Electrostatic control

Industry

CPC
H01J37/32697

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Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32697Electrostatic control

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma processing apparatus
- Patent number 12,191,121
- Issue date Jan 7, 2025
- HITACHI HIGH-TECH CORPORATION
- Kazuyuki Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for controlling ion energy distribution
- Patent number 12,183,557
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Linying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum deposition into trenches and vias and etch of trenches and via
- Patent number 12,170,185
- Issue date Dec 17, 2024
- Ascentool, Inc.
- George Xinsheng Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck
- Patent number 12,170,219
- Issue date Dec 17, 2024
- Kyocera Corporation
- Naoki Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single chamber flowable film formation and treatments
- Patent number 12,142,459
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electron bias control signals for electron enhanced material proces...
- Patent number 12,125,686
- Issue date Oct 22, 2024
- VELVETCH, LLC
- Stewart Francis Sando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic processing chamber baffle
- Patent number 12,119,209
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Udit S. Kotagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus having a middle electrode
- Patent number 12,106,977
- Issue date Oct 1, 2024
- SK hynix Inc.
- Jin Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for dechucking wafer in the...
- Patent number 12,106,942
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Yi Rop Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bipolar electrostatic chuck to limit DC discharge
- Patent number 12,057,339
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron bias control signals for electron enhanced material proces...
- Patent number 12,027,348
- Issue date Jul 2, 2024
- VELVETCH LLC
- Stewart Francis Sando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor manufacturing apparatus and method for man...
- Patent number 12,009,245
- Issue date Jun 11, 2024
- NGK Insulators, Ltd.
- Masaki Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable mode plasma chamber utilizing tunable plasma potential
- Patent number 12,002,652
- Issue date Jun 4, 2024
- Mattson Technology, Inc.
- Stephen E. Savas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer de-chucking detection and arcing prevention
- Patent number 12,002,702
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- Ganesh Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power electrostatic chuck design with radio frequency coupling
- Patent number 11,948,826
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Jaeyong Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatically clamped edge ring
- Patent number 11,935,776
- Issue date Mar 19, 2024
- Lam Research Corporation
- Christopher Kimball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support with real time force and film stress control
- Patent number 11,915,913
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Wendell Glenn Boyd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for manipulating power at an edge ring in pla...
- Patent number 11,908,661
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Linying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing substrate
- Patent number 11,894,219
- Issue date Feb 6, 2024
- Semes Co., Ltd.
- Je Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron bias control signals for electron enhanced material proces...
- Patent number 11,887,823
- Issue date Jan 30, 2024
- VELVETCH LLC
- Stewart Francis Sando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 11,875,977
- Issue date Jan 16, 2024
- Tokyo Electron Limited
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 11,869,748
- Issue date Jan 9, 2024
- Kokusai Electric Corporation
- Takeshi Yasui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mesa height modulation for thickness correction
- Patent number 11,869,795
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Saketh Pemmasani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and charge neutralization method for...
- Patent number 11,862,439
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- Takahiro Kawawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor processing equipment including electrostatic chuck fo...
- Patent number 11,862,440
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Jeongil Mun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck
- Patent number 11,842,915
- Issue date Dec 12, 2023
- Kyocera Corporation
- Naoki Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck for use in semiconductor processing
- Patent number 11,817,341
- Issue date Nov 14, 2023
- Lam Research Corporation
- Troy Alan Gomm
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for controlling ion energy distribution
- Patent number 11,798,790
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Linying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support
- Patent number 11,791,139
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Shin Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for avoiding electrical breakdown from RF t...
- Patent number 11,784,027
- Issue date Oct 10, 2023
- Lam Research Corporation
- Hyungjoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE
- Publication number 20250029818
- Publication date Jan 23, 2025
- Hitachi High-Tech Corporation
- Andre AMEND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGE
- Publication number 20250014934
- Publication date Jan 9, 2025
- Applied Materials, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250014872
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250006471
- Publication date Jan 2, 2025
- Tokyo Electron Limited
- Takamichi KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE
- Publication number 20240429070
- Publication date Dec 26, 2024
- SK HYNIX INC.
- Jin Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING
- Publication number 20240395509
- Publication date Nov 28, 2024
- TOKYO ELECTRON LIMITED
- Chishio KOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCHER UNIFORMITY CONTROL BY TUNING EDGE ZONE PLASMA SHEATH
- Publication number 20240387152
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Lung HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATION
- Publication number 20240387148
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Che Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE DE-CHUCKING VOLTAGE
- Publication number 20240363315
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Andrew NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON BIAS CONTROL SIGNALS FOR ELECTRON ENHANCED MATERIAL PROCES...
- Publication number 20240321561
- Publication date Sep 26, 2024
- VELVETCH LLC
- Stewart Francis Sando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Variable Mode Plasma Chamber Utilizing Tunable Plasma Potential
- Publication number 20240297019
- Publication date Sep 5, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Stephen E. Savas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTORTION OF PULSES FOR WAFER BIASING
- Publication number 20240266153
- Publication date Aug 8, 2024
- LAM RESEARCH CORPORATION
- Karl Frederick Leeser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT WITH REAL TIME FORCE AND FILM STRESS CONTROL
- Publication number 20240258075
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Wendell Glenn BOYD
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Publication number 20240222095
- Publication date Jul 4, 2024
- TOKYO ELECTRON LIMITED
- Takashi YAMAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE
- Publication number 20240212995
- Publication date Jun 27, 2024
- SEMES CO., LTD.
- Yoon Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON BIAS CONTROL SIGNALS FOR ELECTRON ENHANCED MATERIAL PROCES...
- Publication number 20240128060
- Publication date Apr 18, 2024
- VELVETCH LLC
- Stewart Francis Sando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Publication number 20240112895
- Publication date Apr 4, 2024
- TOKYO ELECTRON LIMITED
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Processing Apparatus and Method of Manufacturing Semicond...
- Publication number 20240096597
- Publication date Mar 21, 2024
- Kokusai Electric Corporation
- Takeshi YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE
- Publication number 20240087854
- Publication date Mar 14, 2024
- PSK INC.
- Kwang Sung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE
- Publication number 20240079216
- Publication date Mar 7, 2024
- PSK INC.
- KWANG SUNG YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK
- Publication number 20240063046
- Publication date Feb 22, 2024
- Kyocera Corporation
- Naoki FURUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION BEAM SOURCE, SUBSTRATE PROCESS APPARATUS INCLUDING THE SAME, AN...
- Publication number 20240062996
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- SeungWan YOO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DEPOSITING SILICON NITRIDE FILM, APPARATUS FOR DEPOSITING...
- Publication number 20240055239
- Publication date Feb 15, 2024
- Ulvac, Inc.
- Yuta Ando
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROSTATIC CHUCK FOR USE IN SEMICONDUCTOR PROCESSING
- Publication number 20240038568
- Publication date Feb 1, 2024
- LAM RESEARCH CORPORATION
- Troy Alan Gomm
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
VACUUM DEPOSITION INTO TRENCHES AND VIAS AND ETCH OF TRENCHES AND VIA
- Publication number 20240021411
- Publication date Jan 18, 2024
- Ascentool, Inc.
- George Xinsheng Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMPROVED PLASMA RESISTANT COATINGS FOR ELECTROSTATIC CHUCKS
- Publication number 20240006216
- Publication date Jan 4, 2024
- OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKON
- Matthew Paul KIRK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CO-DOPING TO CONTROL WET ETCH RATE OF FCVD OXIDE LAYERS
- Publication number 20240006158
- Publication date Jan 4, 2024
- Applied Materials, Inc.
- Vikram M. Bhosle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOL FOR PREVENTING OR SUPPRESSING ARCING
- Publication number 20230416922
- Publication date Dec 28, 2023
- LAM RESEARCH CORPORATION
- Yukinori SAKIYAMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS AND METHODS FOR CONTROLLING ION ENERGY DISTRIBUTION
- Publication number 20230420229
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Linying CUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR AVOIDING ELECTRICAL BREAKDOWN FROM RF T...
- Publication number 20230420218
- Publication date Dec 28, 2023
- LAM RESEARCH CORPORATION
- Hyungjoon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Electrostatic control

