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Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L21/76837
Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics
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last 30 patents
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Method for forming semiconductor structure and a semiconductor
Patent number
12,324,148
Issue date
Jun 3, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Chih-Cheng Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method and apparatus for filling gap using atomic layer deposition
Patent number
12,312,686
Issue date
May 27, 2025
Samsung Electronics Co., Ltd.
Eunhyoung Cho
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with etched landing pad surface
Patent number
12,309,996
Issue date
May 20, 2025
NANYA TECHNOLOGY CORPORATION
Yen-Ho Chu
H01 - BASIC ELECTRIC ELEMENTS
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Interconnect structures including air gaps
Patent number
12,308,286
Issue date
May 20, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Cheng-Chin Lee
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and formation method thereof
Patent number
12,293,971
Issue date
May 6, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Zhongdi Tang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of manufacturing the same
Patent number
12,293,925
Issue date
May 6, 2025
Renesas Electronics Corporation
Yuki Murayama
H01 - BASIC ELECTRIC ELEMENTS
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Methods for depositing gap filling fluids and related systems and d...
Patent number
12,293,942
Issue date
May 6, 2025
ASM IP Holding B.V.
Timothee Blanquart
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Gap patterning for metal-to-source/drain plugs in a semiconductor d...
Patent number
12,293,947
Issue date
May 6, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Lien Huang
H01 - BASIC ELECTRIC ELEMENTS
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Method of providing a workpiece including low resistance interconne...
Patent number
12,278,143
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with cushion structure and method for fabricat...
Patent number
12,278,152
Issue date
Apr 15, 2025
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with cushion structure and method for fabricat...
Patent number
12,278,153
Issue date
Apr 15, 2025
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
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Gapfill of variable aspect ratio features with a composite PEALD an...
Patent number
12,261,038
Issue date
Mar 25, 2025
Lam Research Corporation
Hu Kang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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In-situ PECVD cap layer
Patent number
12,252,782
Issue date
Mar 18, 2025
Lam Research Corporation
Jeremy David Fields
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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3DIC with gap-fill structures and the method of manufacturing the same
Patent number
12,249,566
Issue date
Mar 11, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Ping-Jung Wu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device with porous dielectric layers and method for f...
Patent number
12,243,817
Issue date
Mar 4, 2025
NANYA TECHNOLOGY CORPORATION
Tse-Yao Huang
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device structure having air gap and methods of formin...
Patent number
12,230,537
Issue date
Feb 18, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ting-Ya Lo
H01 - BASIC ELECTRIC ELEMENTS
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Wafer chip scale packaging with ball attach before repassivation
Patent number
12,230,539
Issue date
Feb 18, 2025
Texas Instruments Incorporated
Daiki Komatsu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor memory device and manufacturing method thereof
Patent number
12,224,205
Issue date
Feb 11, 2025
CHANGXIN MEMORY TECHNOLOGIES, INC.
Jingwen Lu
H01 - BASIC ELECTRIC ELEMENTS
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Methods for depositing gap filling fluid
Patent number
12,211,742
Issue date
Jan 28, 2025
ASM IP Holding B.V.
Timothee Blanquart
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Electronic devices comprising a compressive dielectric material, an...
Patent number
12,205,900
Issue date
Jan 21, 2025
Micron Technology, Inc.
Jivaan Kishore Jhothiraman
H01 - BASIC ELECTRIC ELEMENTS
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Sensor packages
Patent number
12,205,860
Issue date
Jan 21, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Tsung-Hsien Chiang
H01 - BASIC ELECTRIC ELEMENTS
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Defect free germanium oxide gap fill
Patent number
12,198,936
Issue date
Jan 14, 2025
Applied Materials, Inc.
Huiyuan Wang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Semiconductor device and method
Patent number
12,191,158
Issue date
Jan 7, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Kuan-Wei Huang
H01 - BASIC ELECTRIC ELEMENTS
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Electronic devices including tiered stacks including conductive str...
Patent number
12,191,254
Issue date
Jan 7, 2025
Micron Technology, Inc.
Sidhartha Gupta
H01 - BASIC ELECTRIC ELEMENTS
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Method for manufacturing semiconductor structure and semiconductor...
Patent number
12,165,879
Issue date
Dec 10, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Xinman Cao
H01 - BASIC ELECTRIC ELEMENTS
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Chemical direct pattern plating method
Patent number
12,159,837
Issue date
Dec 3, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Wen-Jiun Liu
H01 - BASIC ELECTRIC ELEMENTS
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Substrate processing method
Patent number
12,154,824
Issue date
Nov 26, 2024
ASM IP Holding B.V.
