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H01L23/28

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/28Encapsulations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and device configurations
- Patent number 12,315,986
- Issue date May 27, 2025
- QUALCOMM Incorporated
- Seong Heon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cartridge for inspection
- Patent number 12,237,236
- Issue date Feb 25, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 12,232,300
- Issue date Feb 18, 2025
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 12,211,804
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with patterns of die-specific information
- Patent number 12,131,916
- Issue date Oct 29, 2024
- Micron Technology, Inc.
- Federico Pio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 12,132,009
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Su Chang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic electronic device including encapsulation layer
- Patent number 12,101,958
- Issue date Sep 24, 2024
- LG Chem, Ltd.
- Hyun Jee Yoo
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 12,062,549
- Issue date Aug 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive and protective coating for electronic device
- Patent number 12,033,426
- Issue date Jul 9, 2024
- Next Biometrics Group ASA
- Matias N. Troccoli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Double-sided integrated circuit module having an exposed semiconduc...
- Patent number 12,021,065
- Issue date Jun 25, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,021,020
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driver for motors
- Patent number 11,984,773
- Issue date May 14, 2024
- Mitsuba Corporation
- Tomoya Ikariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap type semiconductor device package structure
- Patent number 11,979,136
- Issue date May 7, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Yunxiang Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and measurement method for the package structure
- Patent number 11,965,731
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure
- Patent number 11,953,461
- Issue date Apr 9, 2024
- HITACHI HIGH-TECH CORPORATION
- Ukyo Ikeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit die pad cavity
- Patent number 11,942,448
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead package with wettable flanges
- Patent number 11,935,821
- Issue date Mar 19, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 11,935,840
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,935,802
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency module
- Patent number 11,903,120
- Issue date Feb 13, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated temperature sensor package with embedded spacer in dielect...
- Patent number 11,879,790
- Issue date Jan 23, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency component
- Patent number 11,876,277
- Issue date Jan 16, 2024
- ENDRESS+HAUSER SE+CO.KG
- Martin Hitzler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 11,871,523
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Ryohei Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structures and methods of manufacturing the same
- Patent number 11,862,585
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device including air gaps and method of manufact...
- Patent number 11,862,514
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...
- Publication number 20250183123
- Publication date Jun 5, 2025
- Alpha and Omega Semiconductor International LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF IMPLEMENTING REDISTRIBUTION LAY...
- Publication number 20250167174
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yunseok YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARTRIDGE FOR INSPECTION
- Publication number 20250157861
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza CHAJI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS
- Publication number 20250149495
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112180
- Publication date Apr 3, 2025
- AOI ELECTRONICS CO., LTD.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112095
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Kazufumi OKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME STRUCTURES IN SEMICONDUCTOR PACKAGES
- Publication number 20250112176
- Publication date Apr 3, 2025
- Apple Inc.
- Jiongxin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP AND METHOD OF MANUFACT...
- Publication number 20250105097
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Yeongseon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250087603
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250087588
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250079338
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250079393
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070048
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Dawoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062299
- Publication date Feb 20, 2025
- Siliconware Precision Industries Co., Ltd.
- Meng-Jie LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PATTERNS OF DIE-SPECIFIC INFORMATION
- Publication number 20250054776
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Federico Pio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250038100
- Publication date Jan 30, 2025
- Samsung Electronics Co., Ltd.
- Daehun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND RELATED MANUFACTURING METHOD THEREOF
- Publication number 20240404930
- Publication date Dec 5, 2024
- STATS CHIPPAC SEMICONDUCTOR (JIANGYIN) CO., LTD.
- Jiade Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240395781
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Chengtar Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...
- Publication number 20240387464
- Publication date Nov 21, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20240379635
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379636
- Publication date Nov 14, 2024
- nD-HI Technologies Lab, Inc.
- HO-MING TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355638
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Device, Power Module, and Electronic Apparatus
- Publication number 20240321719
- Publication date Sep 26, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Xiaojing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE THEREOF
- Publication number 20240321825
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321728
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE PAD CAVITY
- Publication number 20240274569
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE
- Publication number 20240263938
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIOCOMPATIBLE GLASS SUBSTRATE WITH THROUGH ELECTRODE AND BIOCOMPATI...
- Publication number 20240262738
- Publication date Aug 8, 2024
- Schott Japan Corporation
- Yutaka ONEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND THE STRUCTURE FORMED THEREFROM
- Publication number 20240258260
- Publication date Aug 1, 2024
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE
- Publication number 20240250052
- Publication date Jul 25, 2024
- FUJIKURA LTD.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS

Encapsulations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package and method of forming the same

Antenna and device configurations

Dummy structure of stacked and bonded semiconductor device

Cartridge for inspection

Power semiconductor device and method for manufacturing power semic...

Semiconductor device with partial EMI shielding removal using laser...

Semiconductor packages with patterns of die-specific information

Semiconductor package

Organic electronic device including encapsulation layer

Semiconductor device with encapsulant deposited along sides and sur...

Panel molded electronic assemblies with multi-surface conductive co...

Semiconductor packages and related methods

Thermally conductive and protective coating for electronic device

Double-sided integrated circuit module having an exposed semiconduc...

Semiconductor package

Driver for motors

Air gap type semiconductor device package structure

Package structure and measurement method for the package structure

Semiconductor device and method of making a wafer-level chip-scale...

Electrode structure

Integrated circuit die pad cavity

Quad flat no-lead package with wettable flanges

Semiconductor device with partial EMI shielding removal using laser...

Integrated circuit package and method of forming same

Radio frequency module

Isolated temperature sensor package with embedded spacer in dielect...

High-frequency component

Electronic component module and method for manufacturing electronic...

Semiconductor package structures and methods of manufacturing the same

Integrated circuit device including air gaps and method of manufact...

Patents Applicationslast 30 patents

POWER MODULE HAVING INTERCONNECTED BASE PLATE WITH MOLDED METAL AND...

SEMICONDUCTOR PACKAGE AND METHOD OF IMPLEMENTING REDISTRIBUTION LAY...

CARTRIDGE FOR INSPECTION

SEMICONDUCTOR PACKAGE AND METHODS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FRAME STRUCTURES IN SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP AND METHOD OF MANUFACT...

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGES WITH PATTERNS OF DIE-SPECIFIC INFORMATION

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE AND RELATED MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND RELATED METHODS

Packaged Device, Power Module, and Electronic Apparatus

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE THEREOF

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DIE PAD CAVITY

PACKAGE STRUCTURE AND MEASUREMENT METHOD FOR THE PACKAGE STRUCTURE

BIOCOMPATIBLE GLASS SUBSTRATE WITH THROUGH ELECTRODE AND BIOCOMPATI...

SEMICONDUCTOR PACKAGING METHOD AND THE STRUCTURE FORMED THEREFROM

SEMICONDUCTOR PACKAGE AND HIGH FREQUENCY MODULE