Foil-like cooling fins or heat sinks

Industry

CPC
H01L23/3672

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3672Foil-like cooling fins or heat sinks

Industries

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation device
- Patent number 11,971,219
- Issue date Apr 30, 2024
- Delta Electronics, Inc.
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device
- Patent number 11,967,584
- Issue date Apr 23, 2024
- Hitachi Astemo, Ltd.
- Hiromi Shimazu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of semiconductor device assemblies with thermal dissipa...
- Patent number 11,961,782
- Issue date Apr 16, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling ultrasound transducers and ultrasou...
- Patent number 11,959,707
- Issue date Apr 16, 2024
- SUNNYBROOK RESEARCH INSTITUTE
- Benjamin Lucht
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Linear spacer for spacing a carrier of a package
- Patent number 11,942,383
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of three-dimensional integrated circuits
- Patent number 11,942,453
- Issue date Mar 26, 2024
- Kambix Innovations, LLC
- Kambiz Vafai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package lids with polymer features
- Patent number 11,935,799
- Issue date Mar 19, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die and heat spreaders with solderable thermal interface structu...
- Patent number 11,935,808
- Issue date Mar 19, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal spreader having integrated EF/EMI shi...
- Patent number 11,935,809
- Issue date Mar 19, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die with solderable thermal interface structures for assemblies...
- Patent number 11,923,267
- Issue date Mar 5, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a power module unit
- Patent number 11,915,990
- Issue date Feb 27, 2024
- Siemens Aktiengesellschaft
- Daniel Kappauf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management of GPU-HBM package by microchannel integrated su...
- Patent number 11,915,997
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Xiaopeng Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated heat distribution and manufact...
- Patent number 11,901,343
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Bora Baloglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with heatsink
- Patent number 11,894,296
- Issue date Feb 6, 2024
- Cisco Technology, Inc.
- Mike Sapozhnikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,881,524
- Issue date Jan 23, 2024
- Sumitomo Electric Industries, Ltd.
- Hisato Michikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply system
- Patent number 11,876,084
- Issue date Jan 16, 2024
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module apparatus, cooling structure, and electric vehicle or...
- Patent number 11,854,937
- Issue date Dec 26, 2023
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package wrap-around heat spreader
- Patent number 11,854,932
- Issue date Dec 26, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal peak suppression device
- Patent number 11,848,250
- Issue date Dec 19, 2023
- Global Unichip Corporation
- Chih-Chieh Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,848,251
- Issue date Dec 19, 2023
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding passive devices on active device dies to form 3D packages
- Patent number 11,837,575
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full package vapor chamber with IHS
- Patent number 11,832,419
- Issue date Nov 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked compute and memory with copper-to-copper hybrid bond
- Patent number 11,784,164
- Issue date Oct 10, 2023
- Kepler Computing Inc.
- Rajeev Kumar Dokania
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,776,868
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with clip and connector above electronic components
- Patent number 11,756,859
- Issue date Sep 12, 2023
- Infineon Technologies AG
- Tomasz Naeve
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,756,854
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, power semiconductor module, and power electro...
- Patent number 11,749,578
- Issue date Sep 5, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structures
- Patent number 11,749,584
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hsiang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
- Patent number 11,742,255
- Issue date Aug 29, 2023
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...
- Publication number 20240136244
- Publication date Apr 25, 2024
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240136343
- Publication date Apr 25, 2024
- ROBERT BOSCH GmbH
- Felix Stewing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING
- Publication number 20240128146
- Publication date Apr 18, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND ME...
- Publication number 20240120321
- Publication date Apr 11, 2024
- NXP USA, Inc.
- Elie A. Maalouf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SUBSTRATES AND RELATED METHODS
- Publication number 20240120253
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Oseob JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240120263
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- CHEOL KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package having component carrier with cavity and electronic compone...
- Publication number 20240113037
- Publication date Apr 4, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Gerald Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS
- Publication number 20240113076
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Frank Robert Libsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...
- Publication number 20240105553
- Publication date Mar 28, 2024
- DELPHI TECHNOLOGIES IP LIMITED
- Kevin M. Gertiser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE
- Publication number 20240105690
- Publication date Mar 28, 2024
- DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096764
- Publication date Mar 21, 2024
- Fuji Electric Co., Ltd.
- Shinichiro ADACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HEAT SINK
- Publication number 20240087977
- Publication date Mar 14, 2024
- STMicroelectronics (Grenoble 2) SAS
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR...
- Publication number 20240079293
- Publication date Mar 7, 2024
- ROHM CO., LTD.
- Katsuhiko YOSHIHARA
- B60 - VEHICLES IN GENERAL
Information Patent Application
ARRAY OF HEAT-SINKED POWER SEMICONDUCTORS
- Publication number 20240079289
- Publication date Mar 7, 2024
- American Axle & Manufacturing, Inc.
- Jeffrey J. RONNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND POWER CONVERSION D...
- Publication number 20240055357
- Publication date Feb 15, 2024
- Mitsubishi Electric Corporation
- Kozo HARADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...
- Publication number 20240047295
- Publication date Feb 8, 2024
- Qorvo US, Inc.
- George Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CHIP PACKAGE AND POWER MODULE
- Publication number 20240047302
- Publication date Feb 8, 2024
- Ganstronic INC.
- Cheng-Chuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILTERING STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240047385
- Publication date Feb 8, 2024
- Huawei Technologies Co., Ltd
- Kehan Sui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT
- Publication number 20240038618
- Publication date Feb 1, 2024
- SIEMENS AKTIENGESELLSCHAFT
- Stefan Pfefferlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Methods for Processing Exfoliated Graphite Materials
- Publication number 20240021495
- Publication date Jan 18, 2024
- 0908905 B.C. Ltd.
- John Kenna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Heat Dissipation Using Graphene
- Publication number 20240014093
- Publication date Jan 11, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and manufacturing method thereof
- Publication number 20240014082
- Publication date Jan 11, 2024
- UNITED MICROELECTRONICS CORP.
- Yi-Feng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20240014094
- Publication date Jan 11, 2024
- ROHM CO., LTD.
- Keita SHIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FORMING THE SAME
- Publication number 20230420328
- Publication date Dec 28, 2023
- Vanguard International Semiconductor Corporation
- Hsiu-Mei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES
- Publication number 20230420338
- Publication date Dec 28, 2023
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME
- Publication number 20230420334
- Publication date Dec 28, 2023
- Infineon Technologies Austria AG
- Timo Bohnenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20230411359
- Publication date Dec 21, 2023
- Wolfspeed, Inc.
- Brice McPherson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEV...
- Publication number 20230402342
- Publication date Dec 14, 2023
- GaN Systems Inc.
- Di CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device, Power Conversion Device, and Electric S...
- Publication number 20230395457
- Publication date Dec 7, 2023
- Hitachi Astemo, Ltd.
- Takahiro ARAKI
- H01 - BASIC ELECTRIC ELEMENTS

