Electromagnetic shielding

Industry

CPC
H01L2225/06537

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06537Electromagnetic shielding

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 12,131,997
- Issue date Oct 29, 2024
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating passive devices in package structures
- Patent number 12,132,029
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable quantum processor design
- Patent number 12,086,689
- Issue date Sep 10, 2024
- Google LLC
- Julian Shaw Kelly
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,057,434
- Issue date Aug 6, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EM and RF mitigation silicon structures in stacked die microprocess...
- Patent number 12,057,433
- Issue date Aug 6, 2024
- Intel Corporation
- Sameer Shekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,033,946
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including multiple d...
- Patent number 11,961,825
- Issue date Apr 16, 2024
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming stacked semiconductors die assemblies
- Patent number 11,948,921
- Issue date Apr 2, 2024
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including sheilding cover that covers molded...
- Patent number 11,923,319
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,837
- Issue date Feb 20, 2024
- Kioxia Corporation
- Soichiro Ibaraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 11,894,345
- Issue date Feb 6, 2024
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material paste and semiconductor package
- Patent number 11,876,031
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package and semiconductor package
- Patent number 11,791,321
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Tae-Young Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack assembly for radio-frequency applications
- Patent number 11,785,853
- Issue date Oct 10, 2023
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including conductive bumps to improve EMI/RFI...
- Patent number 11,784,135
- Issue date Oct 10, 2023
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,749,646
- Issue date Sep 5, 2023
- Kioxia Corporation
- Akihito Sawanobori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tank circuit structure and method of making the same
- Patent number 11,699,656
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module and communication apparatus
- Patent number 11,637,091
- Issue date Apr 25, 2023
- Murata Manufacturing Co., Ltd.
- Sho Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,594,519
- Issue date Feb 28, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Naruhiro Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,527,487
- Issue date Dec 13, 2022
- LUXSHARE ELECTRONIC TECHNOLOGY (KUNSHAN) LTD.
- Xiaolei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 11,515,291
- Issue date Nov 29, 2022
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,488,934
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 11,476,208
- Issue date Oct 18, 2022
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages and related methods
- Patent number 11,456,284
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages and related methods...
- Patent number 11,410,973
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device assemblies and packages including surface mo...
- Patent number 11,393,794
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module and communication apparatus
- Patent number 11,393,796
- Issue date Jul 19, 2022
- Murata Manufacturing Co., Ltd.
- Sho Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,387,216
- Issue date Jul 12, 2022
- SK hynix Inc.
- Jin Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency module and communication apparatus
- Patent number 11,380,654
- Issue date Jul 5, 2022
- Murata Manufacturing Co., Ltd.
- Sho Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395771
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...
- Publication number 20240355778
- Publication date Oct 24, 2024
- Intel Corporation
- Sameer SHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240355744
- Publication date Oct 24, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS
- Publication number 20240312957
- Publication date Sep 19, 2024
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Interposer
- Publication number 20240312916
- Publication date Sep 19, 2024
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND MET...
- Publication number 20240284683
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Jungmin Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240213177
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- YOUNG-WOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...
- Publication number 20240186295
- Publication date Jun 6, 2024
- Lodestar Licensing Group LLC
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
- Publication number 20240114794
- Publication date Apr 4, 2024
- Skyworks Solutions, Inc.
- Hardik Bhupendra MODI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240055366
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVELY FORMING A SHIELDING LAYER ON A SEMICONDUCTOR...
- Publication number 20230411305
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- SeongHwan PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395522
- Publication date Dec 7, 2023
- KIOXIA Corporation
- Makoto MINAMINAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION HARDENED SEMICONDUCTOR DEVICES AND PACKAGING
- Publication number 20230387079
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Chong Leong Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230361084
- Publication date Nov 9, 2023
- KIOXIA Corporation
- Akihito SAWANOBORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE C...
- Publication number 20230299044
- Publication date Sep 21, 2023
- Intel Corporation
- Andrew P. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230282616
- Publication date Sep 7, 2023
- KIOXIA Corporation
- Satoru ITAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230282617
- Publication date Sep 7, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHENG-JER YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS
- Publication number 20230090121
- Publication date Mar 23, 2023
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS
- Publication number 20230008292
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Randon K. Richards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI...
- Publication number 20220406726
- Publication date Dec 22, 2022
- Western Digital Technologies, Inc.
- Jiandi Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTIGUOUS SHIELD STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING H...
- Publication number 20220399305
- Publication date Dec 15, 2022
- Intel Corporation
- Beomseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...
- Publication number 20220375902
- Publication date Nov 24, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20220375901
- Publication date Nov 24, 2022
- KIOXIA Corporation
- Susumu YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220302083
- Publication date Sep 22, 2022
- KIOXIA Corporation
- Soichiro IBARAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...
- Publication number 20220302090
- Publication date Sep 22, 2022
- Micron Technology, Inc.
- Aparna U. Limaye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20220285277
- Publication date Sep 8, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS
- Publication number 20220278080
- Publication date Sep 1, 2022
- Murata Manufacturing Co., Ltd.
- Sho MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
- Publication number 20220157795
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- TAE-YOUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating Passive Devices in Package Structures
- Publication number 20220139885
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS

Electromagnetic shielding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages

Integrating passive devices in package structures

Scalable quantum processor design

Semiconductor package and manufacturing method thereof

EM and RF mitigation silicon structures in stacked die microprocess...

Semiconductor devices and methods of manufacturing semiconductor de...

Microelectronic device assemblies and packages including multiple d...

Methods of forming stacked semiconductors die assemblies

Semiconductor package including sheilding cover that covers molded...

Semiconductor device

Integrated voltage regulator and passive components

Thermal interface material paste and semiconductor package

Method of fabricating semiconductor package and semiconductor package

Stack assembly for radio-frequency applications

Semiconductor device including conductive bumps to improve EMI/RFI...

Semiconductor package and manufacturing method thereof

Tank circuit structure and method of making the same

System-in-package with double-sided molding

Radio-frequency module and communication apparatus

Semiconductor device

Package structure and method of manufacturing the same

Integrated voltage regulator and passive components

Semiconductor package and manufacturing method thereof

Grounding techniques for backside-biased semiconductor dice and rel...

Microelectronic device assemblies and packages and related methods

Microelectronic device assemblies and packages and related methods...

Microelectronic device assemblies and packages including surface mo...

Radio-frequency module and communication apparatus

Semiconductor memory device

Radio-frequency module and communication apparatus

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS

Semiconductor Device Package with Die Stackup and Interposer

NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND MET...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

MICROELECTRONIC DEVICE ASSEMBLIES, STACKED SEMICONDUCTOR DIE ASSEMB...

DEVICES AND METHODS RELATED TO STACK ASSEMBLY

SPACER FOR CHIPS ON WAFER SEMICONDUCTOR DEVICE ASSEMBLIES

METHOD FOR SELECTIVELY FORMING A SHIELDING LAYER ON A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

RADIATION HARDENED SEMICONDUCTOR DEVICES AND PACKAGING

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PASSIVE ELECTRICAL COMPONENTS IN MOLD METAL LAYERS OF A MULTI-DIE C...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE

INTEGRATED VOLTAGE REGULATOR AND PASSIVE COMPONENTS

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE BUMPS TO IMPROVE EMI/RFI...

CONTIGUOUS SHIELD STRUCTURES IN MICROELECTRONIC ASSEMBLIES HAVING H...

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES AND RELATED METHODS...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE

MICROELECTRONIC DEVICE ASSEMBLIES AND PACKAGES INCLUDING MULTIPLE D...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

RADIO-FREQUENCY MODULE AND COMMUNICATION APPARATUS

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Integrating Passive Devices in Package Structures