Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

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H01L23/42

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
- Patent number 12,322,676
- Issue date Jun 3, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising a pulsating heat pipe
- Patent number 12,322,675
- Issue date Jun 3, 2025
- Siemens Aktiengesellschaft
- Florian Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber heat spreader for bare die processors
- Patent number 12,315,779
- Issue date May 27, 2025
- Amazon Technologies, Inc.
- Luke Thomas Gregory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader for a semiconductor package
- Patent number 12,315,781
- Issue date May 27, 2025
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid metal foam thermal interface material
- Patent number 12,300,567
- Issue date May 13, 2025
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,300,573
- Issue date May 13, 2025
- Mediatek Inc.
- Bo-Jiun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 12,300,574
- Issue date May 13, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber, electronic device, metallic sheet for vapor chamber...
- Patent number 12,298,082
- Issue date May 13, 2025
- Dai Nippon Printing Co., Ltd.
- Shinichiro Takahashi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation member
- Patent number 12,292,238
- Issue date May 6, 2025
- Kyocera Corporation
- Yuichi Abe
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic circuit comprising a RF switches having reduced parasiti...
- Patent number 12,293,981
- Issue date May 6, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane Monfray
- G11 - INFORMATION STORAGE
Information Patent Grant
Two-phase immersion-cooling heat-dissipation composite structure ha...
- Patent number 12,289,865
- Issue date Apr 29, 2025
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Chun-Te Wu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device and a method of manufacturing a semiconductor...
- Patent number 12,278,154
- Issue date Apr 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Se Man Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip cooling platform based on micro-nano structure
- Patent number 12,278,164
- Issue date Apr 15, 2025
- Guangdong Ocean University
- Haowei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 12,274,036
- Issue date Apr 8, 2025
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Compliant thermal management devices, systems, and methods of fabri...
- Patent number 12,262,509
- Issue date Mar 25, 2025
- Georgios Karamanis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiator module and method of manufacturing the same
- Patent number 12,261,096
- Issue date Mar 25, 2025
- Denso Corporation
- Shinya Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material (PCM)-based conductive thermal actuator switc...
- Patent number 12,258,948
- Issue date Mar 25, 2025
- Raytheon Company
- Andrew J. Pitts
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sinks with beyond-board fins
- Patent number 12,262,514
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including liquid alloy thermal interface material...
- Patent number 12,255,119
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising a thermal interface materia...
- Patent number 12,237,242
- Issue date Feb 25, 2025
- Infineon Technologies Austria AG
- Martin Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay module with thermal storage
- Patent number 12,237,243
- Issue date Feb 25, 2025
- GE Aviation Systems LLC
- Rinaldo Luigi Miorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-transfer member and cooling system
- Patent number 12,222,166
- Issue date Feb 11, 2025
- Kyushu University, National University Corporation
- Yasuyuki Takata
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Substrate, electronic device, and method for manufacturing substrate
- Patent number 12,218,085
- Issue date Feb 4, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hirofumi Makino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,211,762
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Yun Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-noise heat exchanger
- Patent number 12,207,443
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion apparatus
- Patent number 12,199,010
- Issue date Jan 14, 2025
- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
- Hayata Onaga
- G01 - MEASURING TESTING
Information Patent Grant
System for electrically decoupled, homogeneous temperature control...
- Patent number 12,198,907
- Issue date Jan 14, 2025
- Meyer Burger (Germany) GmbH
- Christian Böhm
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VAPOR CHAMBER, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING V...
- Publication number 20250185214
- Publication date Jun 5, 2025
- DAI NIPPON PRINTING CO., LTD.
- Shinichiro TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill for Large Area Attaches for Semiconductor Packages
- Publication number 20250183119
- Publication date Jun 5, 2025
- Wolfspeed, Inc.
- Sayan Seal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250174516
- Publication date May 29, 2025
- Fuji Electric Co., Ltd.
- Tsubasa WATAKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE
- Publication number 20250167074
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sam Vaziri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20250157879
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Dongkyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL...
- Publication number 20250157878
- Publication date May 15, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION DEVICE
- Publication number 20250157880
- Publication date May 15, 2025
- Hitachi Astemo, Ltd.
- Fusanori NISHIKIMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED COMBINED MICROCHANNEL AND HEAT PIPES FOR ELECTRONICS COOLING
- Publication number 20250157881
- Publication date May 15, 2025
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250157865
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Yun MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20250159841
- Publication date May 15, 2025
- National Tsing-Hua University
- Shwin-Chung Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250149402
- Publication date May 8, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Ting-An Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE S...
- Publication number 20250149403
- Publication date May 8, 2025
- Wistron Corporation
- Tung-Yang TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION BY NANO PIPES
- Publication number 20250140644
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250140643
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20250140697
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20250132220
- Publication date Apr 24, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Hyeon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED PACKAGING FOR FLIP-CHIP DEVICES
- Publication number 20250132222
- Publication date Apr 24, 2025
- Qorvo US, Inc.
- Matthew Tyler Irvine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER HIGH ASPECT RATIO MICROCHANNEL DEVICE
- Publication number 20250123058
- Publication date Apr 17, 2025
- ThermAvant Technologies, LLC
- Lily Ellebracht
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
INVERTED MEMORY STACK
- Publication number 20250125220
- Publication date Apr 17, 2025
- ADVANCED MICRO DEVICES, INC.
- Gabriel LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...
- Publication number 20250118615
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID HEAT SINK
- Publication number 20250118627
- Publication date Apr 10, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Hans Knauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE
- Publication number 20250118628
- Publication date Apr 10, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Qingdong CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...
- Publication number 20250112118
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- VLADIMIR DANOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...
- Publication number 20250112105
- Publication date Apr 3, 2025
- Micron Technology, Inc.
- Chan H. YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION APPARATUS
- Publication number 20250105092
- Publication date Mar 27, 2025
- Panasonic Automotive Systems Co., Ltd.
- Hayata ONAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105068
- Publication date Mar 27, 2025
- Siliconware Precision Industries Co., Ltd.
- Chuan-Shun LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250105093
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Daehyuk SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...
- Publication number 20250105209
- Publication date Mar 27, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...
- Publication number 20250096062
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Baffles for electronic circuits immersed in cooling fluid in a tank

