TREA

Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics

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Industry

  • CPC
  • H01L21/76837
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76837Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics
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