Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device

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H01L23/18

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming package structure
- Patent number 12,170,236
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,142,576
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,131,974
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system and related methods
- Patent number 12,033,904
- Issue date Jul 9, 2024
- Semiconductor Components Industries, L.L.C.
- Yushuang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including a base and a lid disposed over the base...
- Patent number 12,002,780
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuei-Sung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 11,984,377
- Issue date May 14, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,923,259
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding device
- Patent number 11,901,250
- Issue date Feb 13, 2024
- STMicroelectron S.r.l.
- Pierangelo Magni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power converter
- Patent number 11,855,033
- Issue date Dec 26, 2023
- Mitsubishi Electric Corporation
- Haruko Hitomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,810,831
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with marking pattern
- Patent number 11,810,865
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Seungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 11,664,286
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,605,597
- Issue date Mar 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,600,608
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Jichul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and electronic device
- Patent number 11,594,465
- Issue date Feb 28, 2023
- Beijing Baidu Netcom Science and Technology Co., Ltd
- Zhenghui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress tuned stiffeners for micro electronics package warpage control
- Patent number 11,581,231
- Issue date Feb 14, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil-based package with distance compensation
- Patent number 11,574,858
- Issue date Feb 7, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Erwin Yacoub-George
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,521,905
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for scribe seal structures
- Patent number 11,515,209
- Issue date Nov 29, 2022
- Texas Instruments Incorporated
- Subhashish Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,444,013
- Issue date Sep 13, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,424,173
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,424,178
- Issue date Aug 23, 2022
- Mitsubishi Electric Corporation
- Satoshi Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and manufacturing method having a mesh gas-permea...
- Patent number 11,373,927
- Issue date Jun 28, 2022
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Build-up package for integrated circuit devices, and methods of mak...
- Patent number 11,367,667
- Issue date Jun 21, 2022
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit product customizations for identification code v...
- Patent number 11,315,883
- Issue date Apr 26, 2022
- Advanced Micro Devices, Inc.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided cooled molded semiconductor package
- Patent number 11,302,613
- Issue date Apr 12, 2022
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation-hardened package for an electronic device
- Patent number 11,276,619
- Issue date Mar 15, 2022
- AMS International AG
- Jens Hofrichter
- B82 - NANO-TECHNOLOGY
Information Patent Grant
High resistivity silicon-on-insulator structure and method of manuf...
- Patent number 11,145,538
- Issue date Oct 12, 2021
- GlobalWafers Co., Ltd.
- Jeffery L. Libbert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device packaging
- Patent number 11,133,261
- Issue date Sep 28, 2021
- Intel Corporation
- Eng Huat Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization of semiconductor packages and structures resulting th...
- Patent number 11,127,644
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421011
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- WanSun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...
- Publication number 20240395760
- Publication date Nov 28, 2024
- Samsung Electronics Co., LTD
- Daeyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240379491
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LAYERS WITH FILLING STRUCTURES
- Publication number 20240355689
- Publication date Oct 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Qingyi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE PACKAGE STRUCTURE
- Publication number 20240282739
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUEI-SUNG CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE
- Publication number 20240186198
- Publication date Jun 6, 2024
- STMicroelectronics S.r.l
- Pierangelo MAGNI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240153834
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Jun Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Molded Heat Dissipation Plate
- Publication number 20240145325
- Publication date May 2, 2024
- Infineon Technologies Austria AG
- Joon Seo Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES
- Publication number 20240063066
- Publication date Feb 22, 2024
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240055307
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Sojeong HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CUSHION STRUCTURE AND METHOD FOR FABRICAT...
- Publication number 20240047287
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CUSHION STRUCTURE AND METHOD FOR FABRICAT...
- Publication number 20240047286
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230275039
- Publication date Aug 31, 2023
- JCET GROUP CO., LTD.
- YAOJIAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20230253276
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230223352
- Publication date Jul 13, 2023
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH ADAPTIVE MULTI-LAYER ENCAPSULATION...
- Publication number 20230197543
- Publication date Jun 22, 2023
- Intel Corporation
- Liang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER SEAL RING
- Publication number 20230187294
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING HOLLOW FILLER MATERIALS
- Publication number 20230089928
- Publication date Mar 23, 2023
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230075735
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230067725
- Publication date Mar 2, 2023
- Fuji Electric Co., Ltd.
- Akira MOROZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230011041
- Publication date Jan 12, 2023
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005832
- Publication date Jan 5, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...
- Publication number 20230005802
- Publication date Jan 5, 2023
- Micron Technology, Inc.
- Hong Wan Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method of Forming Same
- Publication number 20220359329
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...
- Publication number 20220332868
- Publication date Oct 20, 2022
- Mitsubishi Gas Chemical Company, Inc.
- Takahito SEKIDO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220301954
- Publication date Sep 22, 2022
- Fuji Electric Co., Ltd.
- Taichi ITOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20220301970
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER PARTICLE HAVING MORPHOLOGICAL ADHESION PROMOTER SHELL ON CORE
- Publication number 20220275217
- Publication date Sep 1, 2022
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20220199476
- Publication date Jun 23, 2022
- MITSUBISHI ELECTRIC CORPORATION
- Ryuichiro HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MARKING PATTERN
- Publication number 20220165678
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- Seungmin KIM
- H01 - BASIC ELECTRIC ELEMENTS

Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for forming package structure

Semiconductor package structure and method for manufacturing the same

Semiconductor package and method of manufacturing semiconductor pac...

Semiconductor package system and related methods

Package structure including a base and a lid disposed over the base...

IC die and heat spreaders with solderable thermal interface structu...

Package structure and method of manufacturing the same

Method of manufacturing semiconductor devices and corresponding device

Power semiconductor module and power converter

Integrated circuit package and method of forming same

Semiconductor package with marking pattern

Method for forming package structure

Semiconductor package structure and method for manufacturing the same

Semiconductor package

Chip package and electronic device

Stress tuned stiffeners for micro electronics package warpage control

Foil-based package with distance compensation

Package structure and method of manufacturing the same

Methods and apparatus for scribe seal structures

Semiconductor device and manufacturing method thereof

Integrated circuit package and method of forming same

Semiconductor module

Package substrate and manufacturing method having a mesh gas-permea...

Build-up package for integrated circuit devices, and methods of mak...

Integrated circuit product customizations for identification code v...

Double-sided cooled molded semiconductor package

Radiation-hardened package for an electronic device

High resistivity silicon-on-insulator structure and method of manuf...

Electronic device packaging

Planarization of semiconductor packages and structures resulting th...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

STACKED LAYERS WITH FILLING STRUCTURES

PACKAGE STRUCTURE AND METHOD OF FORMING THE PACKAGE STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE

SEMICONDUCTOR PACKAGES

Semiconductor Package with Molded Heat Dissipation Plate

TEMPLATE STRUCTURE FOR QUASI-MONOLITHIC DIE ARCHITECTURES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE WITH CUSHION STRUCTURE AND METHOD FOR FABRICAT...

SEMICONDUCTOR DEVICE WITH CUSHION STRUCTURE AND METHOD FOR FABRICAT...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONIC ASSEMBLIES WITH ADAPTIVE MULTI-LAYER ENCAPSULATION...

SEMICONDUCTOR WAFER SEAL RING

SEMICONDUCTOR DEVICES HAVING HOLLOW FILLER MATERIALS

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAK...

Integrated Circuit Package and Method of Forming Same

FILM, LAMINATE, SEMICONDUCTOR WAFER WITH FILM LAYER, SUBSTRATE FOR...

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

FILLER PARTICLE HAVING MORPHOLOGICAL ADHESION PROMOTER SHELL ON CORE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR PACKAGE WITH MARKING PATTERN