Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics

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CPC
H01L21/76837

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76837Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming semiconductor structure and a semiconductor
- Patent number 12,324,148
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for filling gap using atomic layer deposition
- Patent number 12,312,686
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Eunhyoung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with etched landing pad surface
- Patent number 12,309,996
- Issue date May 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Yen-Ho Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures including air gaps
- Patent number 12,308,286
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and formation method thereof
- Patent number 12,293,971
- Issue date May 6, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhongdi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,293,925
- Issue date May 6, 2025
- Renesas Electronics Corporation
- Yuki Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing gap filling fluids and related systems and d...
- Patent number 12,293,942
- Issue date May 6, 2025
- ASM IP Holding B.V.
- Timothee Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gap patterning for metal-to-source/drain plugs in a semiconductor d...
- Patent number 12,293,947
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing a workpiece including low resistance interconne...
- Patent number 12,278,143
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with cushion structure and method for fabricat...
- Patent number 12,278,152
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with cushion structure and method for fabricat...
- Patent number 12,278,153
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gapfill of variable aspect ratio features with a composite PEALD an...
- Patent number 12,261,038
- Issue date Mar 25, 2025
- Lam Research Corporation
- Hu Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In-situ PECVD cap layer
- Patent number 12,252,782
- Issue date Mar 18, 2025
- Lam Research Corporation
- Jeremy David Fields
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3DIC with gap-fill structures and the method of manufacturing the same
- Patent number 12,249,566
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with porous dielectric layers and method for f...
- Patent number 12,243,817
- Issue date Mar 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having air gap and methods of formin...
- Patent number 12,230,537
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer chip scale packaging with ball attach before repassivation
- Patent number 12,230,539
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Daiki Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method thereof
- Patent number 12,224,205
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jingwen Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for depositing gap filling fluid
- Patent number 12,211,742
- Issue date Jan 28, 2025
- ASM IP Holding B.V.
- Timothee Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic devices comprising a compressive dielectric material, an...
- Patent number 12,205,900
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor packages
- Patent number 12,205,860
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect free germanium oxide gap fill
- Patent number 12,198,936
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method
- Patent number 12,191,158
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices including tiered stacks including conductive str...
- Patent number 12,191,254
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Sidhartha Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure and semiconductor...
- Patent number 12,165,879
- Issue date Dec 10, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xinman Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical direct pattern plating method
- Patent number 12,159,837
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Jiun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method
- Patent number 12,154,824
- Issue date Nov 26, 2024
- ASM IP Holding B.V.
- Hyunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,701
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligning spacer tight pitch via
- Patent number 12,142,525
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the semiconductor...
- Patent number 12,137,563
- Issue date Nov 5, 2024
- SK hynix Inc.
- Kang Sik Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192056
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...
- Publication number 20250192055
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL...
- Publication number 20250167041
- Publication date May 22, 2025
- STMicroelectronics International N.V.
- Fabrizio Fausto Renzo TOIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL
- Publication number 20250157935
- Publication date May 15, 2025
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES...
- Publication number 20250140691
- Publication date May 1, 2025
- Micron Technology, Inc.
- Sidhartha Gupta
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250125144
- Publication date Apr 17, 2025
- NANYA TECHNOLOGY CORPORATION
- Yubon CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT SHAPES FOR BACKSIDE METALS
- Publication number 20250118661
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
- Publication number 20250112169
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- FENG-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE INTERCONNECT STRUCTURES IN INTEGRA...
- Publication number 20250112145
- Publication date Apr 3, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...
- Publication number 20250112171
- Publication date Apr 3, 2025
- NANYA TECHNOLOGY CORPORATION
- FENG-WEN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR GAP FILL AND PLANARIZATION
- Publication number 20250079304
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Liang-Shiuan PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070010
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250070007
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ping-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20250070020
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT
- Publication number 20250054811
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND STRUCTURE
- Publication number 20250038106
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20250038048
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Hyunchul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCESS LINE FORMATION FOR A MEMORY ARRAY
- Publication number 20250031383
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Andrea Redaelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...
- Publication number 20250029876
- Publication date Jan 23, 2025
- Tahoe Research, Ltd.
- Kevin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20250024680
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Kang Sik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS
- Publication number 20250014908
- Publication date Jan 9, 2025
- ASM IP HOLDING, B.V.
- Timothee Blanquart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES
- Publication number 20240420950
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Xiang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...
- Publication number 20240395610
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395911
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240379548
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379413
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379436
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED
- Publication number 20240379419
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
- Publication number 20240379420
- Publication date Nov 14, 2024
- Applied Materials, Inc.
- Shi YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transmission Line Structures for Three-Dimensional Integrated Circu...
- Publication number 20240379592
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS

Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming semiconductor structure and a semiconductor

Method and apparatus for filling gap using atomic layer deposition

Semiconductor device with etched landing pad surface

Interconnect structures including air gaps

Semiconductor structure and formation method thereof

Semiconductor device and method of manufacturing the same

Methods for depositing gap filling fluids and related systems and d...

Gap patterning for metal-to-source/drain plugs in a semiconductor d...

Method of providing a workpiece including low resistance interconne...

Semiconductor device with cushion structure and method for fabricat...

Semiconductor device with cushion structure and method for fabricat...

Gapfill of variable aspect ratio features with a composite PEALD an...

In-situ PECVD cap layer

3DIC with gap-fill structures and the method of manufacturing the same

Semiconductor device with porous dielectric layers and method for f...

Semiconductor device structure having air gap and methods of formin...

Wafer chip scale packaging with ball attach before repassivation

Semiconductor memory device and manufacturing method thereof

Methods for depositing gap filling fluid

Electronic devices comprising a compressive dielectric material, an...

Sensor packages

Defect free germanium oxide gap fill

Semiconductor device and method

Electronic devices including tiered stacks including conductive str...

Method for manufacturing semiconductor structure and semiconductor...

Chemical direct pattern plating method

Substrate processing method

Semiconductor device

Self-aligning spacer tight pitch via

Semiconductor device and manufacturing method of the semiconductor...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH FILLING LAYER AND METHOD FOR FABRICATING...

BEOL INTEGRATION SOLUTION BASED ON DIRECT CMP TO IMPROVE INTERMETAL...

ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL

ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CUT SHAPES FOR BACKSIDE METALS

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...

METHODS AND APPARATUS TO IMPROVE INTERCONNECT STRUCTURES IN INTEGRA...

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND...

SEMICONDUCTOR GAP FILL AND PLANARIZATION

3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME

3DIC WITH GAP-FILL STRUCTURES AND THE METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT

BOND STRUCTURE

SUBSTRATE PROCESSING METHOD

ACCESS LINE FORMATION FOR A MEMORY ARRAY

SUBTRACTIVE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

METHODS AND SYSTEMS FOR TOPOGRAPHY-SELECTIVE DEPOSITIONS

DENSIFIED SEAM-FREE SILICON-CONTAINING MATERIAL GAP FILL PROCESSES

STRUCTURES FOR REDUCING GAP FILL DEFECTS IN A VERTICALLY STACKED SE...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING SEAM SEALED

METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT

Transmission Line Structures for Three-Dimensional Integrated Circu...