Foil-like cooling fins or heat sinks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heat dissipation device

Semiconductor package having improved thermal interface between sem...

Power semiconductor device

Integration of semiconductor device assemblies with thermal dissipa...

Systems and methods for cooling ultrasound transducers and ultrasou...

Linear spacer for spacing a carrier of a package

Thermal management of three-dimensional integrated circuits

Integrated circuit package lids with polymer features

IC die and heat spreaders with solderable thermal interface structu...

Semiconductor package thermal spreader having integrated EF/EMI shi...

IC die with solderable thermal interface structures for assemblies...

Method for manufacturing a power module unit

Thermal management of GPU-HBM package by microchannel integrated su...

Semiconductor device with integrated heat distribution and manufact...

Integrated circuit package with heatsink

Semiconductor device

Power supply system

Power module apparatus, cooling structure, and electric vehicle or...

Package wrap-around heat spreader

Thermal peak suppression device

Semiconductor device

Bonding passive devices on active device dies to form 3D packages

Full package vapor chamber with IHS

3D stacked compute and memory with copper-to-copper hybrid bond

Methods for establishing thermal joints between heat spreaders or l...

Package with clip and connector above electronic components

Package structure and method of fabricating the same

Semiconductor module, power semiconductor module, and power electro...

Heat dissipation structures

Silicon heat-dissipation package for compact electronic devices

Patents Applicationslast 30 patents

IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTU...

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING

POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND ME...

INTEGRATED SUBSTRATES AND RELATED METHODS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

Package having component carrier with cavity and electronic compone...

INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS

SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL CO...

POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE HEAT SINK

POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR...

ARRAY OF HEAT-SINKED POWER SEMICONDUCTORS

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND POWER CONVERSION D...

3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...

POWER CHIP PACKAGE AND POWER MODULE

FILTERING STRUCTURE AND ELECTRONIC DEVICE

SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT

Apparatus and Methods for Processing Exfoliated Graphite Materials

Semiconductor Device and Method of Heat Dissipation Using Graphene

Semiconductor structure and manufacturing method thereof

NITRIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FORMING THE SAME

TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME

POWER MODULE

DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEV...

Power Semiconductor Device, Power Conversion Device, and Electric S...