Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device stack-up with bulk substrate material to mitig...
- Patent number 11,978,689
- Issue date May 7, 2024
- Intel Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device
- Patent number 11,971,219
- Issue date Apr 30, 2024
- Delta Electronics, Inc.
- Li-Kuang Tan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package
- Patent number 11,967,549
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jung Ho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with cavity substrate
- Patent number 11,967,579
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,961,797
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with cantilever multi-chip module (...
- Patent number 11,948,855
- Issue date Apr 2, 2024
- Rockwell Collins, Inc.
- Bret W. Simon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite thermal interface materials and associated devices, syste...
- Patent number 11,943,899
- Issue date Mar 26, 2024
- Deeia Inc.
- Himanshu Pokharna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration semiconductor package structure
- Patent number 11,942,396
- Issue date Mar 26, 2024
- Industrial Technology Research Institute
- Heng-Chieh Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package lids with polymer features
- Patent number 11,935,799
- Issue date Mar 19, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system providing cooling to an infrastructure having a plur...
- Patent number 11,937,406
- Issue date Mar 19, 2024
- OVH
- Ali Chehade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compensation layers with core-shell phase change particles...
- Patent number 11,933,546
- Issue date Mar 19, 2024
- Toyota Motor North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Vapor chambers
- Patent number 11,930,620
- Issue date Mar 12, 2024
- Intel Corporation
- Jeff Ku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Balanced heat transfer mechanism and control for automotive vehicle...
- Patent number 11,920,869
- Issue date Mar 5, 2024
- Continental Automotive Systems, Inc.
- Robert Pozdal
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High power density chips based two-phase loop recirculation
- Patent number 11,925,001
- Issue date Mar 5, 2024
- BAIDU USA LLC
- Tianyi Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics assembly including top and bottom packages in stac...
- Patent number 11,915,996
- Issue date Feb 27, 2024
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation system with microelectromechanical system (MEMS) f...
- Patent number 11,910,568
- Issue date Feb 20, 2024
- Cisco Technology, Inc.
- Joel Richard Goergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Connecting component, display panel, and display device
- Patent number 11,908,801
- Issue date Feb 20, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Chuanghua Deng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,908,806
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Dong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single and multi-layer mesh structures for enhanced thermal transport
- Patent number 11,898,807
- Issue date Feb 13, 2024
- The Regents of the University of Colorado, a Body Corporate
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,263
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 11,894,287
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level packaging structure and method for LED chip
- Patent number 11,894,357
- Issue date Feb 6, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device
- Patent number 11,892,246
- Issue date Feb 6, 2024
- Fujitsu Limited
- Kento Ohga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Hermetically sealed electronics module with enhanced cooling of cor...
- Patent number 11,894,286
- Issue date Feb 6, 2024
- BAE Systems Information and Electronic Systems Integration Inc.
- Keith K Sturcken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure relief valve and adsorbent chamber for two-phase immersion...
- Patent number 11,894,288
- Issue date Feb 6, 2024
- MTS IP Holdings Ltd
- Nihal Joshua
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling systems comprising passively and actively expandable vapor...
- Patent number 11,879,686
- Issue date Jan 23, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Carbon based polymer thermal interface materials with polymer chain...
- Patent number 11,881,440
- Issue date Jan 23, 2024
- Intel Corporation
- Marely E. Tejeda Ferrari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooling system including embedded channels and cold plates
- Patent number 11,876,036
- Issue date Jan 16, 2024
- The Research Foundation for the State University of New York
- Leila Choobineh
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,869,825
- Issue date Jan 9, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT SINK AND ELECTRONIC DEVICE
- Publication number 20240145338
- Publication date May 2, 2024
- Giga Computing Technology Co., Ltd.
- Jian-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
- Publication number 20240136243
- Publication date Apr 25, 2024
- Intel Corporation
- Min Suet Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT
- Publication number 20240133643
- Publication date Apr 25, 2024
- The Regents of the University of Colorado, a Body Corporate
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...
- Publication number 20240136252
- Publication date Apr 25, 2024
- Frore Systems Inc.
- Suryaprakash Ganti
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136251
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE
- Publication number 20240125561
- Publication date Apr 18, 2024
- Fujitsu Limited
- KENTO OHGA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
- Publication number 20240128227
- Publication date Apr 18, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Perceval COUDRAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240112982
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- HIROFUMI MAKINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240112981
- Publication date Apr 4, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS
- Publication number 20240105585
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR RING TYPE INTEGRATED CIRCUITS
- Publication number 20240105549
- Publication date Mar 28, 2024
- Cisco Technology, Inc.
- Yongguo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE
- Publication number 20240105677
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages, Devices Using the Same, and Methods of...
- Publication number 20240105530
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...
- Publication number 20240096741
- Publication date Mar 21, 2024
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING APPARATUS, SEMICONDUCTOR DEVICE INCLUDING THE APPARATUS, AN...
- Publication number 20240096742
- Publication date Mar 21, 2024
- KOOLMICRO INC.
- Kyo Sung CHOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ASSEMBLY HAVING A COOLING BODY AND AT LEAST ON...
- Publication number 20240087984
- Publication date Mar 14, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Florian Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240087976
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240087983
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Daewoong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...
- Publication number 20240071865
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, FORMING METHOD OF SAME AND MEMORY
- Publication number 20240071864
- Publication date Feb 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Kaimin LV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRAT...
- Publication number 20240074028
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Youngho YOON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ALIGNMENT MECHANISM
- Publication number 20240061036
- Publication date Feb 22, 2024
- Delta Design, Inc.
- Jerry Ihor TUSTANIWSKYJ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...
- Publication number 20240063087
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Liang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REINFORCING STRUCTURE
- Publication number 20240063077
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jongbeom PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...
- Publication number 20240055321
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-PHASE LIQUID-COOLED ELECTRICAL POWER APPARATUS
- Publication number 20240057304
- Publication date Feb 15, 2024
- Raytheon Company
- Stephen B. Kuznetsov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Chip Comprising Heat Transfer Means
- Publication number 20240055322
- Publication date Feb 15, 2024
- Nokia Technologies Oy
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240047338
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUITS
- Publication number 20240038629
- Publication date Feb 1, 2024
- GM Cruise Holdings LLC
- Yafei Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT
- Publication number 20240038630
- Publication date Feb 1, 2024
- SIEMENS AKTIENGESELLSCHAFT
- STEFAN PFEFFERLEIN
- H01 - BASIC ELECTRIC ELEMENTS

Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device stack-up with bulk substrate material to mitig...

Heat dissipation device

Semiconductor package

Method for forming package structure with cavity substrate

3DIC packaging with hot spot thermal management features

Semiconductor package and fabricating method thereof

Integrated circuit (IC) package with cantilever multi-chip module (...

Composite thermal interface materials and associated devices, syste...

Heterogeneous integration semiconductor package structure

Integrated circuit package lids with polymer features

Cooling system providing cooling to an infrastructure having a plur...

Thermal compensation layers with core-shell phase change particles...

Vapor chambers

Balanced heat transfer mechanism and control for automotive vehicle...

High power density chips based two-phase loop recirculation

Microelectronics assembly including top and bottom packages in stac...

Heat dissipation system with microelectromechanical system (MEMS) f...

Connecting component, display panel, and display device

Semiconductor package and method of fabricating the same

Single and multi-layer mesh structures for enhanced thermal transport

Semiconductor device and manufacturing method thereof

Adhesive and thermal interface material on a plurality of dies cove...

System-level packaging structure and method for LED chip

Cooling device

Hermetically sealed electronics module with enhanced cooling of cor...

Pressure relief valve and adsorbent chamber for two-phase immersion...

Cooling systems comprising passively and actively expandable vapor...

Carbon based polymer thermal interface materials with polymer chain...

Fluid cooling system including embedded channels and cold plates

RF devices with enhanced performance and methods of forming the same

Patents Applicationslast 30 patents

HEAT SINK AND ELECTRONIC DEVICE

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT

PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COM...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COOLING DEVICE

SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS

HEATSINK FOR RING TYPE INTEGRATED CIRCUITS

RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE

Integrated Circuit Packages, Devices Using the Same, and Methods of...

COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...

COOLING APPARATUS, SEMICONDUCTOR DEVICE INCLUDING THE APPARATUS, AN...

SEMICONDUCTOR MODULE ASSEMBLY HAVING A COOLING BODY AND AT LEAST ON...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE HAVING AN ENCAPULANT COMPRISING CONDUCTIVE FI...

SEMICONDUCTOR STRUCTURE, FORMING METHOD OF SAME AND MEMORY

ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRAT...

ALIGNMENT MECHANISM

THERMAL AND MECHANICAL ENHANCED THERMAL MODULE STRUCTURE ON HETEROG...

SEMICONDUCTOR PACKAGE WITH REINFORCING STRUCTURE

THERMAL MODULE FOR A SEMICONDUCTOR PACKAGE AND METHODS OF FORMING T...

TWO-PHASE LIQUID-COOLED ELECTRICAL POWER APPARATUS

Three-Dimensional Chip Comprising Heat Transfer Means

Integrated Circuit Packages and Methods of Forming the Same

MULTILAYER THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUITS

SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT