Fillings or auxiliary members in containers or encapsulations

Industry

CPC
H01L23/16

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/16Fillings or auxiliary members in containers or encapsulations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structures having underfills
- Patent number 11,967,581
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,961,777
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for underfilling using spacers
- Patent number 11,948,809
- Issue date Apr 2, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Whei Sheng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a support solder ball
- Patent number 11,948,873
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,942,439
- Issue date Mar 26, 2024
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear spacer for spacing a carrier of a package
- Patent number 11,942,383
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,935,804
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer chips and enclosures for quantum circuits
- Patent number 11,908,756
- Issue date Feb 20, 2024
- International Business Machines Corporation
- David Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including dual stiffener
- Patent number 11,908,758
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for molding compound crack suppression in semico...
- Patent number 11,908,757
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,908,755
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Jae Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid semiconductor device and electronic device
- Patent number 11,908,810
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
- Patent number 11,901,348
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Tae-Ho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with stress reduction design and metho...
- Patent number 11,894,320
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,894,340
- Issue date Feb 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First-level integration of second-level thermal interface material...
- Patent number 11,881,438
- Issue date Jan 23, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC having a metal ring thereon for stress reduction
- Patent number 11,869,820
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,837,557
- Issue date Dec 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Peng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
O-ring seals for fluid sensing
- Patent number 11,837,513
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and method for forming the same
- Patent number 11,830,859
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,830,823
- Issue date Nov 28, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package semiconductor device and method of manufacture
- Patent number 11,817,360
- Issue date Nov 14, 2023
- Nexperia B.V.
- Loh Choong Keat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for sacrificial film, package, manufacturing method of...
- Patent number 11,798,857
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 11,798,897
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 11,791,227
- Issue date Oct 17, 2023
- Advanced Semiconductor Engineering, Inc.
- Kuoching Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated module with electromagnetic shielding
- Patent number 11,784,136
- Issue date Oct 10, 2023
- Qorvo US, Inc.
- Mohsen Haji-Rahim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Covers for semiconductor package components
- Patent number 11,784,103
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corner guard for improved electroplated first level interconnect bu...
- Patent number 11,776,864
- Issue date Oct 3, 2023
- Intel Corporation
- Jacob Vehonsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stiffening structure
- Patent number 11,776,918
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,776,937
- Issue date Oct 3, 2023
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
O-RING SEALS FOR FLUID SENSING
- Publication number 20240128137
- Publication date Apr 18, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240128206
- Publication date Apr 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Peng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND ME...
- Publication number 20240120321
- Publication date Apr 11, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE
- Publication number 20240120211
- Publication date Apr 11, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...
- Publication number 20240113087
- Publication date Apr 4, 2024
- Intel Corporation
- Brandon Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LA...
- Publication number 20240096820
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Young Lyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION
- Publication number 20240071948
- Publication date Feb 29, 2024
- Intel Corporation
- Jiun Hann SIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071849
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-You Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING SEMICONDCUTOR DEVICE ASSEMBLY COMPONENTS USING INTERCONN...
- Publication number 20240071903
- Publication date Feb 29, 2024
- ADVANCED MICRO DEVICES, INC.
- GABRIEL H. LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240063145
- Publication date Feb 22, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Tae Ki KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
- Publication number 20240038609
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH CAVITIES AND METHODS OF MAKING THEREOF
- Publication number 20240038608
- Publication date Feb 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose L. Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240030077
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- SANGHYEON JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240030085
- Publication date Jan 25, 2024
- Mitsubishi Electric Corporation
- Hongbo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS A...
- Publication number 20240014083
- Publication date Jan 11, 2024
- Micron Technology, Inc.
- Hem P. Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE
- Publication number 20230420384
- Publication date Dec 28, 2023
- Intel Corporation
- Kavitha NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS
- Publication number 20230420317
- Publication date Dec 28, 2023
- INFINEON TECHNOLOGIES AG
- Michael STADLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230411357
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Jun TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING A REPEATIN...
- Publication number 20230411157
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Seungkyo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Structures for Integrated Circuit Packages and Methods of F...
- Publication number 20230402339
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ON PACKAGE (MOP) ARCHITECTURE
- Publication number 20230395576
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH FAN-OUT STRUCTURES
- Publication number 20230378078
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20230369246
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST PACKAGE WARPAGE SOLUTION
- Publication number 20230369071
- Publication date Nov 16, 2023
- Intel Corporation
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230360985
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising Structures Configured to Withstand...
- Publication number 20230360984
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Christoph Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230360997
- Publication date Nov 9, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230352382
- Publication date Nov 2, 2023
- RENESAS ELECTRONICS CORPORATION
- Takashi KARASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20230343738
- Publication date Oct 26, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS

Fillings or auxiliary members in containers or encapsulations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structures having underfills

Package structure comprising buffer layer for reducing thermal stre...

Method for underfilling using spacers

Semiconductor package including a support solder ball

Semiconductor package structure

Linear spacer for spacing a carrier of a package

Integrated circuit package and method

Interposer chips and enclosures for quantum circuits

Semiconductor package including dual stiffener

Die corner removal for molding compound crack suppression in semico...

Semiconductor devices and methods of manufacturing semiconductor de...

Hybrid semiconductor device and electronic device

Semiconductor package and method of manufacturing the semiconductor...

Semiconductor device package with stress reduction design and metho...

Package structure and method for manufacturing the same

First-level integration of second-level thermal interface material...

IC having a metal ring thereon for stress reduction

Semiconductor device package and a method of manufacturing the same

O-ring seals for fluid sensing

Package structures and method for forming the same

Semiconductor devices and methods of manufacturing semiconductor de...

Chip scale package semiconductor device and method of manufacture

Composition for sacrificial film, package, manufacturing method of...

Package structure and methods of manufacturing the same

Electronic device package

Integrated module with electromagnetic shielding

Covers for semiconductor package components

Corner guard for improved electroplated first level interconnect bu...

Semiconductor package having stiffening structure

Electronic module

Patents Applicationslast 30 patents

O-RING SEALS FOR FLUID SENSING

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND ME...

STIFFENER PACKAGE AND METHOD OF FABRICATING STIFFENER PACKAGE

HIGH PERFORMANCE PERMANENT GLASS ARCHITECTURES FOR STACKED INTEGRAT...

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SACRIFICIAL LA...

SEMICONDUCTOR PACKAGE WITH STIFFENER BASKET PORTION

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD

CONNECTING SEMICONDCUTOR DEVICE ASSEMBLY COMPONENTS USING INTERCONN...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS

SEMICONDUCTOR PACKAGES WITH CAVITIES AND METHODS OF MAKING THEREOF

PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE ASSEMBLIES WITH SCREEN-PRINTED EPOXY SPACERS A...

SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE

ELECTRONIC DEVICES INCLUDING VENT OPENINGS AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING A REPEATIN...

Molding Structures for Integrated Circuit Packages and Methods of F...

MEMORY ON PACKAGE (MOP) ARCHITECTURE

PACKAGE WITH FAN-OUT STRUCTURES

PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

LOW COST PACKAGE WARPAGE SOLUTION

PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Package Comprising Structures Configured to Withstand...

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...