Electronic module comprising a pulsating heat pipe

Vapor chamber heat spreader for bare die processors

Heat spreader for a semiconductor package

Solid metal foam thermal interface material

Semiconductor device and manufacturing method thereof

Adhesive and thermal interface material on a plurality of dies cove...

Vapor chamber, electronic device, metallic sheet for vapor chamber...

Heat dissipation member

Electronic circuit comprising a RF switches having reduced parasiti...

Two-phase immersion-cooling heat-dissipation composite structure ha...

Semiconductor device and a method of manufacturing a semiconductor...

Chip cooling platform based on micro-nano structure

Heatsink for co-packaged optical switch rack package

Compliant thermal management devices, systems, and methods of fabri...

Semiconductor package having an encapulant comprising conductive fi...

Radiator module and method of manufacturing the same

Phase change material (PCM)-based conductive thermal actuator switc...

Heat sinks with beyond-board fins

Thermal management in integrated circuit packages

Package assembly including liquid alloy thermal interface material...

Semiconductor device package comprising a thermal interface materia...

Power overlay module with thermal storage

Heat-transfer member and cooling system

Substrate, electronic device, and method for manufacturing substrate

Semiconductor devices and methods of manufacturing semiconductor de...

Low-noise heat exchanger

Housing comprising a composite wall integrating at least one coolin...

Power conversion apparatus

System for electrically decoupled, homogeneous temperature control...

Patents Applicationslast 30 patents

VAPOR CHAMBER, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING V...

Underfill for Large Area Attaches for Semiconductor Packages

SEMICONDUCTOR DEVICE

PASSIVE THERMAL CONTROL LAYER FOR INTEGRATED DEVICE

SEMICONDUCTOR APPARATUS

ELECTRONICS MODULE COMPRISING A PULSATING HEAT PIPE WITH A CHANNEL...

POWER CONVERSION DEVICE

OPTIMIZED COMBINED MICROCHANNEL AND HEAT PIPES FOR ELECTRONICS COOLING

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

HEAT DISSIPATION DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

COOLING SYSTEM FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE S...

HEAT DISSIPATION BY NANO PIPES

PACKAGE STRUCTURE

INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER

ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES

ENHANCED PACKAGING FOR FLIP-CHIP DEVICES

MULTILAYER HIGH ASPECT RATIO MICROCHANNEL DEVICE

INVERTED MEMORY STACK

PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...

HYBRID HEAT SINK

HEAT DISSIPATION STRUCTURE OF HIGH-POWER CHIP POWER SUPPLY MODULE

SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND...

SEMICONDUCTOR ASSEMBLIES INCLUDING VERTICALLY INTEGRATED CIRCUITS A...

Power, Signaling and Thermal Path Co-optimization

POWER CONVERSION APPARATUS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE

HIGH PERFORMANCE MICROELECTRONIC ASSEMBLIES INCLUDING THROUGH-SILIC...

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FIN...