Hyunchul Kim
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
Patent number
12,148,701
Issue date
Nov 19, 2024
Samsung Electronics Co., Ltd.
Hongsik Shin
H01 - BASIC ELECTRIC ELEMENTS
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Self-aligning spacer tight pitch via
Patent number
12,142,525
Issue date
Nov 12, 2024
International Business Machines Corporation
Lawrence A. Clevenger
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and manufacturing method of the semiconductor...
Patent number
12,137,563
Issue date
Nov 5, 2024
SK hynix Inc.
Kang Sik Choi
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL...
Publication number
20250167041
Publication date
May 22, 2025
STMicroelectronics International N.V.
Fabrizio Fausto Renzo TOIA
H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL
Publication number
20250157935
Publication date
May 15, 2025
Micron Technology, Inc.
Jivaan Kishore Jhothiraman
H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES...
Publication number
20250140691
Publication date
May 1, 2025
Micron Technology, Inc.
Sidhartha Gupta
G11 - INFORMATION STORAGE
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20250125144
Publication date
Apr 17, 2025
NANYA TECHNOLOGY CORPORATION
Yubon CHIANG
H01 - BASIC ELECTRIC ELEMENTS
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CUT SHAPES FOR BACKSIDE METALS
Publication number
20250118661
Publication date
Apr 10, 2025
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
Publication number
20250112169
Publication date
Apr 3, 2025
NANYA TECHNOLOGY CORPORATION
FENG-WEN HSU
H01 - BASIC ELECTRIC ELEMENTS
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METHODS AND APPARATUS TO IMPROVE INTERCONNECT STRUCTURES IN INTEGRA...
Publication number
20250112145
Publication date
Apr 3, 2025
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
Publication number
20250112171
Publication date
Apr 3, 2025
NANYA TECHNOLOGY CORPORATION
FENG-WEN HSU
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR GAP FILL AND PLANARIZATION
Publication number
20250079304
Publication date
Mar 6, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Liang-Shiuan PENG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
Publication number
20250070010
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ping-Jung Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
Publication number
20250070007
Publication date
Feb 27, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Ping-Jung Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
Publication number
20250070020
Publication date
Feb 27, 2025
NANYA TECHNOLOGY CORPORATION
TSE-YAO HUANG
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT
Publication number
20250054811
Publication date
Feb 13, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Chen CHU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
BOND STRUCTURE
Publication number
20250038106
Publication date
Jan 30, 2025
Advanced Semiconductor Engineering, Inc.
Chun-Wei CHIANG
H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE PROCESSING METHOD
Publication number
20250038048
Publication date
Jan 30, 2025
ASM IP HOLDING B.V.
Hyunchul Kim
H01 - BASIC ELECTRIC ELEMENTS
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SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...
Publication number
20250029876
Publication date
Jan 23, 2025
Tahoe Research, Ltd.
Kevin LIN
H01 - BASIC ELECTRIC ELEMENTS
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ACCESS LINE FORMATION FOR A MEMORY ARRAY
Publication number
20250031383
Publication date
Jan 23, 2025
Micron Technology, Inc.
Andrea Redaelli
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
Publication number
20250024680
Publication date
Jan 16, 2025
SK HYNIX INC.
Kang Sik CHOI
H01 - BASIC ELECTRIC ELEMENTS
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METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
Publication number
20250014908
Publication date
Jan 9, 2025
ASM IP HOLDING, B.V.
Timothee Blanquart
H01 - BASIC ELECTRIC ELEMENTS
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DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
Publication number
20240420950
Publication date
Dec 19, 2024
Applied Materials, Inc.
Xiang Ji
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...
Publication number
20240395610
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Company Limited
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
Publication number
20240395911
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Pei Yu Lu
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
Publication number
20240379548
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuang-Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240379413
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Chin LEE
H01 - BASIC ELECTRIC ELEMENTS
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SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240379436
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cai-Ling Wu
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED
Publication number
20240379419
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Lien HUANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
Publication number
20240379420
Publication date
Nov 14, 2024
Applied Materials, Inc.
Shi YOU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Transmission Line Structures for Three-Dimensional Integrated Circu...
Publication number
20240379592
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsiu-Ying Cho
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240379558
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Wei LI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240379560
Publication date
Nov 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shao-Kuan LEE
H01 - BASIC ELECTRIC ELEMENTS