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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/03464
Electroless plating
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last 30 patents
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Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pad for semiconductor device
Patent number
11,901,320
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-metal contact structure
Patent number
11,894,326
Issue date
Feb 6, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
Patent number
11,881,476
Issue date
Jan 23, 2024
Semtech Corporation
Changjun Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,876,062
Issue date
Jan 16, 2024
Mitsubishi Electric Corporation
Tsuyoshi Osaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer-level package including under bump metal layer
Patent number
11,862,589
Issue date
Jan 2, 2024
Samsung Electronics Co., Ltd.
Hyung Sun Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Connector structure and method of forming same
Patent number
11,824,026
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chen-Shien Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure including buffer layer
Patent number
11,810,879
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Wafer-level package including under bump metal layer
Patent number
11,810,878
Issue date
Nov 7, 2023
Samsung Electronics Co., Ltd.
Hyung Sun Jang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and semiconductor package
Patent number
11,791,286
Issue date
Oct 17, 2023
Samsung Electronics Co., Ltd.
Youn-ji Min
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,791,243
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal pad modification
Patent number
11,756,911
Issue date
Sep 12, 2023
International Business Machines Corporation
Krishna Tunga
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor devices, semiconductor packages, and methods of manuf...
Patent number
11,728,297
Issue date
Aug 15, 2023
Samsung Electronics Co., Ltd.
Ju-il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for semiconductor packaging
Patent number
11,705,414
Issue date
Jul 18, 2023
Texas Instruments Incorporated
Sreenivasan K. Koduri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of making wafer level chip scale pa...
Patent number
11,676,938
Issue date
Jun 13, 2023
JCET Semiconductor (Shaoxing) Co., Ltd.
Ming-Che Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder joints on nickel surface finishes without gold plating
Patent number
11,676,926
Issue date
Jun 13, 2023
Schlumberger Technology Corporation
Mark Alex Kostinovsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package with double-sided molding
Patent number
11,670,618
Issue date
Jun 6, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,652,072
Issue date
May 16, 2023
Renesas Electronics Corporation
Takashi Tonegawa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of forming embedded die substrate,...
Patent number
11,652,088
Issue date
May 16, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and power amplifier module
Patent number
11,621,678
Issue date
Apr 4, 2023
Murata Manufacturing Co., Ltd.
Isao Obu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor structure and method
Patent number
11,587,910
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pad for semiconductor device
Patent number
11,527,502
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die-on-interposer assembly with dam structure and method of manufac...
Patent number
11,488,882
Issue date
Nov 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-die package with bridge layer
Patent number
11,476,125
Issue date
Oct 18, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei Sen Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing a redistribution layer, redistribution laye...
Patent number
11,469,194
Issue date
Oct 11, 2022
STMicroelectronics S.r.l.
Paolo Colpani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
11,462,458
Issue date
Oct 4, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,456,265
Issue date
Sep 27, 2022
Renesas Electronics Corporation
Takashi Tonegawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating package structure
Patent number
11,450,641
Issue date
Sep 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,444,020
Issue date
Sep 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding structures of semiconductor devices
Patent number
11,444,045
Issue date
Sep 13, 2022
GLOBALFOUNDRIES Singapore Pte. Ltd.
Ramasamy Chockalingam
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
Publication number
20240128215
Publication date
Apr 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Takashi NOMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE
Publication number
20240120300
Publication date
Apr 11, 2024
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTOR AND METHOD FOR FORMING THE SAME
Publication number
20240021549
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240006354
Publication date
Jan 4, 2024
RENESAS ELECTRONICS CORPORATION
Shota OKABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230411323
Publication date
Dec 21, 2023
RENESAS ELECTRONICS CORPORATION
Etsuko WATANABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
Publication number
20230387051
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Manufacture
Publication number
20230369170
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufaturing Co., Ltd.
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20230352371
Publication date
Nov 2, 2023
Rohm Co., Ltd.
Yuki NAKANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
Publication number
20230343668
Publication date
Oct 26, 2023
UTAC Headquarters Pte. Ltd.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTOR...
Publication number
20230340686
Publication date
Oct 26, 2023
LAM RESEARCH CORPORATION
Steven T. Mayer
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
Publication number
20230343734
Publication date
Oct 26, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka UZOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
Publication number
20230317649
Publication date
Oct 5, 2023
Fuji Electric Co., Ltd.
Masahide GOTOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING
Publication number
20230299027
Publication date
Sep 21, 2023
TEXAS INSTRUMENTS INCORPORATED
Sreenivasan K. KODURI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Shifting Contact Pad for Reducing Stress
Publication number
20230275047
Publication date
Aug 31, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chun-Jen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Structure and Method
Publication number
20230207530
Publication date
Jun 29, 2023
Taiwan Semiconductor Manufacturing Co, LTD.
Szu-Ying Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT
Publication number
20230103655
Publication date
Apr 6, 2023
Rohm Co., Ltd.
Yuki NAKANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
Publication number
20230005848
Publication date
Jan 5, 2023
STMicroelectronics S.r.l.
Paolo COLPANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20220399291
Publication date
Dec 15, 2022
Mitsubishi Electric Corporation
Tsuyoshi OSAGA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ELECTRICAL CONTACT STRUCTURES AND RELATED MET...
Publication number
20220384204
Publication date
Dec 1, 2022
Semiconductor Components Industries, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Manufacture
Publication number
20220367322
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
Publication number
20220302060
Publication date
Sep 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Anhao CHENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure and Method of Forming a Joint Assembly
Publication number
20220302069
Publication date
Sep 22, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Ying-Ju Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
Publication number
20220238466
Publication date
Jul 28, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Yu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TIN PLATING BATH AND A METHOD FOR DEPOSITING TIN OR TIN ALLOY ONTO...
Publication number
20220220617
Publication date
Jul 14, 2022
Atotech Deutschland GmbH
Kadir TUNA
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
Publication number
20220059489
Publication date
Feb 24, 2022
SCHLUMBERGER TECHNOLOGY CORPORATION
Mark Alex Kostinovsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURES OF SEMICONDUCTOR DEVICES
Publication number
20220052000
Publication date
Feb 17, 2022
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
RAMASAMY CHOCKALINGAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
Publication number
20220028812
Publication date
Jan 27, 2022
Semiconductor Components Industries, LLC
Michael J. SEDDON
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
Publication number
20210384144
Publication date
Dec 9, 2021
Samsung Electronics Co., Ltd.
Youn-ji MIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL PACKAGE INCLUDING UNDER BUMP METAL LAYER
Publication number
20210358874
Publication date
Nov 18, 2021
Samsung Electronics Co., Ltd.
Hyung Sun JANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-METAL CONTACT STRUCTURE
Publication number
20210335737
Publication date
Oct 28, 2021
INVENSAS BONDING TECHNOLOGIES, INC.
Rajesh KATKAR
H01 - BASIC ELECTRIC ELEMENTS