for antenna

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H01L2223/6677

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6677for antenna

Industries

Patents Grantslast 30 patents

Information Patent Grant
Arrangement comprising an integrated circuit package and a heatsink...
- Patent number 12,288,757
- Issue date Apr 29, 2025
- SIVERS WIRELESS AB
- Erik Öjefors
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terahertz element and semiconductor device
- Patent number 12,278,423
- Issue date Apr 15, 2025
- Rohm Co., Ltd.
- Toshikazu Mukai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged module with antenna and front end integrated circuit
- Patent number 12,279,353
- Issue date Apr 15, 2025
- Skyworks Solutions, Inc.
- George Khoury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Main-auxiliary field-effect transistor configurations
- Patent number 12,273,100
- Issue date Apr 8, 2025
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna apparatus and fabrication method
- Patent number 12,272,862
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 12,266,847
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,266,618
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 12,266,614
- Issue date Apr 1, 2025
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,261,350
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Guo-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management in integrated circuit packages
- Patent number 12,261,097
- Issue date Mar 25, 2025
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna chip packaging structure and method for preparing same
- Patent number 12,255,159
- Issue date Mar 18, 2025
- SJ SEMICONDUCTOR(JIANGYIN) CORPORATION
- Yayuan Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules and communication devices
- Patent number 12,255,382
- Issue date Mar 18, 2025
- Intel Corporation
- Sidharth Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,249,585
- Issue date Mar 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waferscale physiological characteristic sensor package with integra...
- Patent number 12,232,842
- Issue date Feb 25, 2025
- Medtronic MiniMed, Inc.
- Daniel Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency filters on silicon-o...
- Patent number 12,237,861
- Issue date Feb 25, 2025
- Skyworks Solutions, Inc.
- James Phillip Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure
- Patent number 12,238,865
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for ground fencing
- Patent number 12,230,879
- Issue date Feb 18, 2025
- Apple Inc.
- Xiaofang Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Millimeter-wave antenna chip and terminal device
- Patent number 12,224,254
- Issue date Feb 11, 2025
- Huawei Technologies Co., Ltd.
- Weixi Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including lead frame having multiple conductive...
- Patent number 12,224,255
- Issue date Feb 11, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device package including antenna horn and semicondu...
- Patent number 12,224,480
- Issue date Feb 11, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,224,481
- Issue date Feb 11, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,211,765
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Wei-Tung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single die design for different polarizations
- Patent number 12,212,074
- Issue date Jan 28, 2025
- NXP B.V.
- Jan Willem Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor package wi...
- Patent number 12,211,803
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming discrete antenna modules
- Patent number 12,211,808
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon on sapphire substrate for edge computer
- Patent number 12,205,936
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Devendra K. Sadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME
- Publication number 20250140679
- Publication date May 1, 2025
- JCET STATS ChipPAC Korea Limited
- SangHoon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132272
- Publication date Apr 24, 2025
- InnoLux Corporation
- Jui-Jen YUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...
- Publication number 20250132273
- Publication date Apr 24, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250125289
- Publication date Apr 17, 2025
- STATS ChipPAC Pte Ltd.
- KaiChong CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MESH INDUCTORS AND ANTENNAS OF ELECTRONIC ASSEMBLIES
- Publication number 20250105143
- Publication date Mar 27, 2025
- Super Micro Computer, Inc.
- Manhtien V. PHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Three-Dimensional On-Chip Inductors
- Publication number 20250098185
- Publication date Mar 20, 2025
- Apple Inc.
- Ming-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...
- Publication number 20250096180
- Publication date Mar 20, 2025
- Fujitsu Limited
- Shirou OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna Apparatus and Method
- Publication number 20250096167
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Wei KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO COMPENSATED POWER DETECTOR
- Publication number 20250085316
- Publication date Mar 13, 2025
- Skyworks Solutions, Inc.
- Adrian John BERGSMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE COMPRISING ANTENNA AND COMMUNICATION M...
- Publication number 20250087606
- Publication date Mar 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES
- Publication number 20250087604
- Publication date Mar 13, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250087605
- Publication date Mar 13, 2025
- STMicroelectronics International N.V.
- Antoine Le Ravallec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- Publication number 20250079374
- Publication date Mar 6, 2025
- Fujitsu Limited
- Shinya SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079689
- Publication date Mar 6, 2025
- Advanced Semiconductor Engineering, Inc.
- Christophe ZINCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DIODE INTEGRATION WITH BACKSIDE BACK END OF THE LINE NETWORK
- Publication number 20250079349
- Publication date Mar 6, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming AIP Structure to Reduce...
- Publication number 20250079350
- Publication date Mar 6, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRICAL DEVICES AND RELATED METHODS
- Publication number 20250070814
- Publication date Feb 27, 2025
- Skyworks Solutions, Inc.
- Andrew Martin KAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20250070058
- Publication date Feb 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY
- Publication number 20250054876
- Publication date Feb 13, 2025
- Skyworks Solutions, Inc.
- Howard E. CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20250055175
- Publication date Feb 13, 2025
- PanelSemi Corporation
- Ching-Kuang Clive TZUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ANTENNA
- Publication number 20250046737
- Publication date Feb 6, 2025
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE
- Publication number 20250038136
- Publication date Jan 30, 2025
- Advanced Semiconductor Engineering, Inc.
- Cheng-Nan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...
- Publication number 20250038127
- Publication date Jan 30, 2025
- Lodestar Licensing Group, LLC
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
- Publication number 20250029940
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS FOR PROGRAMMING A FUSE
- Publication number 20250022674
- Publication date Jan 16, 2025
- Skyworks Solutions, Inc.
- Bo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
- Publication number 20250015020
- Publication date Jan 9, 2025
- MURATA MANUFACTURING CO., LTD.
- Atsushi ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ...
- Publication number 20250006667
- Publication date Jan 2, 2025
- Intel Corporation
- Georgios PANAGOPOULOS
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SWITCHES WITH VOLTAGE LEVEL SHIFTERS IN RADIO FREQUENCY APPLICATIONS
- Publication number 20250007499
- Publication date Jan 2, 2025
- Skyworks Solutions, Inc.
- Florinel G. Balteanu
- H03 - BASIC ELECTRONIC CIRCUITRY

for antenna

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Arrangement comprising an integrated circuit package and a heatsink...

Terahertz element and semiconductor device

Packaged module with antenna and front end integrated circuit

Main-auxiliary field-effect transistor configurations

Antenna apparatus and fabrication method

Integrated devices in semiconductor packages and methods of forming...

Semiconductor packages and manufacturing methods thereof

Semiconductor device and method of manufacturing the same

Molded laser package with electromagnetic interference shield and m...

Semiconductor packages including antenna pattern

Semiconductor device package and method of manufacturing the same

Thermal management in integrated circuit packages

Antenna modules employing three-dimensional (3D) build-up on mold p...

Antenna chip packaging structure and method for preparing same

Antenna modules and communication devices

Semiconductor device package

Waferscale physiological characteristic sensor package with integra...

Devices and methods related to radio-frequency filters on silicon-o...

Integrated circuit structure

System and method for ground fencing

Millimeter-wave antenna chip and terminal device

Electronic package including lead frame having multiple conductive...

Microelectronic device package including antenna horn and semicondu...

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Single die design for different polarizations

Semiconductor device and method of forming semiconductor package wi...

Semiconductor device and method of forming discrete antenna modules

Silicon on sapphire substrate for edge computer

Methods of forming microelectronic device assemblies and packages

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE ASSEMBLY AND METHODS FOR FORMING THE SAME

ELECTRONIC DEVICE

ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...

INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME

MESH INDUCTORS AND ANTENNAS OF ELECTRONIC ASSEMBLIES

Electronic Device with Three-Dimensional On-Chip Inductors

SEMICONDUCTOR DEVICE, WIRELESS COMMUNICATION DEVICE, AND METHOD FOR...

Antenna Apparatus and Method

DEVICES AND METHODS RELATED TO COMPENSATED POWER DETECTOR

SEMICONDUCTOR DEVICE PACKAGE COMPRISING ANTENNA AND COMMUNICATION M...

DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

ANTENNA DIODE INTEGRATION WITH BACKSIDE BACK END OF THE LINE NETWORK

Semiconductor Device and Method of Forming AIP Structure to Reduce...

PACKAGED ELECTRICAL DEVICES AND RELATED METHODS

SEMICONDUCTOR DEVICE PACKAGE

SIGNAL ISOLATION FOR MODULE WITH BALL GRID ARRAY

ANTENNA DEVICE

SEMICONDUCTOR PACKAGE INCLUDING ANTENNA

DEVICE PACKAGE

SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH ANTENNAS AND EMI...

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME

DEVICES AND METHODS FOR PROGRAMMING A FUSE

IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE

AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ...

SWITCHES WITH VOLTAGE LEVEL SHIFTERS IN RADIO FREQUENCY APPLICATIONS