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma processing apparatus

Apparatus and methods for controlling ion energy distribution

Vacuum deposition into trenches and vias and etch of trenches and via

Electrostatic chuck

Single chamber flowable film formation and treatments

Electron bias control signals for electron enhanced material proces...

Dynamic processing chamber baffle

Substrate processing apparatus having a middle electrode

Plasma processing apparatus and method for dechucking wafer in the...

Bipolar electrostatic chuck to limit DC discharge

Electron bias control signals for electron enhanced material proces...

Member for semiconductor manufacturing apparatus and method for man...

Variable mode plasma chamber utilizing tunable plasma potential

Wafer de-chucking detection and arcing prevention

High power electrostatic chuck design with radio frequency coupling

Electrostatically clamped edge ring

Substrate support with real time force and film stress control

Apparatus and methods for manipulating power at an edge ring in pla...

Method for processing substrate

Electron bias control signals for electron enhanced material proces...

Plasma processing apparatus and plasma processing method

Substrate processing apparatus and method of manufacturing semicond...

Mesa height modulation for thickness correction

Substrate processing apparatus and charge neutralization method for...

Semiconductor processing equipment including electrostatic chuck fo...

Electrostatic chuck

Electrostatic chuck for use in semiconductor processing

Apparatus and methods for controlling ion energy distribution

Substrate support

Apparatuses and methods for avoiding electrical breakdown from RF t...

Patents Applicationslast 30 patents

PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE

BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGE

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE

APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING

DRY ETCHER UNIFORMITY CONTROL BY TUNING EDGE ZONE PLASMA SHEATH

TUNABLE PLASMA EXCLUSION ZONE IN SEMICONDUCTOR FABRICATION

ADJUSTABLE DE-CHUCKING VOLTAGE

ELECTRON BIAS CONTROL SIGNALS FOR ELECTRON ENHANCED MATERIAL PROCES...

Variable Mode Plasma Chamber Utilizing Tunable Plasma Potential

DISTORTION OF PULSES FOR WAFER BIASING

SUBSTRATE SUPPORT WITH REAL TIME FORCE AND FILM STRESS CONTROL

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

APPARATUS FOR TREATING SUBSTRATE

ELECTRON BIAS CONTROL SIGNALS FOR ELECTRON ENHANCED MATERIAL PROCES...

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

Substrate Processing Apparatus and Method of Manufacturing Semicond...

APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE

APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE

ELECTROSTATIC CHUCK

ION BEAM SOURCE, SUBSTRATE PROCESS APPARATUS INCLUDING THE SAME, AN...

METHOD OF DEPOSITING SILICON NITRIDE FILM, APPARATUS FOR DEPOSITING...

ELECTROSTATIC CHUCK FOR USE IN SEMICONDUCTOR PROCESSING

VACUUM DEPOSITION INTO TRENCHES AND VIAS AND ETCH OF TRENCHES AND VIA

IMPROVED PLASMA RESISTANT COATINGS FOR ELECTROSTATIC CHUCKS

CO-DOPING TO CONTROL WET ETCH RATE OF FCVD OXIDE LAYERS

TOOL FOR PREVENTING OR SUPPRESSING ARCING

APPARATUS AND METHODS FOR CONTROLLING ION ENERGY DISTRIBUTION

APPARATUSES AND METHODS FOR AVOIDING ELECTRICAL BREAKDOWN FROM RF T...