Foil-like cooling fins or heat sinks

Industry

CPC
H01L23/3672

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3672Foil-like cooling fins or heat sinks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a chip package, method of forming a semiconductor...
- Patent number 12,136,583
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method forming the same
- Patent number 12,131,973
- Issue date Oct 29, 2024
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bidirectional message architecture for inve...
- Patent number 12,122,251
- Issue date Oct 22, 2024
- BorgWarner US Technologies LLC
- Jack Lavern Glenn
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Face-to-face through-silicon via multi-chip semiconductor apparatus...
- Patent number 12,125,768
- Issue date Oct 22, 2024
- Altera Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink with increased air flow
- Patent number 12,114,467
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Magnus Kallmark
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power module with graphite plate
- Patent number 12,107,029
- Issue date Oct 1, 2024
- Rohm Co., Ltd.
- Masashi Hayashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrated gate driver for inverter for ele...
- Patent number 12,103,406
- Issue date Oct 1, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Chip heat dissipating structure, chip structure, circuit board and...
- Patent number 12,100,636
- Issue date Sep 24, 2024
- BITMAIN TECHNOLOGIES INC.
- Tao Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 12,100,701
- Issue date Sep 24, 2024
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of insulated metal substrate
- Patent number 12,096,569
- Issue date Sep 17, 2024
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-cleaning heatsink for electronic components
- Patent number 12,074,080
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- Maksim Kuzmenka
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Arrangement of a power semiconductor module and a cooler
- Patent number 12,068,174
- Issue date Aug 20, 2024
- HITACHI ENERGY LTD
- Daniele Torresin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,057,414
- Issue date Aug 6, 2024
- Mitsubishi Electric Corporation
- Yusuke Yamakaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and semiconductor device
- Patent number 12,051,662
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of heat-sinked power semiconductors
- Patent number 12,046,529
- Issue date Jul 23, 2024
- American Axle & Manufacturing, Inc.
- Jeffrey J. Ronning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,007,170
- Issue date Jun 11, 2024
- Intel Corporation
- Feras Eid
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat transfer device
- Patent number 12,009,275
- Issue date Jun 11, 2024
- ASUSTeK COMPUTER Inc.
- Hsin-Chen Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package including lid with integrated heat pipe for t...
- Patent number 12,009,276
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated radiator having temperature gradient
- Patent number 12,002,728
- Issue date Jun 4, 2024
- QKM TECHNOLOGY (DONG GUAN) CO., LTD
- Jiang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible transistors with near-junction heat dissipation
- Patent number 11,996,473
- Issue date May 28, 2024
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation for semiconductor devices and methods of manufacture
- Patent number 11,990,404
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module arrangement
- Patent number 11,978,700
- Issue date May 7, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 11,978,721
- Issue date May 7, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device
- Patent number 11,971,219
- Issue date Apr 30, 2024
- Delta Electronics, Inc.
- Li-Kuang Tan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 11,967,584
- Issue date Apr 23, 2024
- Hitachi Astemo, Ltd.
- Hiromi Shimazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 11,961,782
- Issue date Apr 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling ultrasound transducers and ultrasou...
- Patent number 11,959,707
- Issue date Apr 16, 2024
- SUNNYBROOK RESEARCH INSTITUTE
- Benjamin Lucht
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Linear spacer for spacing a carrier of a package
- Patent number 11,942,383
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of three-dimensional integrated circuits
- Patent number 11,942,453
- Issue date Mar 26, 2024
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND HEAT DISSIPATION BASE
- Publication number 20240387334
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Makoto ISOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Vertical Interconnect Architecture and Methods Fo...
- Publication number 20240387458
- Publication date Nov 21, 2024
- Applied Materials, Inc.
- Suketu PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE
- Publication number 20240379608
- Publication date Nov 14, 2024
- Fuji Electric Co., Ltd.
- Yuta TAKEUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240339421
- Publication date Oct 10, 2024
- ROHM CO., LTD.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY OF HEAT-SINKED POWER SEMICONDUCTORS
- Publication number 20240339374
- Publication date Oct 10, 2024
- American Axle & Manufacturing, Inc.
- Jeffrey J. RONNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING T...
- Publication number 20240334641
- Publication date Oct 3, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Matthias Eisner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT RADIATOR AND ELECTRONIC COMPONENT MODULE
- Publication number 20240321671
- Publication date Sep 26, 2024
- Molex, LLC
- Tetsunori Tsumuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED P...
- Publication number 20240306348
- Publication date Sep 12, 2024
- GaN Systems Inc.
- Ruoyu HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240304513
- Publication date Sep 12, 2024
- Samsung Electronics Co., Ltd.
- Anthony Dongick LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HYBRID HEAT SPREADER MANUFACTURING METHOD AND THEREOF
- Publication number 20240290681
- Publication date Aug 29, 2024
- SHUN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...
- Publication number 20240290761
- Publication date Aug 29, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240282662
- Publication date Aug 22, 2024
- UT-Battelle, LLC
- Md Shajjad Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...
- Publication number 20240282663
- Publication date Aug 22, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL CONDUCTIVE MEMBER FOR A HEAT SINK
- Publication number 20240274488
- Publication date Aug 15, 2024
- The ESAB Group Inc.
- Secundino Miguel Baldonado
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240274490
- Publication date Aug 15, 2024
- Hitachi Power Semiconductor Device, Ltd.
- Yujiro Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODU...
- Publication number 20240274491
- Publication date Aug 15, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device, Method for Manufacturing Same, and Powe...
- Publication number 20240274489
- Publication date Aug 15, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Haruna TADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...
- Publication number 20240266244
- Publication date Aug 8, 2024
- Zhuhai ACCESS Semiconductor Co., LTD.
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS
- Publication number 20240266252
- Publication date Aug 8, 2024
- Semiconductor Components Industries, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240266285
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Fong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR COOLING ULTRASOUND TRANSDUCERS AND ULTRASOU...
- Publication number 20240255235
- Publication date Aug 1, 2024
- Sunnybrook Research Institute
- Benjamin LUCHT
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250057
- Publication date Jul 25, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240234392
- Publication date Jul 11, 2024
- ROBERT BOSCH GmbH
- Felix Stewing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asic Package With Photonics And Vertical Power Delivery
- Publication number 20240213215
- Publication date Jun 27, 2024
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS
- Publication number 20240213221
- Publication date Jun 27, 2024
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...
- Publication number 20240203827
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240194617
- Publication date Jun 13, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAKAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20240194560
- Publication date Jun 13, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES
- Publication number 20240186218
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS

Foil-like cooling fins or heat sinks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a chip package, method of forming a semiconductor...

Semiconductor device and method forming the same

Systems and methods for bidirectional message architecture for inve...

Face-to-face through-silicon via multi-chip semiconductor apparatus...

Heatsink with increased air flow

Power module with graphite plate

Systems and methods for integrated gate driver for inverter for ele...

Chip heat dissipating structure, chip structure, circuit board and...

Hybrid system including photonic and electronic integrated circuits...

Manufacturing method of insulated metal substrate

Self-cleaning heatsink for electronic components

Arrangement of a power semiconductor module and a cooler

Printed circuit board

Electronic component and semiconductor device

Array of heat-sinked power semiconductors

Thermal management in integrated circuit packages

Heat transfer device

Semiconductor package including lid with integrated heat pipe for t...

Integrated radiator having temperature gradient

Flexible transistors with near-junction heat dissipation

Heat dissipation for semiconductor devices and methods of manufacture

Power semiconductor module arrangement

ASIC package with photonics and vertical power delivery

Heat dissipation device

Semiconductor package having improved thermal interface between sem...

Power semiconductor device

Integration of semiconductor device assemblies with thermal dissipa...

Systems and methods for cooling ultrasound transducers and ultrasou...

Linear spacer for spacing a carrier of a package

Thermal management of three-dimensional integrated circuits

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE AND HEAT DISSIPATION BASE

Three-Dimensional Vertical Interconnect Architecture and Methods Fo...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

ARRAY OF HEAT-SINKED POWER SEMICONDUCTORS

ELECTRONICS ARRANGEMENT AND SEMICONDUCTOR SWITCHING DEVICE HAVING T...

HEAT RADIATOR AND ELECTRONIC COMPONENT MODULE

THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED P...

SEMICONDUCTOR DEVICE

INTEGRATED HYBRID HEAT SPREADER MANUFACTURING METHOD AND THEREOF

SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACT...

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...

POWER MODULE

INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPA...

THERMAL CONDUCTIVE MEMBER FOR A HEAT SINK

SEMICONDUCTOR MODULE

PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODU...

Power Semiconductor Device, Method for Manufacturing Same, and Powe...

EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING...

SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS

HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

SYSTEMS AND METHODS FOR COOLING ULTRASOUND TRANSDUCERS AND ULTRASOU...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR MODULE

Asic Package With Photonics And Vertical Power Delivery

THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS

THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SU...

PRINTED CIRCUIT BOARD

MEMORY DEVICE AND METHOD OF ASSEMBLING SAME

MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES