Etching of the substrate by chemical or physical means

Industry

CPC
H05K3/0017

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0017Etching of the substrate by chemical or physical means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit structure and fabrication method thereof
- Patent number 12,133,337
- Issue date Oct 29, 2024
- INNOLUX CORPORATION
- Yi Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,101,890
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung Ju Gi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 11,842,893
- Issue date Dec 12, 2023
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring circuit board and producing method thereof
- Patent number 11,825,598
- Issue date Nov 21, 2023
- Nitto Denko Corporation
- Ryosuke Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,807,947
- Issue date Nov 7, 2023
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Mounting substrate to which image sensor is mounted, sensor package...
- Patent number 11,778,293
- Issue date Oct 3, 2023
- Canon Kabushiki Kaisha
- Dai Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed package and method of forming same
- Patent number 11,744,518
- Issue date Sep 5, 2023
- Medtronic, Inc.
- David A Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Interposer and method for producing holes in an interposer
- Patent number 11,744,015
- Issue date Aug 29, 2023
- Schott AG
- Oliver Jackl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impedence matching conductive structure for high efficiency RF circ...
- Patent number 11,677,373
- Issue date Jun 13, 2023
- 3D GLASS SOLUTIONS, INC.
- Jeb H. Flemming
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board with spaces for embedding components
- Patent number 11,664,360
- Issue date May 30, 2023
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a circuit board with embedded nickel resistor
- Patent number 11,665,831
- Issue date May 30, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jian Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroless and electrolytic deposition process for forming traces...
- Patent number 11,653,453
- Issue date May 16, 2023
- CATLAM, LLC
- Kenneth S Bahl
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
PCB-pinout based packaged module and method for preparing PCB-pinou...
- Patent number 11,641,072
- Issue date May 2, 2023
- Huawei Technologies Co., Ltd.
- Weijian Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for introducing at least one cutout or aperture into a sheet...
- Patent number 11,610,784
- Issue date Mar 21, 2023
- LPKF LASER & ELECTRONICS SE
- Norbert Ambrosius
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalytic laminate with conductive traces formed during lamination
- Patent number 11,477,893
- Issue date Oct 18, 2022
- CATLAM, LLC
- Kenneth S Bahl
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sealed package and method of forming same
- Patent number 11,419,552
- Issue date Aug 23, 2022
- Medtronic, Inc.
- David A Ruben
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing wiring substrate
- Patent number 11,425,823
- Issue date Aug 23, 2022
- Toyota Jidosha Kabushiki Kaisha
- Haruki Kondoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a heat dissipation structure
- Patent number 11,380,603
- Issue date Jul 5, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Fu-Yun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a packaging structure
- Patent number 11,375,619
- Issue date Jun 28, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-level pad card edge self-guide and alignment of connector
- Patent number 11,342,697
- Issue date May 24, 2022
- International Business Machines Corporation
- Paul W Coteus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-curable composition and patterning method using the same
- Patent number 11,332,597
- Issue date May 17, 2022
- Canon Kabushiki Kaisha
- Toshiki Ito
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Carrier substrate for electrical, more particularly electronic, com...
- Patent number 11,330,707
- Issue date May 10, 2022
- Rogers Germany GmbH
- Stefan Britting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wickless capillary driven constrained vapor bubble heat pipes
- Patent number 11,324,139
- Issue date May 3, 2022
- Intel Corporation
- Sumita Basu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System for direct writing on an uneven surface of a workpiece that...
- Patent number 11,284,517
- Issue date Mar 22, 2022
- Micronic Mydata AB
- Per Askebjer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,255,018
- Issue date Feb 22, 2022
- KATEEVA, LTD.
- Nava Shpaisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,234,330
- Issue date Jan 25, 2022
- Innolux Corporation
- Po-Yun Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with spaces for embedding components
- Patent number 11,217,576
- Issue date Jan 4, 2022
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of heat dissipation component
- Patent number 11,183,442
- Issue date Nov 23, 2021
- COMPEQ MANUFACTURING CO., LTD.
- Sz-Shian Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch panel, electronic device including same, and method for manuf...
- Patent number 11,169,649
- Issue date Nov 9, 2021
- Samsung Display Co., Ltd.
- Kyungseop Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component built-in wiring board and method for manufactu...
- Patent number 11,160,168
- Issue date Oct 26, 2021
- Ibiden Co., Ltd.
- Yusuke Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20240414849
- Publication date Dec 12, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Myung Ju GI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREFOR
- Publication number 20240357739
- Publication date Oct 24, 2024
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...
- Publication number 20240298409
- Publication date Sep 5, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Seok Na
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ANTENNA DEVICE COMPRISING SAME
- Publication number 20240260175
- Publication date Aug 1, 2024
- LG Innotek Co., Ltd.
- In Jae LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CIRCUIT BOARD ASSEMBLIES
- Publication number 20240251507
- Publication date Jul 25, 2024
- Simmonds Precision Products, Inc.
- Jeffrey Ewanchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215158
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215159
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang-min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240172373
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Byung Woo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240164028
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
- Publication number 20240147629
- Publication date May 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHANG-HE ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20240121898
- Publication date Apr 11, 2024
- Sumitomo Electric Industries, Ltd.
- Yosuke FUKAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
- Publication number 20240114628
- Publication date Apr 4, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240107667
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
- Publication number 20240107664
- Publication date Mar 28, 2024
- Nitto Denko Corporation
- Kenta FUKUSHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20240035167
- Publication date Feb 1, 2024
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Impedence Matching Conductive Structure for High Efficiency RF Circ...
- Publication number 20240014794
- Publication date Jan 11, 2024
- 3D GLASS SOLUTIONS, INC
- Jeb H. Flemming
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Printed Circuit Board and Manufacturing Method Thereof
- Publication number 20230413430
- Publication date Dec 21, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Po-Hsiang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING FLEXIBLE SUBSTRATE
- Publication number 20230345644
- Publication date Oct 26, 2023
- Japan Display Inc.
- Takumi SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND RESONATO...
- Publication number 20230292441
- Publication date Sep 14, 2023
- SEIKO EPSON CORPORATION
- Koji Kitahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20230284381
- Publication date Sep 7, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20230209719
- Publication date Jun 29, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Myung Ju GI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING PATTERN ON SUBSTRATE STRUCTURE WITHOUT USING MAS...
- Publication number 20230199968
- Publication date Jun 22, 2023
- Amulaire thermal technology, INC.
- SHIH-HSI TAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESISTOR-EMBEDDED CIRCUIT BOARD AND METHOD FOR PROCESSING THE RESIS...
- Publication number 20230064497
- Publication date Mar 2, 2023
- SHENNAN CIRCUITS CO., LTD.
- Ke Leng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEALED PACKAGE AND METHOD OF FORMING SAME
- Publication number 20220378371
- Publication date Dec 1, 2022
- Medtronic, Inc.
- David A. Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PACKAGING STRUCTURE
- Publication number 20220279655
- Publication date Sep 1, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20220192010
- Publication date Jun 16, 2022
- Nitto Denko Corporation
- Ryosuke SASAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20220136113
- Publication date May 5, 2022
- Kateeva, Inc.
- Nava Shpaisman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20220141962
- Publication date May 5, 2022
- MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
- Meng MEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH SPACES FOR EMBEDDING COMPONENTS
- Publication number 20220122958
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Quang Nguyen
- H01 - BASIC ELECTRIC ELEMENTS

