Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics

Industry

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H01L21/76837

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76837Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for preparing semiconductor device with air gap
- Patent number 11,978,662
- Issue date May 7, 2024
- NANYA TECHNOLOGY CORPORATION
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with inner spacer layer and method f...
- Patent number 11,973,129
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing a gap-fill layer by plasma-assisted deposition
- Patent number 11,972,944
- Issue date Apr 30, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,967,527
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,955,370
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,948,888
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Hongsik Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of metal films with tungsten liner
- Patent number 11,948,836
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Yu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure, method, layout, and system
- Patent number 11,935,825
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,908,796
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step process for flowable gap-fill film
- Patent number 11,901,222
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Maximillian Clemons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating interconnection using graphene
- Patent number 11,876,050
- Issue date Jan 16, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Ming Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully self-aligned subtractive etch
- Patent number 11,869,807
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Lili Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,860,550
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive plug and tab patterning with photobuckets for back end...
- Patent number 11,854,882
- Issue date Dec 26, 2023
- Tahoe Research, LTD.
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for Si gap fill by PECVD
- Patent number 11,848,232
- Issue date Dec 19, 2023
- Applied Materials, Inc.
- Xin Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gap patterning for metal-to-source/drain plugs in a semiconductor d...
- Patent number 11,842,930
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having isolation fins
- Patent number 11,837,651
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semicondcutor device using carbon containing sp...
- Patent number 11,804,404
- Issue date Oct 31, 2023
- NANYA TECHNOLOGY CORPORATION
- Chao-Wen Lay
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with polymer-based insulating material and met...
- Patent number 11,804,432
- Issue date Oct 31, 2023
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor with sidewall having reduced roughness
- Patent number 11,798,979
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device terminal interconnect structures
- Patent number 11,791,257
- Issue date Oct 17, 2023
- Intel Corporation
- Sairam Subramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of hafnium oxide within a high aspect ratio hole
- Patent number 11,791,153
- Issue date Oct 17, 2023
- ASM IP Holding B.V.
- Jiyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with fan-out feature
- Patent number 11,784,091
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ling-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect free germanium oxide gap fill
- Patent number 11,781,218
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing gap filling fluids and related systems and d...
- Patent number 11,776,846
- Issue date Oct 3, 2023
- ASM IP Holding B.V.
- Timothee Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor structure including low-resistance interconnect and i...
- Patent number 11,769,695
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement gate process for semiconductor devices
- Patent number 11,756,838
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-alignment etching of interconnect layers
- Patent number 11,749,561
- Issue date Sep 5, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and method
- Patent number 11,742,254
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DOPING FREE CONNECTION STRUCTURES AND METHODS
- Publication number 20240145298
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate with Differing Dielectric Constants
- Publication number 20240145392
- Publication date May 2, 2024
- Avago Technologies International Sales Pte. Limited
- Dharmendra Saraswat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20240136291
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240128120
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-STEP PROCESS FOR FLOWABLE GAP-FILL FILM
- Publication number 20240128121
- Publication date Apr 18, 2024
- Applied Materials, Inc.
- Maximillian CLEMONS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUG IN A METAL LAYER
- Publication number 20240113017
- Publication date Apr 4, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM
- Publication number 20240105508
- Publication date Mar 28, 2024
- Intel Corporation
- Jitendra Kumar Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240096797
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- MINJAE KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20240085803
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...
- Publication number 20240087960
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A CONDUCTI...
- Publication number 20240079456
- Publication date Mar 7, 2024
- SK HYNIX INC.
- Jae Man YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES...
- Publication number 20240055350
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Mark S. Swenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CUSHION STRUCTURE AND METHOD FOR FABRICAT...
- Publication number 20240047287
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CUSHION STRUCTURE AND METHOD FOR FABRICAT...
- Publication number 20240047286
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20240030133
- Publication date Jan 25, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...
- Publication number 20240030132
- Publication date Jan 25, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY DECOMPOSABLE FILL MATERIAL
- Publication number 20240030063
- Publication date Jan 25, 2024
- Brewer Science, Inc.
- Daniel Patrick Sweat
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS FOR DEPOSITING GAP FILLING FLUIDS AND RELATED SYSTEMS AND D...
- Publication number 20240030064
- Publication date Jan 25, 2024
- ASM IP HOLDING B.V.
- Timothee Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE WITH ETCHED LANDING PAD SURFACE
- Publication number 20240023307
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- YEN-HO CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ETCHED LANDING PAD SURFACE AND MANUFACTUR...
- Publication number 20240023308
- Publication date Jan 18, 2024
- NANYA TECHNOLOGY CORPORATION
- YEN-HO CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240006232
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Chao-Wen LAY
- G11 - INFORMATION STORAGE
Information Patent Application
DEFECT FREE GERMANIUM OXIDE GAP FILL
- Publication number 20230407468
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Huiyuan Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR GAP
- Publication number 20230386903
- Publication date Nov 30, 2023
- NANYA TECHNOLOGY CORPORATION
- LIANG-PIN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES
- Publication number 20230386937
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...
- Publication number 20230386901
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...
- Publication number 20230378064
- Publication date Nov 23, 2023
- Changxin Memory Technologies, Inc.
- Deyuan XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL, AN...
- Publication number 20230378069
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH FAN-OUT FEATURE
- Publication number 20230369115
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ling-Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Resistance Interconnect
- Publication number 20230369114
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS
- Publication number 20230360965
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Suketu Arun Parikh
- H01 - BASIC ELECTRIC ELEMENTS

Filling up the space between adjacent conductive structures; Gap-filling properties of dielectrics

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for preparing semiconductor device with air gap

Semiconductor device structure with inner spacer layer and method f...

Method for depositing a gap-fill layer by plasma-assisted deposition

Fully aligned subtractive processes and electronic devices therefrom

Via for semiconductor device connection and methods of forming the...

Semiconductor devices and methods of manufacture

Semiconductor device

Deposition of metal films with tungsten liner

Contact structure, method, layout, and system

Semiconductor device and method of fabricating the same

Multi-step process for flowable gap-fill film

Method for fabricating interconnection using graphene

Fully self-aligned subtractive etch

Multi-metal fill with self-aligned patterning and dielectric with v...

Subtractive plug and tab patterning with photobuckets for back end...

Method for Si gap fill by PECVD

Gap patterning for metal-to-source/drain plugs in a semiconductor d...

Semiconductor device having isolation fins

Method of forming a semicondcutor device using carbon containing sp...

Semiconductor device with polymer-based insulating material and met...

Integrated capacitor with sidewall having reduced roughness

Device terminal interconnect structures

Deposition of hafnium oxide within a high aspect ratio hole

Structure and formation method of chip package with fan-out feature

Defect free germanium oxide gap fill

Methods for depositing gap filling fluids and related systems and d...

Semiconductor structure including low-resistance interconnect and i...

Replacement gate process for semiconductor devices

Self-alignment etching of interconnect layers

Sensor package and method

Patents Applicationslast 30 patents

DOPING FREE CONNECTION STRUCTURES AND METHODS

Substrate with Differing Dielectric Constants

LOW-STRESS PASSIVATION LAYER

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

MULTI-STEP PROCESS FOR FLOWABLE GAP-FILL FILM

PLUG IN A METAL LAYER

INTEGRATED CIRCUIT DEVICES WITH CONTACTS USING NITRIDIZED MOLYBDENUM

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

GAP PATTERNING FOR METAL-TO-SOURCE/DRAIN PLUGS IN A SEMICONDUCTOR D...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING A CONDUCTI...

ELECTRONIC DEVICES INCLUDING STACKS INCLUDING CONDUCTIVE STRUCTURES...

SEMICONDUCTOR DEVICE WITH CUSHION STRUCTURE AND METHOD FOR FABRICAT...

SEMICONDUCTOR DEVICE WITH CUSHION STRUCTURE AND METHOD FOR FABRICAT...

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

SEMICONDUCTOR DEVICE WITH POROUS DIELECTRIC LAYERS AND METHOD FOR F...

THERMALLY DECOMPOSABLE FILL MATERIAL

METHODS FOR DEPOSITING GAP FILLING FLUIDS AND RELATED SYSTEMS AND D...

SEMICONDUCTOR DEVICE WITH ETCHED LANDING PAD SURFACE

SEMICONDUCTOR DEVICE WITH ETCHED LANDING PAD SURFACE AND MANUFACTUR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DEFECT FREE GERMANIUM OXIDE GAP FILL

METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH AIR GAP

REPLACEMENT GATE PROCESS FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...

SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...

ELECTRONIC DEVICES COMPRISING A COMPRESSIVE DIELECTRIC MATERIAL, AN...

PACKAGE STRUCTURE WITH FAN-OUT FEATURE

Low-Resistance Interconnect

SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS