Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,165,951
- Issue date Dec 10, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pad, semiconductor chip including the same and method of ma...
- Patent number 12,159,859
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Jimin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structures for three-dimensional system on integra...
- Patent number 12,154,842
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device assembly
- Patent number 12,146,714
- Issue date Nov 19, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Alignment mechanism
- Patent number 12,140,625
- Issue date Nov 12, 2024
- Delta Design, Inc.
- Jerry Ihor Tustaniwskyj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for embedded integrated circuit devices
- Patent number 12,142,543
- Issue date Nov 12, 2024
- Intel Corporation
- Johanna Swan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance two-phase cooling apparatus for portable applications
- Patent number 12,140,385
- Issue date Nov 12, 2024
- PiMEMS, Inc.
- Payam Bozorgi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Interlayer of sub-structure having elevations and further sub-struc...
- Patent number 12,136,578
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-activated pump with integrated evaporator for electronic chip...
- Patent number 12,133,363
- Issue date Oct 29, 2024
- Hamfop Technologies LLC
- Mudasir Ahmad
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Device and method for a two phase heat transfer
- Patent number 12,130,093
- Issue date Oct 29, 2024
- National University of Singapore
- Poh Seng Lee
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,117,244
- Issue date Oct 15, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat pipe with in-plane heat spreader and loading mechanism
- Patent number 12,114,466
- Issue date Oct 8, 2024
- Intel Corporation
- Penchala Pratap Binni Boyina
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling of power semiconductors
- Patent number 12,107,032
- Issue date Oct 1, 2024
- ABB Schweiz AG
- Colin Tschida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoelectric composite, preparation method therefor, and thermoel...
- Patent number 12,108,677
- Issue date Oct 1, 2024
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Tae Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for optimization of vapor transport in a thermal...
- Patent number 12,104,856
- Issue date Oct 1, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 12,100,638
- Issue date Sep 24, 2024
- Denso Corporation
- Shohei Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing the same
- Patent number 12,100,641
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing device
- Patent number 12,094,802
- Issue date Sep 17, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS-based active cooling systems
- Patent number 12,089,374
- Issue date Sep 10, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Hybrid thermal interface material (TIM) with reduced 3D thermal res...
- Patent number 12,087,658
- Issue date Sep 10, 2024
- Intel Corporation
- Pooya Tadayon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat exchanger
- Patent number 12,074,089
- Issue date Aug 27, 2024
- Denso Corporation
- Xiaolin Guo
- B08 - CLEANING
Information Patent Grant
Method of constructing a circuitry assembly for heat dispersal usin...
- Patent number 12,068,223
- Issue date Aug 20, 2024
- Elta Systems Ltd.
- Michael Kedem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling electronics
- Patent number 12,068,422
- Issue date Aug 20, 2024
- Simmonds Precision Products, Inc.
- Craig R. Bibeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal material with high capacity and high conductivity, method f...
- Patent number 12,060,301
- Issue date Aug 13, 2024
- Thales
- Matthieu Pawlik
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Semiconductor packages including recesses to contain solder
- Patent number 12,062,589
- Issue date Aug 13, 2024
- Infineon Technologies AG
- Adrian Lis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device assemblies and cooling devices for cooling heat-genera...
- Patent number 12,062,593
- Issue date Aug 13, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling in conductors for chips
- Patent number 12,063,763
- Issue date Aug 13, 2024
- Hamilton Sundstrand Corporation
- Jeffrey Ewanchuk
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421034
- Publication date Dec 19, 2024
- Samsung Electronics Co., LTD
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interlayer of Sub-structure Having Elevations and Further Sub-struc...
- Publication number 20240413033
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATION DEVICES
- Publication number 20240413053
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Youngjoon Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation Structures
- Publication number 20240413052
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...
- Publication number 20240404916
- Publication date Dec 5, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DATA PROCESSING DEVICE
- Publication number 20240404915
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...
- Publication number 20240395770
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT MODULE OF AN INTEGRATED CIRCUIT ASSEMBLY
- Publication number 20240395660
- Publication date Nov 28, 2024
- Apple Inc.
- Halil Berberoglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM...
- Publication number 20240395652
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Top-Mounted Heat Dissipation Photovoltaic Inverter Device
- Publication number 20240389282
- Publication date Nov 21, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Maofan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...
- Publication number 20240387321
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTE...
- Publication number 20240389274
- Publication date Nov 21, 2024
- Deeia Inc.
- Himanshu Pokharna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE HEAT SINK SIDE ATTACH METHODOLOGY
- Publication number 20240387320
- Publication date Nov 21, 2024
- Cisco Technology, Inc.
- Gary K. CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20240387322
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387323
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20240379496
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371721
- Publication date Nov 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS-BASED ACTIVE COOLING SYSTEMS
- Publication number 20240373593
- Publication date Nov 7, 2024
- Frore Systems Inc.
- Prabhu Sathyamurthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240371720
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- OhYoung Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Controlling Distribution of Liqu...
- Publication number 20240371719
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- JongChan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT PLANES
- Publication number 20240369306
- Publication date Nov 7, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATION
- Publication number 20240371716
- Publication date Nov 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Li TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE WITH A SUBSTRATE AND AT LEAST ONE SEMICONDUCTO...
- Publication number 20240363487
- Publication date Oct 31, 2024
- SIEMENS AKTIENGESELLSCHAFT
- VOLKER MÜLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...
- Publication number 20240355759
- Publication date Oct 24, 2024
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...
- Publication number 20240355778
- Publication date Oct 24, 2024
- Intel Corporation
- Sameer SHEKHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20240347411
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20240347442
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347521
- Publication date Oct 17, 2024
- DENSO CORPORATION
- Yoshitaka KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS

Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

RF devices with enhanced performance and methods of forming the same

Thermal pad, semiconductor chip including the same and method of ma...

High speed network device with orthogonal pluggable optics modules

Heat dissipation structures for three-dimensional system on integra...

Heat dissipation device assembly

Alignment mechanism

Thermal management solutions for embedded integrated circuit devices

High performance two-phase cooling apparatus for portable applications

Interlayer of sub-structure having elevations and further sub-struc...

Heat-activated pump with integrated evaporator for electronic chip...

Device and method for a two phase heat transfer

Vapor chamber and manufacturing method of the same

Heat pipe with in-plane heat spreader and loading mechanism

Cooling of power semiconductors

Thermoelectric composite, preparation method therefor, and thermoel...

Method and device for optimization of vapor transport in a thermal...

Semiconductor device

Electronic package and method for manufacturing the same

Data processing device

MEMS-based active cooling systems

Hybrid thermal interface material (TIM) with reduced 3D thermal res...

Heat exchanger

Method of constructing a circuitry assembly for heat dispersal usin...

Systems and methods for cooling electronics

Dummy die structures of a packaged integrated circuit device

Thermal material with high capacity and high conductivity, method f...

Semiconductor packages including recesses to contain solder

Power device assemblies and cooling devices for cooling heat-genera...

Cooling in conductors for chips

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

Interlayer of Sub-structure Having Elevations and Further Sub-struc...

HEAT RADIATION DEVICES

Heat Dissipation Structures

PRESSURE RELIEF VALVE AND ADSORBENT CHAMBER FOR TWO-PHASE IMMERSION...

DATA PROCESSING DEVICE

METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL...

THERMAL MANAGEMENT MODULE OF AN INTEGRATED CIRCUIT ASSEMBLY

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

Top-Mounted Heat Dissipation Photovoltaic Inverter Device

THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...

COMPOSITE THERMAL INTERFACE MATERIALS AND ASSOCIATED DEVICES, SYSTE...

REMOTE HEAT SINK SIDE ATTACH METHODOLOGY

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

MEMS-BASED ACTIVE COOLING SYSTEMS

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

Semiconductor Device and Method of Controlling Distribution of Liqu...

THERMAL MANAGEMENT PLANES

CHIP PACKAGE STRUCTURE AND FABRICATION

SEMICONDUCTOR MODULE WITH A SUBSTRATE AND AT LEAST ONE SEMICONDUCTO...

LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DA...

EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESS...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...