Membership
Tour
Register
Log in
Electromagnetic shielding
Follow
Industry
CPC
H01L2924/3025
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
Current Industry
H01L2924/3025
Electromagnetic shielding
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Multiple conductive posts
Patent number
11,973,043
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chih-Hsien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
Patent number
11,967,562
Issue date
Apr 23, 2024
Infineon Technologies AG
Horst Theuss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
Patent number
11,967,567
Issue date
Apr 23, 2024
Amkor Technology Singapore Holding Pte Ltd.
Doo Soub Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic device assemblies and packages including multiple d...
Patent number
11,961,825
Issue date
Apr 16, 2024
Micron Technology, Inc.
Aparna U. Limaye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Regulator circuit package techniques
Patent number
11,955,437
Issue date
Apr 9, 2024
Analog Devices International Unlimited Company
Leonard Shtargot
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming stacked semiconductors die assemblies
Patent number
11,948,921
Issue date
Apr 2, 2024
Randon K. Richards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
Patent number
11,932,933
Issue date
Mar 19, 2024
STATS ChipPAC Pte. Ltd.
OhHan Kim
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor package with an antenna substrate
Patent number
11,935,849
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Myungsam Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including sheilding cover that covers molded...
Patent number
11,923,319
Issue date
Mar 5, 2024
Samsung Electronics Co., Ltd.
Young-Woo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,923,230
Issue date
Mar 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
3D semiconductor device and structure with memory
Patent number
11,901,210
Issue date
Feb 13, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including electromagnetic interference (EMI) s...
Patent number
11,901,307
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Po-Yao Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,901,332
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Yeong Beom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with integrated heat distribution and manufact...
Patent number
11,901,343
Issue date
Feb 13, 2024
Amkor Technology Singapore Holding Pte Ltd.
Bora Baloglu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out semiconductor package
Patent number
11,894,310
Issue date
Feb 6, 2024
Samsung Electronics Co., Ltd.
Myung Sam Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated voltage regulator and passive components
Patent number
11,894,345
Issue date
Feb 6, 2024
Adeia Semiconductor Inc.
Javier A. Delacruz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reduction in susceptibility of analog integrated circuits and senso...
Patent number
11,887,937
Issue date
Jan 30, 2024
ams International AG
Benjamin Joseph Sheahan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device
Patent number
11,873,435
Issue date
Jan 16, 2024
CITIZEN ELECTRONICS CO., LTD.
Byungchul Hong
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
3D semiconductor device and structure with single-crystal layers
Patent number
11,876,011
Issue date
Jan 16, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Chip stacking and packaging structure
Patent number
11,876,037
Issue date
Jan 16, 2024
HOSIN GLOBAL ELECTRONICS CO., LTD
Chen-Nan Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of stacking devices using support f...
Patent number
11,869,848
Issue date
Jan 9, 2024
STATS ChipPAC Pte. Ltd.
GunHyuck Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fluid-cooled package having shielding layer
Patent number
11,862,533
Issue date
Jan 2, 2024
Infineon Technologies AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a 3D semiconductor device and structure with m...
Patent number
11,862,503
Issue date
Jan 2, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and measurement device
Patent number
11,854,952
Issue date
Dec 26, 2023
Lapis Semiconductor Co., Ltd.
Toshihisa Sone
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having EMI shielding structure and related met...
Patent number
11,855,000
Issue date
Dec 26, 2023
Amkor Technology Singapore Holding Pte Ltd.
Young Woo Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing a 3D semiconductor device and structure with...
Patent number
11,854,857
Issue date
Dec 26, 2023
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with sealed semiconductor chip
Patent number
11,854,946
Issue date
Dec 26, 2023
Kioxia Corporation
Isao Ozawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method
Patent number
11,848,288
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Tzu-Sung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
Patent number
11,842,991
Issue date
Dec 12, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
Publication number
20240145402
Publication date
May 2, 2024
CYPRESS SEMICONDUCTOR CORPORATION
Mark PAVIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
Publication number
20240128193
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Pao-Nan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240120288
Publication date
Apr 11, 2024
Advanced Semiconductor Engineering, Inc.
Chih-Hsin LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
Publication number
20240120289
Publication date
Apr 11, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20240120332
Publication date
Apr 11, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
Publication number
20240114794
Publication date
Apr 4, 2024
Skyworks Solutions, Inc.
Hardik Bhupendra MODI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DEVICE
Publication number
20240101899
Publication date
Mar 28, 2024
Citizen Electronics Co., Ltd.
Byungchul HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPRESSIBLE FOAMED THERMAL INTERFACE MATERIALS AND METHODS OF MAKI...
Publication number
20240105663
Publication date
Mar 28, 2024
Laird Technologies, Inc.
Vijayaraghavan RAJAGOPAL
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
Publication number
20240105565
Publication date
Mar 28, 2024
LAPIS SEMICONDUCTOR CO., LTD.
Toshihisa SONE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...
Publication number
20240096817
Publication date
Mar 21, 2024
QUALCOMM Incorporated
Ranadeep DUTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Stacking Devices Using Support F...
Publication number
20240088060
Publication date
Mar 14, 2024
STATS ChipPAC Pte Ltd.
GunHyuck Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PACKAGE WITH SEALED DIE ENCLOSURES
Publication number
20240088081
Publication date
Mar 14, 2024
QUALCOMM Incorporated
Bart KASSTEEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING LAYE...
Publication number
20240088057
Publication date
Mar 14, 2024
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING EMI SHIELDING STRUCTURE AND RELATED MET...
Publication number
20240088059
Publication date
Mar 14, 2024
Amkor Technology Singapore Holding Pte. Ltd
Young Woo LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
Publication number
20240088068
Publication date
Mar 14, 2024
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Tunable Fingertip Capacitors with Enhanced Shielding in Ceramic Pac...
Publication number
20240072025
Publication date
Feb 29, 2024
TEXAS INSTRUMENTS INCORPORATED
Rajen M. Murugan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Package with Double-Side...
Publication number
20240063196
Publication date
Feb 22, 2024
STATS ChipPAC Pte Ltd.
TaeKeun Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240063145
Publication date
Feb 22, 2024
Amkor Technology Singapore Holding Pte. Ltd
Tae Ki KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE HAVING FOUR SIDES PROVIDED WITH ELECTROMAGNETIC INTERF...
Publication number
20240063138
Publication date
Feb 22, 2024
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Partial EMI Shielding
Publication number
20240063137
Publication date
Feb 22, 2024
STATS ChipPAC Pte Ltd.
JinHee Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
Publication number
20240055366
Publication date
Feb 15, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240047852
Publication date
Feb 8, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Kyoung Yeon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240047374
Publication date
Feb 8, 2024
SILICONWARE PRECISION INDUSTRIES CO., LTD.
Chih-Hsien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
Publication number
20240047376
Publication date
Feb 8, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES
Publication number
20240038679
Publication date
Feb 1, 2024
Advanced Semiconductor Engineering, Inc.
Pao-Nan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SMALLER MODULE BY STACKING
Publication number
20240038743
Publication date
Feb 1, 2024
Dingyou Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240030089
Publication date
Jan 25, 2024
Samsung Electronics Co., Ltd.
Eunseok CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-COMPONENT MODULES (MCMs) INCLUDING CONFIGURABLE ELECTROMAGNET...
Publication number
20240021538
Publication date
Jan 18, 2024
QUALCOMM Incorporated
Jay Scott Salmon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND MANUFACTURING METHOD
Publication number
20240014188
Publication date
Jan 11, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Xiaofei SUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240014146
Publication date
Jan 11, 2024
KIOXIA Corporation
Akihito Sawanobori
H01 - BASIC ELECTRIC ELEMENTS