Electrostatic control

Industry

CPC
H01J37/32697

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32697Electrostatic control

Industries

Patents Grantslast 30 patents

Information Patent Grant
Tunable plasma exclusion zone in semiconductor fabrication
- Patent number 12,340,987
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Che Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etcher uniformity control by tuning edge zone plasma sheath
- Patent number 12,334,314
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lung Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distortion of pulses for wafer biasing
- Patent number 12,315,705
- Issue date May 27, 2025
- Lam Research Corporation
- Karl Frederick Leeser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and method for installing edge ring
- Patent number 12,308,221
- Issue date May 20, 2025
- Tokyo Electron Limited
- Takashi Aramaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus having edge impedance control circuit
- Patent number 12,300,470
- Issue date May 13, 2025
- Semes Co., Ltd.
- Daehyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,261,027
- Issue date Mar 25, 2025
- Tokyo Electron Limited
- Natsumi Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support device
- Patent number 12,233,501
- Issue date Feb 25, 2025
- Tes Co., Ltd.
- Sang-Jean Jeon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated control of a plasma processing system
- Patent number 12,230,476
- Issue date Feb 18, 2025
- Advanced Energy Industries, Inc.
- Gideon Van Zyl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion beam source, substrate process apparatus including the same, an...
- Patent number 12,224,163
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- SeungWan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF tuning systems including tuning circuits having impedances for s...
- Patent number 12,217,939
- Issue date Feb 4, 2025
- Lam Research Corporation
- David French
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 12,191,121
- Issue date Jan 7, 2025
- HITACHI HIGH-TECH CORPORATION
- Kazuyuki Ikenaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for controlling ion energy distribution
- Patent number 12,183,557
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Linying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum deposition into trenches and vias and etch of trenches and via
- Patent number 12,170,185
- Issue date Dec 17, 2024
- Ascentool, Inc.
- George Xinsheng Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chuck
- Patent number 12,170,219
- Issue date Dec 17, 2024
- Kyocera Corporation
- Naoki Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single chamber flowable film formation and treatments
- Patent number 12,142,459
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Khokan Chandra Paul
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electron bias control signals for electron enhanced material proces...
- Patent number 12,125,686
- Issue date Oct 22, 2024
- VELVETCH, LLC
- Stewart Francis Sando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic processing chamber baffle
- Patent number 12,119,209
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Udit S. Kotagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus having a middle electrode
- Patent number 12,106,977
- Issue date Oct 1, 2024
- SK hynix Inc.
- Jin Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and method for dechucking wafer in the...
- Patent number 12,106,942
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Yi Rop Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bipolar electrostatic chuck to limit DC discharge
- Patent number 12,057,339
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron bias control signals for electron enhanced material proces...
- Patent number 12,027,348
- Issue date Jul 2, 2024
- VELVETCH LLC
- Stewart Francis Sando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for semiconductor manufacturing apparatus and method for man...
- Patent number 12,009,245
- Issue date Jun 11, 2024
- NGK Insulators, Ltd.
- Masaki Ishikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable mode plasma chamber utilizing tunable plasma potential
- Patent number 12,002,652
- Issue date Jun 4, 2024
- Mattson Technology, Inc.
- Stephen E. Savas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer de-chucking detection and arcing prevention
- Patent number 12,002,702
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- Ganesh Balasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power electrostatic chuck design with radio frequency coupling
- Patent number 11,948,826
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Jaeyong Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatically clamped edge ring
- Patent number 11,935,776
- Issue date Mar 19, 2024
- Lam Research Corporation
- Christopher Kimball
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support with real time force and film stress control
- Patent number 11,915,913
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Wendell Glenn Boyd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and methods for manipulating power at an edge ring in pla...
- Patent number 11,908,661
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Linying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing substrate
- Patent number 11,894,219
- Issue date Feb 6, 2024
- Semes Co., Ltd.
- Je Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electron bias control signals for electron enhanced material proces...
- Patent number 11,887,823
- Issue date Jan 30, 2024
- VELVETCH LLC
- Stewart Francis Sando
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND...
- Publication number 20250232960
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Hyungsik KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250232961
- Publication date Jul 17, 2025
- Hitachi High-Tech Corporation
- Kazuya TAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING SYSTEM AND PROCESSING METHOD
- Publication number 20250232967
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT SYSTEM
- Publication number 20250226189
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Toshiki AKAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STATIC ELECTRCITY CONTROL DEVICE FOR SEMICONDUCTOR PROCESSING SYSTEM
- Publication number 20250218745
- Publication date Jul 3, 2025
- NEXTIN, INC.
- Heung-Gyoon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE
- Publication number 20250218746
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- In Hee KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE
- Publication number 20250218747
- Publication date Jul 3, 2025
- SEMES CO., LTD.
- Dong Hun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250210322
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- HYUNJAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250210330
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Naoki MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT ASSEMBLY, PLASMA CONTROL METHOD, AND PLASMA PROCE...
- Publication number 20250201521
- Publication date Jun 19, 2025
- SEMES CO., LTD.
- Dae Hyun YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20250201536
- Publication date Jun 19, 2025
- TOKYO ELECTRON LIMITED
- Mitsuhiro IWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME
- Publication number 20250183013
- Publication date Jun 5, 2025
- SEMES CO., LTD.
- Jong Joon JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
- Publication number 20250174442
- Publication date May 29, 2025
- TOKYO ELECTRON LIMITED
- Yasuhisa KUDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARC REDUCTION AND RF CONTROL FOR ELECTROSTATIC CHUCKS IN SEMICONDUC...
- Publication number 20250116001
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Allison Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RF TUNING SYSTEMS INCLUDING TUNING CIRCUITS HAVING IMPEDANCES FOR S...
- Publication number 20250118535
- Publication date Apr 10, 2025
- LAM RESEARCH CORPORATION
- David French
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250112030
- Publication date Apr 3, 2025
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Kenneth Scott Alexander Butcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING SAME
- Publication number 20250095972
- Publication date Mar 20, 2025
- PSK INC.
- Yong Soo YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250087470
- Publication date Mar 13, 2025
- TOKYO ELECTRON LIMITED
- Takari YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING
- Publication number 20250079138
- Publication date Mar 6, 2025
- TOKYO ELECTRON LIMITED
- Takashi ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION APPARATUS AND METHOD OF OPERATING THE SAME
- Publication number 20250079135
- Publication date Mar 6, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jun Hyeuk KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20250079136
- Publication date Mar 6, 2025
- Hitachi High-Tech Corporation
- Mai ISOMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND-LIKE CARBON GAP FILL
- Publication number 20250046599
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Jialiang WANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING
- Publication number 20250046635
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Sangchul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE
- Publication number 20250029818
- Publication date Jan 23, 2025
- Hitachi High-Tech Corporation
- Andre AMEND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGE
- Publication number 20250014934
- Publication date Jan 9, 2025
- Applied Materials, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250014872
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20250006471
- Publication date Jan 2, 2025
- Tokyo Electron Limited
- Takamichi KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE
- Publication number 20240429070
- Publication date Dec 26, 2024
- SK HYNIX INC.
- Jin Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING
- Publication number 20240395509
- Publication date Nov 28, 2024
- TOKYO ELECTRON LIMITED
- Chishio KOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCHER UNIFORMITY CONTROL BY TUNING EDGE ZONE PLASMA SHEATH
- Publication number 20240387152
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Lung HUNG
- H01 - BASIC ELECTRIC ELEMENTS

Electrostatic control

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tunable plasma exclusion zone in semiconductor fabrication

Dry etcher uniformity control by tuning edge zone plasma sheath

Distortion of pulses for wafer biasing

Substrate processing system and method for installing edge ring

Substrate treating apparatus having edge impedance control circuit

Plasma processing apparatus and plasma processing method

Substrate support device

Integrated control of a plasma processing system

Ion beam source, substrate process apparatus including the same, an...

RF tuning systems including tuning circuits having impedances for s...

Plasma processing apparatus

Apparatus and methods for controlling ion energy distribution

Vacuum deposition into trenches and vias and etch of trenches and via

Electrostatic chuck

Single chamber flowable film formation and treatments

Electron bias control signals for electron enhanced material proces...

Dynamic processing chamber baffle

Substrate processing apparatus having a middle electrode

Plasma processing apparatus and method for dechucking wafer in the...

Bipolar electrostatic chuck to limit DC discharge

Electron bias control signals for electron enhanced material proces...

Member for semiconductor manufacturing apparatus and method for man...

Variable mode plasma chamber utilizing tunable plasma potential

Wafer de-chucking detection and arcing prevention

High power electrostatic chuck design with radio frequency coupling

Electrostatically clamped edge ring

Substrate support with real time force and film stress control

Apparatus and methods for manipulating power at an edge ring in pla...

Method for processing substrate

Electron bias control signals for electron enhanced material proces...

Patents Applicationslast 30 patents

FOCUS RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND...

PLASMA PROCESSING APPARATUS

PROCESSING SYSTEM AND PROCESSING METHOD

SUBSTRATE TREATMENT SYSTEM

STATIC ELECTRCITY CONTROL DEVICE FOR SEMICONDUCTOR PROCESSING SYSTEM

APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE

APPARATUS FOR AND METHOD OF PROCESSING SUBSTRATE

SUBSTRATE PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM

SUBSTRATE SUPPORT ASSEMBLY, PLASMA CONTROL METHOD, AND PLASMA PROCE...

PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM

ELECTROSTATIC CHUCK AND PLASMA PROCESSING APPARATUS INCLUDING THE SAME

SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS

ARC REDUCTION AND RF CONTROL FOR ELECTROSTATIC CHUCKS IN SEMICONDUC...

RF TUNING SYSTEMS INCLUDING TUNING CIRCUITS HAVING IMPEDANCES FOR S...

PLASMA PROCESSING APPARATUS

SUPPORT UNIT AND SUBSTRATE PROCESSING APPARATUS INCLUDING SAME

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING SYSTEM AND METHOD FOR INSTALLING EDGE RING

DEPOSITION APPARATUS AND METHOD OF OPERATING THE SAME

PLASMA PROCESSING METHOD

DIAMOND-LIKE CARBON GAP FILL

SUBSTRATE PROCESSING

PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE

BIPOLAR ELECTROSTATIC CHUCK TO LIMIT DC DISCHARGE

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

NITRIDE FILM FORMING METHOD AND PLASMA PROCESSING APPARATUS

SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE

APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING

DRY ETCHER UNIFORMITY CONTROL BY TUNING EDGE ZONE PLASMA SHEATH