Etching of the substrate by chemical or physical means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit structure and fabrication method thereof

Method of manufacturing printed circuit board

Printed circuit board and package substrate including same

Wiring circuit board and producing method thereof

Methods for producing an etch resist pattern on a metallic surface

Mounting substrate to which image sensor is mounted, sensor package...

Sealed package and method of forming same

Interposer and method for producing holes in an interposer

Impedence matching conductive structure for high efficiency RF circ...

Circuit board with spaces for embedding components

Method for manufacturing a circuit board with embedded nickel resistor

Electroless and electrolytic deposition process for forming traces...

PCB-pinout based packaged module and method for preparing PCB-pinou...

Method for introducing at least one cutout or aperture into a sheet...

Catalytic laminate with conductive traces formed during lamination

Sealed package and method of forming same

Method for producing wiring substrate

Method for making a heat dissipation structure

Method for manufacturing a packaging structure

Dual-level pad card edge self-guide and alignment of connector

Photo-curable composition and patterning method using the same

Carrier substrate for electrical, more particularly electronic, com...

Wickless capillary driven constrained vapor bubble heat pipes

System for direct writing on an uneven surface of a workpiece that...

Methods for producing an etch resist pattern on a metallic surface

Electronic device

Circuit board with spaces for embedding components

Manufacturing method of heat dissipation component

Touch panel, electronic device including same, and method for manuf...

Electronic component built-in wiring board and method for manufactu...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

WIRING BOARD AND MANUFACTURING METHOD THEREFOR

HEAT SPREADER FOR MODIFIED EDGE COOLING

CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONE...

CIRCUIT BOARD AND ANTENNA DEVICE COMPRISING SAME

ELECTRICAL CIRCUIT BOARD ASSEMBLIES

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

Impedence Matching Conductive Structure for High Efficiency RF Circ...

Printed Circuit Board and Manufacturing Method Thereof

METHOD OF MANUFACTURING FLEXIBLE SUBSTRATE

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND RESONATO...

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

METHOD FOR FORMING PATTERN ON SUBSTRATE STRUCTURE WITHOUT USING MAS...

RESISTOR-EMBEDDED CIRCUIT BOARD AND METHOD FOR PROCESSING THE RESIS...

SEALED PACKAGE AND METHOD OF FORMING SAME

PACKAGING STRUCTURE

WIRING CIRCUIT BOARD AND PRODUCING METHOD THEREOF

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD WITH SPACES FOR EMBEDDING COMPONENTS