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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2223/00
Details relating to semiconductor or other solid state devices covered by the group H01L23/00
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H01L2223/6677
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Patents Grants
last 30 patents
Information
Patent Grant
Multiple conductive posts
Patent number
11,973,043
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chih-Hsien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna module and electronic device including the same
Patent number
11,967,752
Issue date
Apr 23, 2024
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Ho Kyung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
Patent number
11,967,562
Issue date
Apr 23, 2024
Infineon Technologies AG
Horst Theuss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having improved thermal interface between sem...
Patent number
11,967,570
Issue date
Apr 23, 2024
Mediatek Inc.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna module and electronic device including the same
Patent number
11,967,759
Issue date
Apr 23, 2024
Samsung Electronics Co., Ltd.
Soon Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Efficient wave guide transition between package and PCB using solde...
Patent number
11,963,291
Issue date
Apr 16, 2024
NXP B.V.
Leo van Gemert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna apparatus and method
Patent number
11,961,809
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Feng-Wei Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic device assemblies and packages including multiple d...
Patent number
11,961,825
Issue date
Apr 16, 2024
Micron Technology, Inc.
Aparna U. Limaye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package including multiple substrates with dif...
Patent number
11,955,419
Issue date
Apr 9, 2024
Advanced Semiconductor Engineering, Inc.
Yi Chun Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-frequency module and communication device
Patent number
11,955,933
Issue date
Apr 9, 2024
Murata Manufacturing Co., Ltd.
Atsushi Horita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Differential on-chip loop antenna
Patent number
11,955,728
Issue date
Apr 9, 2024
Intel Corporation
Nir Weisman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Millimeter wave antenna tuner
Patent number
11,949,175
Issue date
Apr 2, 2024
QUALCOMM Incorporated
Chuan Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming stacked semiconductors die assemblies
Patent number
11,948,921
Issue date
Apr 2, 2024
Randon K. Richards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,942,442
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Sen-Kuei Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Single-package wireless communication device
Patent number
11,942,676
Issue date
Mar 26, 2024
Tahoe Research, LTD.
Mohamed A. Megahed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package thermal spreader having integrated EF/EMI shi...
Patent number
11,935,809
Issue date
Mar 19, 2024
NXP USA, INC.
Zhiwei Gong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,935,847
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Myungsam Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with an antenna substrate
Patent number
11,935,849
Issue date
Mar 19, 2024
Samsung Electronics Co., Ltd.
Myungsam Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sputtered SiP antenna
Patent number
11,929,542
Issue date
Mar 12, 2024
Analog Devices International Unlimited Company
Romulo Maggay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package
Patent number
11,929,333
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-density flip chip package for wireless transceivers
Patent number
11,923,323
Issue date
Mar 5, 2024
QUALCOMM Incorporated
Ibrahim Ramez Chamas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and corresponding manufacturing method
Patent number
11,915,989
Issue date
Feb 27, 2024
STMicroelectronics S.r.l.
Giovanni Graziosi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with embedded flexible circuit
Patent number
11,916,007
Issue date
Feb 27, 2024
Infineon Technologies AG
Ashutosh Baheti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,908,787
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package
Patent number
11,908,815
Issue date
Feb 20, 2024
Advanced Semiconductor Engineering, Inc.
Wen Hung Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System and method for physically detecting counterfeit electronics
Patent number
11,908,811
Issue date
Feb 20, 2024
NOKOMIS, INC.
Walter J. Keller
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Fabricated two-sided millimeter wave antenna using through-silicon-...
Patent number
11,908,814
Issue date
Feb 20, 2024
Micron Technology, Inc.
John F. Kaeding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna module
Patent number
11,909,099
Issue date
Feb 20, 2024
Samsung Electronics Co., Ltd.
Won Wook So
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wireless module
Patent number
11,901,317
Issue date
Feb 13, 2024
Fujikura Ltd.
