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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29298Fillers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for securing components of an integrated circuit
- Patent number 11,631,600
- Issue date Apr 18, 2023
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,469,165
- Issue date Oct 11, 2022
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 11,309,270
- Issue date Apr 19, 2022
- Dexerials Corporation
- Reiji Tsukao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of micro-LED display panel
- Patent number 11,302,679
- Issue date Apr 12, 2022
- PlayNitride Inc.
- Ying-Tsang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 11,282,801
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, method of manufacturing electronic device, and e...
- Patent number 11,114,418
- Issue date Sep 7, 2021
- Fujitsu Limited
- Taiki Uemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting element including adhesive member containing particles
- Patent number 10,978,623
- Issue date Apr 13, 2021
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48408
- Issue date Jan 26, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
Information Patent Grant
Molded semiconductor package having a package-in-package structure...
- Patent number 10,861,828
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Hui Teng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with supported stacked die
- Patent number 10,796,975
- Issue date Oct 6, 2020
- Intel Corporation
- Guo Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for securing components of an integrated circuit
- Patent number 10,784,128
- Issue date Sep 22, 2020
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED display panel and manufacturing method thereof
- Patent number 10,777,541
- Issue date Sep 15, 2020
- PlayNitride Inc.
- Ying-Tsang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader having electromagnetically-formed features
- Patent number 10,763,188
- Issue date Sep 1, 2020
- Intel Corporation
- Aravindha R. Antoniswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless module with antenna package and cap package
- Patent number 10,756,033
- Issue date Aug 25, 2020
- Intel IP Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,741,482
- Issue date Aug 11, 2020
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48111
- Issue date Jul 21, 2020
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
Information Patent Grant
Chip, flexible display panel and display device
- Patent number 10,651,141
- Issue date May 12, 2020
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,634,941
- Issue date Apr 28, 2020
- Japan Display Inc.
- Yosuke Hyodo
- G02 - OPTICS
Information Patent Grant
Thermally and electrically conductive adhesive composition
- Patent number 10,633,564
- Issue date Apr 28, 2020
- Tanaka Kikinzoku Kogyo K.K.
- Shintaro Abe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing light emitting device
- Patent number 10,626,301
- Issue date Apr 21, 2020
- Dexerials Corporation
- Norio Umetsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of forming build-up interconnect st...
- Patent number 10,304,817
- Issue date May 28, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor element bonded to base bo...
- Patent number 10,290,778
- Issue date May 14, 2019
- Nichia Corporation
- Masafumi Kuramoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,128,223
- Issue date Nov 13, 2018
- TOSHIBA MEMORY CORPORATION
- Kazushige Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed alloy solder paste
- Patent number 10,118,260
- Issue date Nov 6, 2018
- Indium Corporation
- Hongwen Zhang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,090,257
- Issue date Oct 2, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical package including bimetal lid
- Patent number 10,032,727
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number 9,893,045
- Issue date Feb 13, 2018
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structured sintered connection layers, and sem...
- Patent number 9,887,173
- Issue date Feb 6, 2018
- Robert Bosch GmbH
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phosphonium compound, epoxy resin composition including the same an...
- Patent number 9,868,751
- Issue date Jan 16, 2018
- Samsung SDI Co., Ltd.
- Min Gyum Kim
- C07 - ORGANIC CHEMISTRY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240071855
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20230030133
- Publication date Feb 2, 2023
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20220084975
- Publication date Mar 17, 2022
- DEXERIALS CORPORATION
- Reiji TSUKAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MANUFACTURING METHOD OF MICRO-LED DISPLAY PANEL
- Publication number 20200373282
- Publication date Nov 26, 2020
- PlayNitride Inc.
- Ying-Tsang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200350239
- Publication date Nov 5, 2020
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20190206775
- Publication date Jul 4, 2019
- Advanced Semiconductor Engineering, Inc.
- Yu-Ying LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190189866
- Publication date Jun 20, 2019
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION COMPONENT, CONNECTOR, MANUFACTURING METHOD FOR THE SAME...
- Publication number 20180331170
- Publication date Nov 15, 2018
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., L TD
- Kui XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming Build-Up Interconnect St...
- Publication number 20180006008
- Publication date Jan 4, 2018
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Conductive Film And Production Method of the Same
- Publication number 20170012014
- Publication date Jan 12, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Over Se...
- Publication number 20140327145
- Publication date Nov 6, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, RESIN COMPOSITION SHEET, SEMICONDUCTOR DEVICE AN...
- Publication number 20140291870
- Publication date Oct 2, 2014
- Yoichi Shimba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SINTERED SILVER JOINTS VIA CONTROLLED TOPOGRAPHY OF ELECTRONIC PACK...
- Publication number 20140255717
- Publication date Sep 11, 2014
- UT-Battelle, LLC
- Andrew A. Wereszczak
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Method for Producing Structured Sintered Connection Layers, and Sem...
- Publication number 20140225274
- Publication date Aug 14, 2014
- Michael Guyenot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A THIN SEMICONDUCTOR DEVICE
- Publication number 20140220742
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Kahlil HOSSEINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS
- Publication number 20140182763
- Publication date Jul 3, 2014
- Saikumar Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, CHIP ON FILM AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20140124803
- Publication date May 8, 2014
- SAMSUNG DISPLAY CO., LTD.
- Jun-Ho KWACK
- G02 - OPTICS
Information Patent Application
Semiconductor Package and Method of Mounting Semiconductor Die to O...
- Publication number 20140110860
- Publication date Apr 24, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...
- Publication number 20140097528
- Publication date Apr 10, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electrical Interconnecti...
- Publication number 20140008783
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL MODULE FOR BEING RECEIVED BY AUTOMATIC PLACEMENT MACHINE...
- Publication number 20130343006
- Publication date Dec 26, 2013
- EPCOS AG
- Claus Reitlinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING WAFER-LEVEL FLIP CHIP DEVICE PACKAGES
- Publication number 20130330853
- Publication date Dec 12, 2013
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS
- Publication number 20130328172
- Publication date Dec 12, 2013
- Michael A. Tischler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE ADHESIVE
- Publication number 20130279118
- Publication date Oct 24, 2013
- DEXERIALS CORPORATION
- Taichi Koyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INDIUM COMPOSITIONS
- Publication number 20130270117
- Publication date Oct 17, 2013
- Edit SZOCS
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
- Publication number 20130197129
- Publication date Aug 1, 2013
- Shin-Etsu Chemical Co., Ltd.
- Hideki AKIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM COMPOSITION, ANISOTROPIC CONDUCTIVE FIL...
- Publication number 20130154094
- Publication date Jun 20, 2013
- Kyoung Hun Shin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE BONDED BY THE...
- Publication number 20130154129
- Publication date Jun 20, 2013
- Kyung Il SUL
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for permanent connection of two metal surfaces

Apparatus and method for securing components of an integrated circuit

Semiconductor device package

Anisotropic conductive film and production method of the same

Manufacturing method of micro-LED display panel

Method for permanent connection of two metal surfaces

Electronic device, method of manufacturing electronic device, and e...

Light emitting element including adhesive member containing particles

Semiconductor device and method of forming interposer frame over se...

Molded semiconductor package having a package-in-package structure...

Semiconductor package with supported stacked die

Apparatus and method for securing components of an integrated circuit

Micro-LED display panel and manufacturing method thereof

Integrated heat spreader having electromagnetically-formed features

Wireless module with antenna package and cap package

Semiconductor device package

Semiconductor device and method of forming interposer frame over se...

Chip, flexible display panel and display device

Display device

Thermally and electrically conductive adhesive composition

Method for manufacturing light emitting device

Semiconductor device and method of forming build-up interconnect st...

Semiconductor device having semiconductor element bonded to base bo...

Semiconductor device and manufacturing method thereof

Mixed alloy solder paste

Electrical package including bimetal lid

Electrical package including bimetal lid

Semiconductor device and method of forming interposer frame over se...

Method for producing structured sintered connection layers, and sem...

Phosphonium compound, epoxy resin composition including the same an...

Patents Applicationslast 30 patents

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

SEMICONDUCTOR PACKAGE AND METHOD

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

MANUFACTURING METHOD OF MICRO-LED DISPLAY PANEL

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE

CONNECTION COMPONENT, CONNECTOR, MANUFACTURING METHOD FOR THE SAME...

Semiconductor Device and Method of Forming Build-Up Interconnect St...

Anisotropic Conductive Film And Production Method of the Same

Semiconductor Device and Method of Forming Interposer Frame Over Se...

RESIN COMPOSITION, RESIN COMPOSITION SHEET, SEMICONDUCTOR DEVICE AN...

SINTERED SILVER JOINTS VIA CONTROLLED TOPOGRAPHY OF ELECTRONIC PACK...

Method for Producing Structured Sintered Connection Layers, and Sem...

METHOD FOR FORMING A THIN SEMICONDUCTOR DEVICE

POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS

DISPLAY PANEL, CHIP ON FILM AND DISPLAY DEVICE INCLUDING THE SAME

Semiconductor Package and Method of Mounting Semiconductor Die to O...

CHIP ARRANGEMENTS, A CHIP PACKAGE AND A METHOD FOR MANUFACTURING A...

Semiconductor Device and Method of Forming Electrical Interconnecti...

ELECTRICAL MODULE FOR BEING RECEIVED BY AUTOMATIC PLACEMENT MACHINE...

METHODS OF FABRICATING WAFER-LEVEL FLIP CHIP DEVICE PACKAGES

WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS

THERMALLY CONDUCTIVE ADHESIVE

INDIUM COMPOSITIONS

LIQUID EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

ANISOTROPIC CONDUCTIVE FILM COMPOSITION, ANISOTROPIC CONDUCTIVE FIL...

ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE BONDED BY THE...