for antenna

Industry

CPC
H01L2223/6677

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6677for antenna

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatuses with radio-frequency line elements, and a...
- Patent number 12,368,111
- Issue date Jul 22, 2025
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with antennas
- Patent number 12,362,297
- Issue date Jul 15, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module carrying a plurality of electronic devices
- Patent number 12,349,302
- Issue date Jul 1, 2025
- STMicroelectronics S.r.l.
- Luca Maggi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor structure having a porous semico...
- Patent number 12,347,673
- Issue date Jul 1, 2025
- Newport Fab, LLC
- Paul D. Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier module with transistor dies for multiple amplifier...
- Patent number 12,347,740
- Issue date Jul 1, 2025
- NXP USA, INC.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,341,106
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna substrate and electronic device including the same
- Patent number 12,341,252
- Issue date Jun 24, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Je Sang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,341,109
- Issue date Jun 24, 2025
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package
- Patent number 12,334,457
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,327,826
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,804
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,322,702
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in package having antenna on package substrate
- Patent number 12,322,856
- Issue date Jun 3, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and semiconductor manufacturing pro...
- Patent number 12,322,672
- Issue date Jun 3, 2025
- Advanced Semiconductor Engineering, Inc.
- Ian Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,322,691
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 12,322,665
- Issue date Jun 3, 2025
- NXP B.V.
- Denizhan Karaca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and device configurations
- Patent number 12,315,986
- Issue date May 27, 2025
- QUALCOMM Incorporated
- Seong Heon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a radar sensor
- Patent number 12,313,767
- Issue date May 27, 2025
- Robert Bosch GmbH
- Christian Hollaender
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna package with via structure and method of formation thereof
- Patent number 12,300,874
- Issue date May 13, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,300,587
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Hideki Shinkai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna with micro-transfer-printed circuit element
- Patent number RE50432
- Issue date May 13, 2025
- X-CELEPRINT LIMITED
- Ronald S. Cok
Information Patent Grant
Package comprising discrete antenna device
- Patent number 12,293,980
- Issue date May 6, 2025
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit comprising a RF switches having reduced parasiti...
- Patent number 12,293,981
- Issue date May 6, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane Monfray
- G11 - INFORMATION STORAGE
Information Patent Grant
Arrangement comprising an integrated circuit package and a heatsink...
- Patent number 12,288,757
- Issue date Apr 29, 2025
- SIVERS WIRELESS AB
- Erik Öjefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terahertz element and semiconductor device
- Patent number 12,278,423
- Issue date Apr 15, 2025
- Rohm Co., Ltd.
- Toshikazu Mukai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module with antenna and front end integrated circuit
- Patent number 12,279,353
- Issue date Apr 15, 2025
- Skyworks Solutions, Inc.
- George Khoury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Main-auxiliary field-effect transistor configurations
- Patent number 12,273,100
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and fabrication method
- Patent number 12,272,862
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING AN END-FIRE ANTENNA ARRAY
- Publication number 20250239542
- Publication date Jul 24, 2025
- Intel Corporation
- Tae Young YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233089
- Publication date Jul 17, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250226569
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20250226583
- Publication date Jul 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250226343
- Publication date Jul 10, 2025
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMATION
- Publication number 20250218973
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Hai LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITS FOR PROTECTING AGAINST ACCIDENTAL FUSE ACTIVATION
- Publication number 20250218936
- Publication date Jul 3, 2025
- Skyworks Solutions, Inc.
- Bo Zhou
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor Device and Method of Forming Selective Shielding Usin...
- Publication number 20250218985
- Publication date Jul 3, 2025
- STATS ChipPAC Pte Ltd.
- JinHee JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT COMPRISING A RF SWITCHES HAVING REDUCED PARASITI...
- Publication number 20250210550
- Publication date Jun 26, 2025
- STMicroelectronics (Crolles 2) SAS
- Stephane MONFRAY
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250210551
- Publication date Jun 26, 2025
- InnoLux Corporation
- Jen-Hai CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20250210852
- Publication date Jun 26, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERAHERTZ ELEMENT AND SEMICONDUCTOR DEVICE
- Publication number 20250210854
- Publication date Jun 26, 2025
- ROHM CO., LTD.
- Toshikazu MUKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250210552
- Publication date Jun 26, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20250201730
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF COMPONENT WITH INTEGRATED EMI SHIELDING
- Publication number 20250192067
- Publication date Jun 12, 2025
- APPLIED OPTOELECTRONICS, INC.
- William G. MAHONEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20250192079
- Publication date Jun 12, 2025
- AUO Corporation
- Yi-Cheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR BALUN STRUCTURE
- Publication number 20250189623
- Publication date Jun 12, 2025
- NXP B.V.
- Sjoerd Bosma
- G01 - MEASURING TESTING
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20250192080
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183517
- Publication date Jun 5, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic Device Package Including Antenna Horn and Semicondu...
- Publication number 20250183516
- Publication date Jun 5, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250174508
- Publication date May 29, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Tung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device
- Publication number 20250176268
- Publication date May 29, 2025
- InnoLux Corporation
- Chu-Ling YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174582
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Yang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS DEVICE WITH WAVEGUIDING STRUCTURES BETWEEN RADIATING STRUC...
- Publication number 20250174875
- Publication date May 29, 2025
- TEXAS INSTRUMENTS INCORPORATED
- VIKAS GUPTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS
- Publication number 20250167142
- Publication date May 22, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT AND STACKED FILTE...
- Publication number 20250159787
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Darren Roger Frenette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE
- Publication number 20250159812
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FRONT END SYSTEMS WITH SELECTIVELY SHIELDED RADIO FREQUENCY MODULE
- Publication number 20250159788
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES AND COMMUNICATION DEVICES
- Publication number 20250158269
- Publication date May 15, 2025
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS

for antenna

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatuses with radio-frequency line elements, and a...

Semiconductor packages with antennas

Electronic module carrying a plurality of electronic devices

Method for forming a semiconductor structure having a porous semico...

Power amplifier module with transistor dies for multiple amplifier...

Package structure

Antenna substrate and electronic device including the same

Chip package and manufacturing method thereof

Integrated fan-out package

Semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor package

Antenna in package having antenna on package substrate

Dual-mode wireless charging device

Semiconductor package structure and semiconductor manufacturing pro...

Package structure and method of manufacturing the same

Integrated circuit

Package structure and manufacturing method thereof

Antenna and device configurations

Method for manufacturing a radar sensor

Antenna package with via structure and method of formation thereof

Electronic component module

Antenna with micro-transfer-printed circuit element

Package comprising discrete antenna device

Electronic circuit comprising a RF switches having reduced parasiti...

Arrangement comprising an integrated circuit package and a heatsink...

Terahertz element and semiconductor device

Packaged module with antenna and front end integrated circuit

Main-auxiliary field-effect transistor configurations

Antenna apparatus and fabrication method

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE COMPRISING AN END-FIRE ANTENNA ARRAY

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND METHODS OF FORMATION

CIRCUITS FOR PROTECTING AGAINST ACCIDENTAL FUSE ACTIVATION

Semiconductor Device and Method of Forming Selective Shielding Usin...

ELECTRONIC CIRCUIT COMPRISING A RF SWITCHES HAVING REDUCED PARASITI...

ELECTRONIC DEVICE

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

TERAHERTZ ELEMENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE

Molded Laser Package with Electromagnetic Interference Shield and M...

RF COMPONENT WITH INTEGRATED EMI SHIELDING

ANTENNA DEVICE

PLANAR BALUN STRUCTURE

Integrated Devices in Semiconductor Packages and Methods of Forming...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Microelectronic Device Package Including Antenna Horn and Semicondu...

SEMICONDUCTOR DEVICE PACKAGE

Electronic device

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

WIRELESS DEVICE WITH WAVEGUIDING STRUCTURES BETWEEN RADIATING STRUC...

PITCH-REDUCING SOLDER INTERCONNECT FOR RF TRANSITIONS

PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT AND STACKED FILTE...

INTEGRATED CIRCUIT STRUCTURE

FRONT END SYSTEMS WITH SELECTIVELY SHIELDED RADIO FREQUENCY MODULE

ANTENNA MODULES AND COMMUNICATION DEVICES