Kohei Matsumaru
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
3D PRINTED SEMICONDUCTOR PACKAGE
Publication number
20240145526
Publication date
May 2, 2024
TEXAS INSTRUMENTS INCORPORATED
Benjamin Stassen Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND ELECTRONIC APPARATUS
Publication number
20240145415
Publication date
May 2, 2024
PanelSemi Corporation
HSIEN-TE CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS FOR PROGRAMMING A FUSE
Publication number
20240128041
Publication date
Apr 18, 2024
Skyworks Solutions, Inc.
Bo Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Semiconductor Package wi...
Publication number
20240128201
Publication date
Apr 18, 2024
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID CHIP CARRIER PACKAGE
Publication number
20240128170
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
Publication number
20240120289
Publication date
Apr 11, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING INDUCTOR AND SEMICONDUCTOR...
Publication number
20240120297
Publication date
Apr 11, 2024
TEXAS INSTRUMENTS INCORPORATED
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240120640
Publication date
Apr 11, 2024
Advanced Semiconductor Engineering, Inc.
Jenchun CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTONICALLY STEERED IMPEDANCE SURFACE ANTENNAS
Publication number
20240120651
Publication date
Apr 11, 2024
Intel Corporation
Zhen Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR...
Publication number
20240113413
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIDE BANDGAP TRANSISTOR LAYOUT WITH FOLDED GATE
Publication number
20240113180
Publication date
Apr 4, 2024
Skyworks Solutions, Inc.
Guillaume Alexandre BLIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIDE BANDGAP TRANSISTOR LAYOUT WITH DRAIN ON OUTER EDGE
Publication number
20240113051
Publication date
Apr 4, 2024
Skyworks Solutions, Inc.
Guillaume Alexandre Blin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
Publication number
20240114794
Publication date
Apr 4, 2024
Skyworks Solutions, Inc.
Hardik Bhupendra MODI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES WITH DIRECTIONAL ANTENNAS
Publication number
20240113050
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Juan Herbsommer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Antenna Apparatus and Fabrication Method
Publication number
20240097313
Publication date
Mar 21, 2024
INFINEON TECHNOLOGIES AG
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...
Publication number
20240096817
Publication date
Mar 21, 2024
QUALCOMM Incorporated
Ranadeep DUTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ANTENNA
Publication number
20240088083
Publication date
Mar 14, 2024
Fujitsu Limited
Junya IKEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
Publication number
20240088068
Publication date
Mar 14, 2024
NXP USA, Inc.
Michael B. Vincent
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MAKING ELECTRONIC PACKAGE
Publication number
20240071991
Publication date
Feb 29, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
Publication number
20240063544
Publication date
Feb 22, 2024
Intel Corporation
Jimin Yao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
Publication number
20240047852
Publication date
Feb 8, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Kyoung Yeon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Antenna Package with Via Structure and Method of Formation Thereof
Publication number
20240047855
Publication date
Feb 8, 2024
INFINEON TECHNOLOGIES AG
Eung San Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT,...
Publication number
20240045329
Publication date
Feb 8, 2024
TORAY INDUSTRIES, INC.
Masaya JUKEI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW TH...
Publication number
20240047295
Publication date
Feb 8, 2024
Qorvo US, Inc.
George Maxim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN
Publication number
20240038644
Publication date
Feb 1, 2024
STMicroelectronics (Grenoble 2) SAS
Romain COFFY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL ANTENNA MODULE AND SEM...
Publication number
20240038691
Publication date
Feb 1, 2024
TEXAS INSTRUMENTS INCORPORATED
Vijaylaxmi Gumaste Khanolkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Publication number
20240038692
Publication date
Feb 1, 2024
Murata Manufacturing Co., Ltd.
Takashi YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUC...
Publication number
20240030164
Publication date
Jan 25, 2024
SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
SHUN-HSING LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RADIO-FREQUENCY MODULE
Publication number
20240030166
Publication date
Jan 25, 2024
Murata Manufacturing Co., Ltd.
Hiromichi KITAJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
Publication number
20240030098
Publication date
Jan 25, 2024
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS