for controlling the passage of optical signals through the package

Industry

CPC
B81B7/0067

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0067for controlling the passage of optical signals through the package

Industries

Patents Grantslast 30 patents

Information Patent Grant
MEMs phased-array for LiDAR applications
- Patent number 12,117,606
- Issue date Oct 15, 2024
- SCREEN Holdings Co., Ltd.
- Yuki Ashida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package with shock and vibration protection
- Patent number 11,975,961
- Issue date May 7, 2024
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
IR emitter with glass lid
- Patent number 11,926,521
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,887,906
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,873,212
- Issue date Jan 16, 2024
- Xintec Inc.
- Wei-Luen Suen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulant barrier
- Patent number 11,807,522
- Issue date Nov 7, 2023
- Texas Instruments Incorporated
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transmitting device for a LIDAR scanner having a scanning mirror co...
- Patent number 11,764,539
- Issue date Sep 19, 2023
- Jenoptik Optical Systems GmbH
- Uwe Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
- Patent number 11,764,117
- Issue date Sep 19, 2023
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wearable infrared temperature sensing device
- Patent number 11,719,579
- Issue date Aug 8, 2023
- PixArt Imaging Inc.
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 11,667,523
- Issue date Jun 6, 2023
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Emitter package for a photoacoustic sensor
- Patent number 11,609,180
- Issue date Mar 21, 2023
- Infineon Technologies AG
- Siyuan Qi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a micromechanical device having inclined optic...
- Patent number 11,584,640
- Issue date Feb 21, 2023
- Robert Bosch GmbH
- Benjamin Steuer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS mirror arrangement for detecting a large angular range
- Patent number 11,531,196
- Issue date Dec 20, 2022
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hans-Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transmitting device with a scanning mirror covered by a collimating...
- Patent number 11,522,335
- Issue date Dec 6, 2022
- Jenoptik Optical Systems GmbH
- Uwe Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Production method for a micromechanical device having inclined opti...
- Patent number 11,479,461
- Issue date Oct 25, 2022
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic housing comprising a getter, optoelectronic component or M...
- Patent number 11,305,983
- Issue date Apr 19, 2022
- LYNRED
- Sylvain Lemettre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wearable infrared temperature sensing device
- Patent number 11,268,859
- Issue date Mar 8, 2022
- PixArt Imaging Inc.
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging for compact object-scanning modules
- Patent number 11,262,577
- Issue date Mar 1, 2022
- AdHawk Microsystems
- Niladri Sarkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,201,096
- Issue date Dec 14, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-device transducer modulus, electronic apparatus including the...
- Patent number 11,053,115
- Issue date Jul 6, 2021
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Protective wafer including inclined optical windows and device
- Patent number 10,996,461
- Issue date May 4, 2021
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 10,894,712
- Issue date Jan 19, 2021
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package
- Patent number 10,752,494
- Issue date Aug 25, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package
- Patent number 10,745,269
- Issue date Aug 18, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Nick Renaud-Bezot
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging MEMS in fluidic environments
- Patent number 10,712,525
- Issue date Jul 14, 2020
- Albert Ting
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulant barrier
- Patent number 10,710,875
- Issue date Jul 14, 2020
- Texas Instruments Incorporated
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wearable infrared temperature sensing device
- Patent number 10,670,465
- Issue date Jun 2, 2020
- PixArt Imaging Inc.
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lighting module for motor vehicle projector
- Patent number 10,641,456
- Issue date May 5, 2020
- Valeo Vision
- Pierre Choquet
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for manufacturing a protective wafer including inclined opti...
- Patent number 10,591,721
- Issue date Mar 17, 2020
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Tilted chip assembly for optical devices
- Patent number 10,571,682
- Issue date Feb 25, 2020
- Infineon Technologies AG
- Ludwig Heitzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF
- Publication number 20240239648
- Publication date Jul 18, 2024
- STMicroelectronics S.r.l.
- Silvia NICOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240109769
- Publication date Apr 4, 2024
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR
- Publication number 20230384164
- Publication date Nov 30, 2023
- MSG Lithoglas GmbH
- David Bunel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE DEVICE
- Publication number 20230314229
- Publication date Oct 5, 2023
- PIXART IMAGING Inc.
- CHIH-MING SUN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FO...
- Publication number 20230288695
- Publication date Sep 14, 2023
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE INFRARED TEMPERATURE SENSING DEVICE
- Publication number 20220136905
- Publication date May 5, 2022
- PIXART IMAGING Inc.
- CHIH-MING SUN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE
- Publication number 20220077014
- Publication date Mar 10, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETIC HOUSING COMPRISING A GETTER, OPTOELECTRONIC COMPONENT OR M...
- Publication number 20220033250
- Publication date Feb 3, 2022
- LYNRED
- Sylvain Lemettre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGE WITH SHOCK AND VIBRATION PROTECTION
- Publication number 20220033253
- Publication date Feb 3, 2022
- Youmin Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A MEMS Package
- Publication number 20210276859
- Publication date Sep 9, 2021
- IGNITE, Inc.
- Fusao Ishii
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210269303
- Publication date Sep 2, 2021
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
IR Emitter with Glass Lid
- Publication number 20210246016
- Publication date Aug 12, 2021
- INFINEON TECHNOLOGIES AG
- Stephan Pindl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Emitter Package for a Photoacoustic Sensor
- Publication number 20210172862
- Publication date Jun 10, 2021
- INFINEON TECHNOLOGIES AG
- Siyuan Qi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL ELECTRONICS DEVICE
- Publication number 20210139320
- Publication date May 13, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMs Phased-Array for LiDAR Applications
- Publication number 20210072531
- Publication date Mar 11, 2021
- SCREEN Holdings Co., Ltd.
- Yuki Ashida
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND...
- Publication number 20210028077
- Publication date Jan 28, 2021
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE
- Publication number 20210013116
- Publication date Jan 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING INCLINED OPTIC...
- Publication number 20200391998
- Publication date Dec 17, 2020
- ROBERT BOSCH GmbH
- Benjamin Steuer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE
- Publication number 20200385264
- Publication date Dec 10, 2020
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULANT BARRIER
- Publication number 20200339416
- Publication date Oct 29, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE INFRARED TEMPERATURE SENSING DEVICE
- Publication number 20200240846
- Publication date Jul 30, 2020
- PIXART IMAGING Inc.
- CHIH-MING SUN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A PROTECTIVE WAFER INCLUDING INCLINED OPTI...
- Publication number 20200166743
- Publication date May 28, 2020
- ROBERT BOSCH GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AN MEMS MIRROR ARRANGEMENT AND A METHOD FOR MANUFACTURING AN MEMS M...
- Publication number 20200159006
- Publication date May 21, 2020
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Hans-Joachim Quenzer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200140262
- Publication date May 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Ching-Han HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COATED OPTICAL ELEMENT COMPONENT WITH A COATED OPTICAL ELEMENT AND...
- Publication number 20190330054
- Publication date Oct 31, 2019
- SCHOTT AG
- Marcelo David Ackermann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR PRODUCING PACKAGED S...
- Publication number 20190270636
- Publication date Sep 5, 2019
- INFINEON TECHNOLOGIES AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaging for Compact Object-Scanning Modules
- Publication number 20190196179
- Publication date Jun 27, 2019
- AdHawk Microsystems
- Niladri Sarkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULANT BARRIER
- Publication number 20190144270
- Publication date May 16, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Jane Qian Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE INFRARED TEMPERATURE SENSING DEVICE
- Publication number 20190086267
- Publication date Mar 21, 2019
- PIXART IMAGING Inc.
- CHIH-MING SUN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH VIEWER WINDOW AND MANUFACTURING METHOD THEREOF
- Publication number 20190062151
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

for controlling the passage of optical signals through the package

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMs phased-array for LiDAR applications

MEMS package with shock and vibration protection

IR emitter with glass lid

Packaged device with die wrapped by a substrate

Chip package and manufacturing method thereof

Encapsulant barrier

Transmitting device for a LIDAR scanner having a scanning mirror co...

Hermetically sealed optically transparent wafer-level packages and...

Wearable infrared temperature sensing device

Optical electronics device

Emitter package for a photoacoustic sensor

Method for producing a micromechanical device having inclined optic...

MEMS mirror arrangement for detecting a large angular range

Transmitting device with a scanning mirror covered by a collimating...

Production method for a micromechanical device having inclined opti...

Hermetic housing comprising a getter, optoelectronic component or M...

Wearable infrared temperature sensing device

Packaging for compact object-scanning modules

Packaged device with die wrapped by a substrate

Multi-device transducer modulus, electronic apparatus including the...

Protective wafer including inclined optical windows and device

Optical electronics device

Semiconductor device package

MEMS package

Packaging MEMS in fluidic environments

Encapsulant barrier

Wearable infrared temperature sensing device

Lighting module for motor vehicle projector

Method for manufacturing a protective wafer including inclined opti...

Tilted chip assembly for optical devices

Patents Applicationslast 30 patents

MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

INFRARED DETECTOR FORMING METHOD AND ASSOCIATED INFRARED DETECTOR

WEARABLE DEVICE

3D DOME WAFER-LEVEL PACKAGE FOR OPTICAL MEMS MIRROR WITH REDUCED FO...

WEARABLE INFRARED TEMPERATURE SENSING DEVICE

PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE

HERMETIC HOUSING COMPRISING A GETTER, OPTOELECTRONIC COMPONENT OR M...

MEMS PACKAGE WITH SHOCK AND VIBRATION PROTECTION

A MEMS Package

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

IR Emitter with Glass Lid

Emitter Package for a Photoacoustic Sensor

OPTICAL ELECTRONICS DEVICE

MEMs Phased-Array for LiDAR Applications

HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND...

PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE

METHOD FOR PRODUCING A MICROMECHANICAL DEVICE HAVING INCLINED OPTIC...

GENERATING A MEMS DEVICE WITH GLASS COVER AND MEMS DEVICE

ENCAPSULANT BARRIER

WEARABLE INFRARED TEMPERATURE SENSING DEVICE

METHOD FOR MANUFACTURING A PROTECTIVE WAFER INCLUDING INCLINED OPTI...

AN MEMS MIRROR ARRANGEMENT AND A METHOD FOR MANUFACTURING AN MEMS M...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

COATED OPTICAL ELEMENT COMPONENT WITH A COATED OPTICAL ELEMENT AND...

PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR PRODUCING PACKAGED S...

Packaging for Compact Object-Scanning Modules

ENCAPSULANT BARRIER

WEARABLE INFRARED TEMPERATURE SENSING DEVICE

MEMS DEVICE WITH VIEWER WINDOW AND MANUFACTURING METHOD THEREOF