- Publication date Jan 16, 2025
- Hamamatsu Photonics K.K.
- Nao INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...
- Publication number 20250006251
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICES INCLUDING CONTROL LOGIC REGIONS
- Publication number 20240413145
- Publication date Dec 12, 2024
- Micron Technology, Inc.
- Aaron S. Yip
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395791
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387417
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20240387465
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387466
- Publication date Nov 21, 2024
- SOCIONEXT INC.
- Hirotaka TAKENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387454
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF
- Publication number 20240379369
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qingyi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240379439
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379627
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES INCLUDING SOURCE STRUCTURES OVER STACK STRUCTURES, A...
- Publication number 20240371834
- Publication date Nov 7, 2024
- Lodestar Licensing Group LLC
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240371763
- Publication date Nov 7, 2024
- KIOXIA Corporation
- Shinya Arai
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
- Publication number 20240332255
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- HYUEKJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240324193
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- MinKyung KIM
- H01 - BASIC ELECTRIC ELEMENTS

Electrical connections formed on device or on substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Devices, systems, and methods for stacked die packages

Offset pads over TSV

Semiconductor package and method for fabricating the same

Semiconductor package and related methods

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor package

TSV as pad

Oversized via as through-substrate-via (TSV) stop layer

Semiconductor device and manufacturing method thereof

Multi-die package structures including redistribution layers

Semiconductor device, semiconductor package and method of manufactu...

Manufacturing method of three-dimensional stacking structure

Semiconductor package

Semiconductor device including stopper layer and electronic system...

Dicing die attach film, and semiconductor package using the same an...

Semiconductor package and method of fabricating the same

Integrated circuit packages and methods of forming the same

Signal routing between memory die and logic die

Manufacturing method of package

Method for manufacturing semiconductor device

Semiconductor device and method having a through substrate via and...

Memory device and manufacturing method thereof

Three-dimensional bonding scheme and associated systems and methods

Semiconductor package

Semiconductor package having an interposer in which one or more die...

Three-dimensional memory device with backside source contact

Bonding apparatus and bonding method

Integrating passive devices in package structures

Semiconductor package including test bumps

Extendable inner lead for leaded package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING

THREE-DIMENSIONAL BONDING SCHEME AND ASSOCIATED SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE INCLUDING STOPPER LAYER AND ELECTRONIC SYSTEM...

SEMICONDUCTOR PACKAGE

PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUITS WITH CAPACITORS

THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SOURCE CONTACT

Reducing warpage in a package of stacked integrated circuit dies

LIQUID EPOXY RESIN COMPOSITION FOR USE AS MOLD UNDERFILL MATERIAL F...

3-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND CIRCUITS

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMI...

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

MEMORY DEVICES INCLUDING CONTROL LOGIC REGIONS

Multi-Die Package Structures Including Redistribution Layers

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME

Semiconductor Package and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MEMORY DEVICES INCLUDING SOURCE STRUCTURES OVER STACK STRUCTURES, A...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE