for devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g. silicon on sapphire devices

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H01L23/4825

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4825for devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g. silicon on sapphire devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,142,547
- Issue date Nov 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuki Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat slug attached to a die pad for semiconductor package
- Patent number 12,136,588
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge power delivery architectures and processes
- Patent number 12,027,448
- Issue date Jul 2, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
- Patent number 11,973,033
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection circuit having a metal connectio...
- Patent number 11,929,305
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating field-effect transistors with interleaved source and dr...
- Patent number 11,842,947
- Issue date Dec 12, 2023
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator transistor layout for radio frequency po...
- Patent number 11,804,435
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip having a buried power rail
- Patent number 11,742,292
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Marcus Johannes Henricus Van Dal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 11,476,208
- Issue date Oct 18, 2022
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,322,428
- Issue date May 3, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of penetrating electrode interconnections
- Patent number 11,056,463
- Issue date Jul 6, 2021
- Sony Corporation
- Hiroshi Takahashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabricating field-effect transistors with body contacts between sou...
- Patent number 11,004,774
- Issue date May 11, 2021
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-symmetric body contacts for field-effect transistors
- Patent number 10,847,445
- Issue date Nov 24, 2020
- Skyworks Solutions, Inc.
- Hailing Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,790,190
- Issue date Sep 29, 2020
- ELPIS TECHNOLOGIES INC.
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked field-effect transistor switch
- Patent number 10,749,518
- Issue date Aug 18, 2020
- Qorvo US, Inc.
- George Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 10,741,507
- Issue date Aug 11, 2020
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,629,482
- Issue date Apr 21, 2020
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,573,554
- Issue date Feb 25, 2020
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,566,235
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual bond pad structure for photonics
- Patent number 10,476,227
- Issue date Nov 12, 2019
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Body contacts for field-effect transistors
- Patent number 10,410,957
- Issue date Sep 10, 2019
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,361,123
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,236,339
- Issue date Mar 19, 2019
- Kabushiki Kaisha Toshiba
- Shinya Kyogoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip reference electrode for biologically sensitive field effect...
- Patent number 10,101,295
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsien Chang
- G01 - MEASURING TESTING
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,074,561
- Issue date Sep 11, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,068,851
- Issue date Sep 4, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 9,852,944
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal layout for radio-frequency switches
- Patent number 9,852,978
- Issue date Dec 26, 2017
- Skyworks Solutions, Inc.
- Ambarish Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency switches having redu...
- Patent number 9,741,653
- Issue date Aug 22, 2017
- Skyworks Solutions, Inc.
- Ambarish Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated-gate photoconductive semiconductor switch
- Patent number 9,543,462
- Issue date Jan 10, 2017
- XI'AN UNIVERSITY OF TECHNOLOGY
- Xinmei Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE
- Publication number 20250022782
- Publication date Jan 16, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
- Publication number 20240404952
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS WITH INTERLEAVED FINGER CONFIGURATION
- Publication number 20240250003
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT
- Publication number 20240186220
- Publication date Jun 6, 2024
- INFINEON TECHNOLOGIES AG
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP HAVING A BURIED POWER RAIL
- Publication number 20230361041
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Marcus Johannes Henricus VAN DAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AMPLIFYING DEVICE, AND METHOD OF MANUFACTURIN...
- Publication number 20230326832
- Publication date Oct 12, 2023
- Fujitsu Limited
- Tsuyoshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220270954
- Publication date Aug 25, 2022
- Sony Semiconductor Solutions Corporation
- YUKI YANAGISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTROSTATIC DISCHARGE PROTECTION CIRC...
- Publication number 20220165646
- Publication date May 26, 2022
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING FIELD-EFFECT TRANSISTORS WITH INTERLEAVED SOURCE AND DR...
- Publication number 20210265242
- Publication date Aug 26, 2021
- Skyworks Solutions, Inc.
- Hailing Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT FOR RADIO FREQUENCY PO...
- Publication number 20210210415
- Publication date Jul 8, 2021
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210166993
- Publication date Jun 3, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING TECHNIQUES FOR BACKSIDE-BIASED SEMICONDUCTOR DICE AND REL...
- Publication number 20200365530
- Publication date Nov 19, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200266125
- Publication date Aug 20, 2020
- SK HYNIX INC.
- Min-Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING FIELD-EFFECT TRANSISTORS WITH BODY CONTACTS
- Publication number 20200075462
- Publication date Mar 5, 2020
- SKYWORKS SOLUTIONS, INC.
- Hailing Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
- Publication number 20200014171
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20190267285
- Publication date Aug 29, 2019
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20180286748
- Publication date Oct 4, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP REFERENCE ELECTRODE FOR BIOLOGICALLY SENSITIVE FIELD EFFECT...
- Publication number 20180172627
- Publication date Jun 21, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Hsien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FIELD-EFFECT TRANSISTOR SWITCH
- Publication number 20180145678
- Publication date May 24, 2018
- Qorvo US, Inc.
- George Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180083094
- Publication date Mar 22, 2018
- KABUSHIKI KAISHA TOSHIBA
- Shinya Kyogoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20180068891
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20180068892
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20180040509
- Publication date Feb 8, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BODY CONTACTS FOR FIELD-EFFECT TRANSISTORS
- Publication number 20170287813
- Publication date Oct 5, 2017
- SKYWORKS SOLUTIONS, INC.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
- Publication number 20170125974
- Publication date May 4, 2017
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO FINAL SUBSTRATE
- Publication number 20160372372
- Publication date Dec 22, 2016
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LAYOUT FOR RADIO-FREQUENCY SWITCHES
- Publication number 20160225709
- Publication date Aug 4, 2016
- SKYWORKS SOLUTIONS, INC.
- Ambarish ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURES AND METHODS OF MAKING SAME
- Publication number 20140264878
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20140209908
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURES AND METHODS OF MAKING SAME
- Publication number 20140124933
- Publication date May 8, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS

for devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g. silicon on sapphire devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Heat slug attached to a die pad for semiconductor package

Open cavity bridge power delivery architectures and processes

Flip-chip semiconductor-on-insulator transistor layout

Electrostatic discharge protection circuit having a metal connectio...

Fabricating field-effect transistors with interleaved source and dr...

Semiconductor-on-insulator transistor layout for radio frequency po...

Integrated chip having a buried power rail

Grounding techniques for backside-biased semiconductor dice and rel...

Semiconductor device package and method of manufacturing the same

Arrangement of penetrating electrode interconnections

Fabricating field-effect transistors with body contacts between sou...

Non-symmetric body contacts for field-effect transistors

Backside contact to a final substrate

Stacked field-effect transistor switch

Grounding techniques for backside-biased semiconductor dice and rel...

Backside contact to a final substrate

Backside contact to a final substrate

Backside contact to a final substrate

Dual bond pad structure for photonics

Body contacts for field-effect transistors

Backside contact to a final substrate

Semiconductor device

On-chip reference electrode for biologically sensitive field effect...

Backside contact to a final substrate

Semiconductor package structure and method for manufacturing the same

Backside contact to a final substrate

Metal layout for radio-frequency switches

Devices and methods related to radio-frequency switches having redu...

Insulated-gate photoconductive semiconductor switch

Patents Applicationslast 30 patents

HEAT SLUG ATTACHED TO A DIE PAD FOR SEMICONDUCTOR PACKAGE

FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT

FIELD-EFFECT TRANSISTORS WITH INTERLEAVED FINGER CONFIGURATION

ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT

INTEGRATED CHIP HAVING A BURIED POWER RAIL

SEMICONDUCTOR DEVICE, AMPLIFYING DEVICE, AND METHOD OF MANUFACTURIN...

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING AN ELECTROSTATIC DISCHARGE PROTECTION CIRC...

FABRICATING FIELD-EFFECT TRANSISTORS WITH INTERLEAVED SOURCE AND DR...

SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT FOR RADIO FREQUENCY PO...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

GROUNDING TECHNIQUES FOR BACKSIDE-BIASED SEMICONDUCTOR DICE AND REL...

SEMICONDUCTOR DEVICE

FABRICATING FIELD-EFFECT TRANSISTORS WITH BODY CONTACTS

DUAL BOND PAD STRUCTURE FOR PHOTONICS

BACKSIDE CONTACT TO A FINAL SUBSTRATE

BACKSIDE CONTACT TO A FINAL SUBSTRATE

ON-CHIP REFERENCE ELECTRODE FOR BIOLOGICALLY SENSITIVE FIELD EFFECT...

STACKED FIELD-EFFECT TRANSISTOR SWITCH

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

BACKSIDE CONTACT TO A FINAL SUBSTRATE

BACKSIDE CONTACT TO A FINAL SUBSTRATE

BACKSIDE CONTACT TO A FINAL SUBSTRATE

BODY CONTACTS FOR FIELD-EFFECT TRANSISTORS

DUAL BOND PAD STRUCTURE FOR PHOTONICS

BACKSIDE CONTACT TO FINAL SUBSTRATE

METAL LAYOUT FOR RADIO-FREQUENCY SWITCHES

COPPER INTERCONNECT STRUCTURES AND METHODS OF MAKING SAME

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

COPPER INTERCONNECT STRUCTURES AND METHODS OF MAKING SAME