Focus rings

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CPC
H01J37/32642

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HELECTRICITY H01Electric elements H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge

Current Industry

H01J37/32642Focus rings

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plasma reactor having array of coaxial multiple pins and processing...
- Patent number 12,230,481
- Issue date Feb 18, 2025
- HANGZHOU CITY UNIVERSITY
- Qi Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moveable edge ring designs
- Patent number 12,230,482
- Issue date Feb 18, 2025
- Lam Research Corporation
- Hiran Rajitha Rathnasinghe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing system, method of manufacturing a semic...
- Patent number 12,217,962
- Issue date Feb 4, 2025
- Kioxia Corporation
- Shingo Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power cable for heated components in RF environment
- Patent number 12,217,944
- Issue date Feb 4, 2025
- Lam Research Corporation
- Seyed Jafar Jafarian-Tehrani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck design with improved chucking and arcing perfor...
- Patent number 12,211,728
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Abdul Aziz Khaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma control method in semiconductor wafer fabrication
- Patent number 12,205,844
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Shao Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 12,205,801
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Toshiaki Saijo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 12,198,952
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Masahiro Dogome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate support and plasma processing apparatus
- Patent number 12,198,906
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Hajime Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for physical vapor deposition and method for forming a layer
- Patent number 12,191,127
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom and middle edge rings
- Patent number 12,183,554
- Issue date Dec 31, 2024
- Lam Research Corporation
- Hiran Rajitha Rathnasinghe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 12,183,555
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Seunghan Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning method and plasma processing apparatus
- Patent number 12,176,187
- Issue date Dec 24, 2024
- Tokyo Electron Limited
- Chishio Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method for manufacturing semiconductor structure
- Patent number 12,165,851
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lun Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover ring to mitigate carbon contamination in plasma doping chamber
- Patent number 12,165,852
- Issue date Dec 10, 2024
- Applied Materials, Inc.
- Vikram M. Bhosle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and etching method
- Patent number 12,165,849
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Natsumi Torii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and transfer method
- Patent number 12,165,893
- Issue date Dec 10, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma uniformity control in pulsed DC plasma chamber
- Patent number 12,148,595
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Linying Cui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration jig and calibration method
- Patent number 12,148,645
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Andrew Myles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing leakage of heat transfer gas and plasma processi...
- Patent number 12,142,462
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Shinsuke Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated transfer of edge ring requiring rotational alignment
- Patent number 12,142,466
- Issue date Nov 12, 2024
- Lam Research Corporation
- Damon Tyrone Genetti
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Plasma processing chambers configured for tunable substrate and edg...
- Patent number 12,142,469
- Issue date Nov 12, 2024
- Applied Materials, Inc.
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for conditioning semiconductor processing chamber components
- Patent number 12,129,569
- Issue date Oct 29, 2024
- Lam Research Corporation
- Lin Xu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chuck for plasma processing chamber
- Patent number 12,131,890
- Issue date Oct 29, 2024
- Lam Research Corporation
- Ann Erickson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer system, transfer device, and transfer method
- Patent number 12,131,937
- Issue date Oct 29, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment and transport of substrate and focus ring
- Patent number 12,131,936
- Issue date Oct 29, 2024
- Keisuke Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measurement system to measure a thickness of an adjustable edge rin...
- Patent number 12,123,709
- Issue date Oct 22, 2024
- Lam Research Corporation
- Hossein Sadeghi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 12,125,685
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Jun Soo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening automation apparatus for upper electrode
- Patent number 12,119,210
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Joohee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotating biasable pedestal and electrostatic chuck in semiconductor...
- Patent number 12,112,972
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
EDGE RING AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE SAME
- Publication number 20250054735
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Wookhyeon Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED THERMAL AND ELECTRICAL INTERFACE BETWEEN PARTS IN AN ETCH...
- Publication number 20250054778
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Anthony DE LA LLERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD
- Publication number 20250054793
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Norihiko AMIKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD
- Publication number 20250046585
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Tatsuru OKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM
- Publication number 20250046583
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Tatsuru OKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Publication number 20250046573
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Mohd Fairuz BIN BUDIMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING DEVICE
- Publication number 20250037971
- Publication date Jan 30, 2025
- Advanced Micro-Fabrication Equipment Inc. China
- Tuqiang NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS STACK FOR CVD PLASMA TREATMENT
- Publication number 20250037976
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Anirudh K. Alewoor
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIDE-COVERAGE EDGE RING FOR ENHANCED SHIELDING IN SUBSTRATE PROCESS...
- Publication number 20250022691
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Shang-I CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rotating Biasable Pedestal and Electrostatic Chuck in Semiconductor...
- Publication number 20250022745
- Publication date Jan 16, 2025
- Applied Materials, Inc.
- Qiwei LIANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RING OF AN EDGE RING ASSEMBLY FOR AN ETCHING SYSTEM
- Publication number 20250022690
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi Chiuan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE CAPACITIVELY COUPLED PLASMA CHAMBER STRUCTURE
- Publication number 20250006470
- Publication date Jan 2, 2025
- LAM RESEARCH CORPORATION
- Alexei Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE
- Publication number 20240429070
- Publication date Dec 26, 2024
- SK HYNIX INC.
- Jin Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADJUSTABLE EDGE RING TILT FOR EDGE OF WAFER SKEW COMPENSATION
- Publication number 20240429089
- Publication date Dec 26, 2024
- Applied Materials, Inc.
- Peter MURAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240420923
- Publication date Dec 19, 2024
- TOKYO ELECTRON LIMITED
- Manabu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CONTROLLING IMPEDANCE AND SYSTEM FOR TREATING SUBSTRA...
- Publication number 20240420936
- Publication date Dec 19, 2024
- SEMES CO., LTD.
- Hyo Seong Seong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTREME EDGE FEATURE PROFILE TILT CONTROL BY ALTERING INPUT VOLTAGE...
- Publication number 20240420929
- Publication date Dec 19, 2024
- LAM RESEARCH CORPORATION
- Rajesh Dorai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240412958
- Publication date Dec 12, 2024
- Samsung Electronics Co., Ltd.
- Jeongil MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CLAMPING A SUBSTRATE ON A MONO-POLAR ELECTROSTATIC CH...
- Publication number 20240404861
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- SUSHIM KOSHTI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Workpiece Processing Apparatus and Methods for the Treatment of Wor...
- Publication number 20240404797
- Publication date Dec 5, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Ting Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20240395511
- Publication date Nov 28, 2024
- NGK Insulators, Ltd.
- Taro USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING
- Publication number 20240395509
- Publication date Nov 28, 2024
- TOKYO ELECTRON LIMITED
- Chishio KOSHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD
- Publication number 20240395508
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ETCHING SYSTEM HAVING FOCUS RING WITH PROLONGED LIFETIME
- Publication number 20240387150
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCHER UNIFORMITY CONTROL BY TUNING EDGE ZONE PLASMA SHEATH
- Publication number 20240387152
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Lung HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOCUS RING AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE SAME
- Publication number 20240371610
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Hyungsik KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS MODULE CHAMBER PROVIDING SYMMETRIC RF RETURN PATH
- Publication number 20240371604
- Publication date Nov 7, 2024
- LAM RESEARCH CORPORATION
- Sam Jafarian Tehrani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS
- Publication number 20240371611
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- SEJIN OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGS
- Publication number 20240355667
- Publication date Oct 24, 2024
- LAM RESEARCH CORPORATION
- Haoquan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20240347325
- Publication date Oct 17, 2024
- TOKYO ELECTRON LIMITED
- Yuki ONODERA
- H01 - BASIC ELECTRIC ELEMENTS

Focus rings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma reactor having array of coaxial multiple pins and processing...

Moveable edge ring designs

Semiconductor manufacturing system, method of manufacturing a semic...

High power cable for heated components in RF environment

Electrostatic chuck design with improved chucking and arcing perfor...

Plasma control method in semiconductor wafer fabrication

Plasma processing apparatus and plasma processing method

Substrate processing apparatus

Substrate support and plasma processing apparatus

Apparatus for physical vapor deposition and method for forming a layer

Bottom and middle edge rings

Substrate processing apparatus and method of manufacturing semicond...

Cleaning method and plasma processing apparatus

Plasma processing method for manufacturing semiconductor structure

Cover ring to mitigate carbon contamination in plasma doping chamber

Plasma processing apparatus and etching method

Substrate processing system and transfer method

Plasma uniformity control in pulsed DC plasma chamber

Calibration jig and calibration method

Method of reducing leakage of heat transfer gas and plasma processi...

Automated transfer of edge ring requiring rotational alignment

Plasma processing chambers configured for tunable substrate and edg...

Method for conditioning semiconductor processing chamber components

Chuck for plasma processing chamber

Transfer system, transfer device, and transfer method

Alignment and transport of substrate and focus ring

Measurement system to measure a thickness of an adjustable edge rin...

Plasma processing apparatus

Fastening automation apparatus for upper electrode

Rotating biasable pedestal and electrostatic chuck in semiconductor...

Patents Applicationslast 30 patents

EDGE RING AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE SAME

IMPROVED THERMAL AND ELECTRICAL INTERFACE BETWEEN PARTS IN AN ETCH...

SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD

SUBSTRATE PROCESSING SYSTEM AND TRANSFER METHOD

SUBSTRATE PROCESSING SYSTEM

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

PLASMA PROCESSING DEVICE

PROCESS STACK FOR CVD PLASMA TREATMENT

WIDE-COVERAGE EDGE RING FOR ENHANCED SHIELDING IN SUBSTRATE PROCESS...

Rotating Biasable Pedestal and Electrostatic Chuck in Semiconductor...

RING OF AN EDGE RING ASSEMBLY FOR AN ETCHING SYSTEM

EDGE CAPACITIVELY COUPLED PLASMA CHAMBER STRUCTURE

SUBSTRATE PROCESSING APPARATUS HAVING A MIDDLE ELECTRODE

ADJUSTABLE EDGE RING TILT FOR EDGE OF WAFER SKEW COMPENSATION

PLASMA PROCESSING APPARATUS

APPARATUS FOR CONTROLLING IMPEDANCE AND SYSTEM FOR TREATING SUBSTRA...

EXTREME EDGE FEATURE PROFILE TILT CONTROL BY ALTERING INPUT VOLTAGE...

PLASMA PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

APPARATUS FOR CLAMPING A SUBSTRATE ON A MONO-POLAR ELECTROSTATIC CH...

Workpiece Processing Apparatus and Methods for the Treatment of Wor...

WAFER PLACEMENT TABLE

APPARATUS FOR PLASMA PROCESSING AND METHOD OF ETCHING

PLASMA PROCESSING APPARATUS AND METHOD

PLASMA ETCHING SYSTEM HAVING FOCUS RING WITH PROLONGED LIFETIME

DRY ETCHER UNIFORMITY CONTROL BY TUNING EDGE ZONE PLASMA SHEATH

FOCUS RING AND APPARATUS FOR PROCESSING A SUBSTRATE INCLUDING THE SAME

PROCESS MODULE CHAMBER PROVIDING SYMMETRIC RF RETURN PATH

METHOD AND SYSTEM FOR MONITORING SUBSTRATE PROCESSING APPARATUS

EDGE RING ARRANGEMENT WITH MOVEABLE EDGE RINGS

PLASMA PROCESSING APPARATUS