Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics

Industry

CPC
H01L21/76837

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76837Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor structure and semiconductor...
- Patent number 12,165,879
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xinman Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 12,154,824
- Issue date Nov 26, 2024
- ASM IP Holding B.V.
- Hyunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the semiconductor...
- Patent number 12,137,563
- Issue date Nov 5, 2024
- SK hynix Inc.
- Kang Sik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,132,000
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap isolation for back-end-of-the-line semiconductor interconnec...
- Patent number 12,125,790
- Issue date Oct 22, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit isolation feature and method of forming the same
- Patent number 12,112,974
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Tang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition method and an apparatus for depositing a silicon-contain...
- Patent number 12,107,005
- Issue date Oct 1, 2024
- ASM IP Holding B.V.
- Zecheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line structures for three-dimensional integrated circu...
- Patent number 12,100,675
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for sealing a seam, semiconductor structure, and method for...
- Patent number 12,094,768
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,094,764
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for filling a gap and related systems and devices
- Patent number 12,094,769
- Issue date Sep 17, 2024
- ASM IP Holding B.V.
- Zecheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method for air spacer layer and semiconductor structure
- Patent number 12,087,617
- Issue date Sep 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kang You
- G11 - INFORMATION STORAGE
Information Patent Grant
Access line formation for a memory array
- Patent number 12,082,424
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Andrea Redaelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,074,060
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and methods of forming the same
- Patent number 12,068,254
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-resistance contact plugs and method forming same
- Patent number 12,068,191
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric gapfill using atomic layer deposition (ALD), inhibitor p...
- Patent number 12,049,699
- Issue date Jul 30, 2024
- Lam Research Corporation
- Joseph Abel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3-dimensional NOR memory array with very fine pitch: device and method
- Patent number 12,052,867
- Issue date Jul 30, 2024
- SUNRISE MEMORY CORPORATION
- Eli Harari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 12,051,620
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dielectric material fill and treatment
- Patent number 12,046,508
- Issue date Jul 23, 2024
- Applied Materials, Inc.
- Shi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,033,889
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device of dielectric layer
- Patent number 12,034,075
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Yun Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-fill with aluminum-containing films
- Patent number 12,018,363
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Mark Saly
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming material within openings extending into a semico...
- Patent number 12,020,979
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,014,979
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 12,009,301
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with staggered selective growth
- Patent number 12,009,253
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhi-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395911
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...
- Publication number 20240395610
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240379548
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379413
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379436
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED
- Publication number 20240379419
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20240379420
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transmission Line Structures for Three-Dimensional Integrated Circu...
- Publication number 20240379592
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379558
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379560
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371690
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-DIMENSIONAL NOR MEMORY ARRAY WITH VERY FINE PITCH: DEVICE AND METHOD
- Publication number 20240357817
- Publication date Oct 24, 2024
- Sunrise Memory Corporation
- Eli Harari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING A PLANARI...
- Publication number 20240347379
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING A PLANARI...
- Publication number 20240347378
- Publication date Oct 17, 2024
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure with Staggered Selective Growth
- Publication number 20240332073
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Zhi-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE OF DIELECTRIC LAYER
- Publication number 20240332419
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Yun PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER
- Publication number 20240321787
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240312836
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240312835
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE FOR ADVANCED INTERCONNECT
- Publication number 20240304547
- Publication date Sep 12, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Material Within Openings Extending into a Semico...
- Publication number 20240297068
- Publication date Sep 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20240297114
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240290718
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CIRCUIT PART AND METHOD OF MANUFACTURING THREE-DI...
- Publication number 20240282588
- Publication date Aug 22, 2024
- MAXELL, LTD.
- Akiko KITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND M...
- Publication number 20240266293
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Forming Semiconductor Structure And A Semiconductor
- Publication number 20240268104
- Publication date Aug 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chih-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND M...
- Publication number 20240266294
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240250031
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS

Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor structure and semiconductor...

Chemical direct pattern plating method

Substrate processing method

Semiconductor device

Self-aligning spacer tight pitch via

Semiconductor device and manufacturing method of the semiconductor...

Semiconductor device structure and methods of forming the same

Airgap isolation for back-end-of-the-line semiconductor interconnec...

Integrated circuit isolation feature and method of forming the same

Deposition method and an apparatus for depositing a silicon-contain...

Transmission line structures for three-dimensional integrated circu...

Method for sealing a seam, semiconductor structure, and method for...

Interconnect structure and methods of forming the same

Methods for filling a gap and related systems and devices

Formation method for air spacer layer and semiconductor structure

Access line formation for a memory array

Semiconductor device structure and methods of forming the same

Interconnection structure and methods of forming the same

Low-resistance contact plugs and method forming same

Dielectric gapfill using atomic layer deposition (ALD), inhibitor p...

3-dimensional NOR memory array with very fine pitch: device and method

Semiconductor structure and method for manufacturing the same

Method of dielectric material fill and treatment

Semiconductor device structure and methods of forming the same

Device of dielectric layer

Gap-fill with aluminum-containing films

Methods of forming material within openings extending into a semico...

Methods of forming semiconductor packages

Interconnect structure

Semiconductor structure with staggered selective growth

Patents Applicationslast 30 patents

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

Transmission Line Structures for Three-Dimensional Integrated Circu...

INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

3-DIMENSIONAL NOR MEMORY ARRAY WITH VERY FINE PITCH: DEVICE AND METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING A PLANARI...

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE INCLUDING A PLANARI...

Semiconductor Structure with Staggered Selective Growth

DEVICE OF DIELECTRIC LAYER

SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

WIRING STRUCTURE FOR ADVANCED INTERCONNECT

Methods of Forming Material Within Openings Extending into a Semico...

METHODS OF FORMING SEMICONDUCTOR PACKAGES

INTERCONNECT STRUCTURE AND METHOD FOR FORMING THE SAME

THREE-DIMENSIONAL CIRCUIT PART AND METHOD OF MANUFACTURING THREE-DI...

SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND M...

Method For Forming Semiconductor Structure And A Semiconductor

SEMICONDUCTOR DEVICE STRUCTURE WITH DIELECTRIC LINER PORTIONS AND M...

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

SEMICONDUCTOR DEVICE