Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal module for a semiconductor package and methods of forming t...
- Patent number 12,362,258
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package structure
- Patent number 12,362,256
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber
- Patent number 12,345,473
- Issue date Jul 1, 2025
- Cooler Master Co., Ltd.
- Lei-Lei Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device
- Patent number 12,347,746
- Issue date Jul 1, 2025
- AURAS TECHNOLOGY CO., LTD.
- Cheng-Ju Chang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Two-phase liquid-cooled electrical power apparatus
- Patent number 12,349,325
- Issue date Jul 1, 2025
- Raytheon Company
- Stephen B. Kuznetsov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip cooling package with multiple fluid paths
- Patent number 12,341,082
- Issue date Jun 24, 2025
- BAIDU USA LLC
- Tianyi Gao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for cooling electronic circuits
- Patent number 12,341,075
- Issue date Jun 24, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,341,079
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 12,341,080
- Issue date Jun 24, 2025
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,341,081
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink, active energy irradiation device, and active energy irrad...
- Patent number 12,338,987
- Issue date Jun 24, 2025
- Hamamatsu Photonics K.K.
- Kyoichi Murayama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Component cooler for a computing device
- Patent number 12,336,147
- Issue date Jun 17, 2025
- Advanced Micro Devices, Inc.
- Christopher M. Helberg
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat transfer device for high heat flux applications and related me...
- Patent number 12,332,000
- Issue date Jun 17, 2025
- University of Virginia Patent Foundation
- Hossein Haj-Hariri
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
- Patent number 12,322,676
- Issue date Jun 3, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a pulsating heat pipe
- Patent number 12,322,675
- Issue date Jun 3, 2025
- Siemens Aktiengesellschaft
- Florian Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber heat spreader for bare die processors
- Patent number 12,315,779
- Issue date May 27, 2025
- Amazon Technologies, Inc.
- Luke Thomas Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader for a semiconductor package
- Patent number 12,315,781
- Issue date May 27, 2025
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,300,573
- Issue date May 13, 2025
- Mediatek Inc.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 12,300,574
- Issue date May 13, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,298,082
- Issue date May 13, 2025
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation member
- Patent number 12,292,238
- Issue date May 6, 2025
- Kyocera Corporation
- Yuichi Abe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic circuit comprising a RF switches having reduced parasiti...
- Patent number 12,293,981
- Issue date May 6, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane Monfray
- G11 - INFORMATION STORAGE
Information Patent Grant
Two-phase immersion-cooling heat-dissipation composite structure ha...
- Patent number 12,289,865
- Issue date Apr 29, 2025
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Chun-Te Wu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,278,154
- Issue date Apr 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Se Man Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip cooling platform based on micro-nano structure
- Patent number 12,278,164
- Issue date Apr 15, 2025
- Guangdong Ocean University
- Haowei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 12,274,036
- Issue date Apr 8, 2025
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Compliant thermal management devices, systems, and methods of fabri...
- Patent number 12,262,509
- Issue date Mar 25, 2025
- Georgios Karamanis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MOR...
- Publication number 20250233047
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250233048
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250233053
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY WITH BACK PLATE COMPRESSION
- Publication number 20250226280
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTURE
- Publication number 20250226287
- Publication date Jul 10, 2025
- GUANGDONG OCEAN UNIVERSITY
- Haowei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
- Publication number 20250227888
- Publication date Jul 10, 2025
- Marvell Asia Pte Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL UNIT
- Publication number 20250210454
- Publication date Jun 26, 2025
- ROBERT BOSCH GmbH
- Maximilian Amberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT COMPRISING A RF SWITCHES HAVING REDUCED PARASITI...
- Publication number 20250210550
- Publication date Jun 26, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane MONFRAY
- G11 - INFORMATION STORAGE
Information Patent Application
PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...
- Publication number 20250210451
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...
- Publication number 20250210459
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION FOR INTEGRATED CIRCUIT PACKAGE
- Publication number 20250210450
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yen Lan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE
- Publication number 20250212366
- Publication date Jun 26, 2025
- Huawei Technologies Co., Ltd
- Leonid Leonardovich VASILIEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20250210452
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO VAPOR CHAMBER LIDS
- Publication number 20250210453
- Publication date Jun 26, 2025
- ADVANCED MICRO DEVICES, INC.
- Joshua Taylor Knight
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20250210458
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflowable Vapor Chamber Lid
- Publication number 20250201663
- Publication date Jun 19, 2025
- Marvell Asia Pte Ltd.
- Alaba Bamido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250201647
- Publication date Jun 19, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Shih-Chieh LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
- Publication number 20250201668
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20250191997
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structural Thermal Interface Pad
- Publication number 20250191996
- Publication date Jun 12, 2025
- Yuci Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING V...
- Publication number 20250185214
- Publication date Jun 5, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinichiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill for Large Area Attaches for Semiconductor Packages
- Publication number 20250183119
- Publication date Jun 5, 2025
- Wolfspeed, Inc.
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174516
- Publication date May 29, 2025
- Fuji Electric Co., Ltd.
- Tsubasa WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
- Publication number 20250167074
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20250157879
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Dongkyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL...
- Publication number 20250157878
- Publication date May 15, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250157880
- Publication date May 15, 2025
- Hitachi Astemo, Ltd.
- Fusanori NISHIKIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED COMBINED MICROCHANNEL AND HEAT PIPES FOR ELECTRONICS COOLING
- Publication number 20250157881
- Publication date May 15, 2025
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20250159841
- Publication date May 15, 2025
- National Tsing-Hua University
- Shwin-Chung Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250157865
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Yun MA
- H01 - BASIC ELECTRIC ELEMENTS

Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded cooling systems for advanced device packaging and methods...

Thermal module for a semiconductor package and methods of forming t...

Method for forming semiconductor package structure

Vapor chamber

Heat dissipation device

Two-phase liquid-cooled electrical power apparatus

Chip cooling package with multiple fluid paths

Systems and methods for cooling electronic circuits

Package structure and manufacturing method thereof

Semiconductor device stack-up with bulk substrate material to mitig...

Semiconductor device and manufacturing method thereof

Heatsink, active energy irradiation device, and active energy irrad...

Component cooler for a computing device

Heat transfer device for high heat flux applications and related me...

Baffles for electronic circuits immersed in cooling fluid in a tank

Electronic module comprising a pulsating heat pipe

Vapor chamber heat spreader for bare die processors

Heat spreader for a semiconductor package

Solid metal foam thermal interface material

Semiconductor device and manufacturing method thereof

Adhesive and thermal interface material on a plurality of dies cove...

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Heat dissipation member

Electronic circuit comprising a RF switches having reduced parasiti...

Two-phase immersion-cooling heat-dissipation composite structure ha...

Semiconductor device and a method of manufacturing a semiconductor...

Chip cooling platform based on micro-nano structure

Heatsink for co-packaged optical switch rack package

Compliant thermal management devices, systems, and methods of fabri...

Semiconductor package having an encapulant comprising conductive fi...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE WITH HEAT DISSIPATION STRUCTURE HAVING ONE OR MOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

PACKAGE ASSEMBLY WITH BACK PLATE COMPRESSION

NOVEL CHIP COOLING PLATFORM BASED ON MICRO-NANO STRUCTURE

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

CONTROL UNIT

ELECTRONIC CIRCUIT COMPRISING A RF SWITCHES HAVING REDUCED PARASITI...

PACKAGE STRUCTURE WITH MOLDING LAYER AND METHOD FOR MANUFACTURING T...

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...

HEAT DISSIPATION FOR INTEGRATED CIRCUIT PACKAGE

VAPOR CHAMBER, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

MICRO VAPOR CHAMBER LIDS

THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE

Reflowable Vapor Chamber Lid

PACKAGE STRUCTURE

STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

Structural Thermal Interface Pad

VAPOR CHAMBER, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING V...

Underfill for Large Area Attaches for Semiconductor Packages

SEMICONDUCTOR DEVICE

PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE

SEMICONDUCTOR APPARATUS

ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL...

POWER CONVERSION DEVICE

OPTIMIZED COMBINED MICROCHANNEL AND HEAT PIPES FOR ELECTRONICS COOLING

HEAT DISSIPATION DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...