for devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g. silicon on sapphire devices

Industry

CPC
H01L23/4825

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4825for devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g. silicon on sapphire devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
- Patent number 11,973,033
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection circuit having a metal connectio...
- Patent number 11,929,305
- Issue date Mar 12, 2024
- Infineon Technologies AG
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating field-effect transistors with interleaved source and dr...
- Patent number 11,842,947
- Issue date Dec 12, 2023
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator transistor layout for radio frequency po...
- Patent number 11,804,435
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip having a buried power rail
- Patent number 11,742,292
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Marcus Johannes Henricus Van Dal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 11,476,208
- Issue date Oct 18, 2022
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,322,428
- Issue date May 3, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of penetrating electrode interconnections
- Patent number 11,056,463
- Issue date Jul 6, 2021
- Sony Corporation
- Hiroshi Takahashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabricating field-effect transistors with body contacts between sou...
- Patent number 11,004,774
- Issue date May 11, 2021
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-symmetric body contacts for field-effect transistors
- Patent number 10,847,445
- Issue date Nov 24, 2020
- Skyworks Solutions, Inc.
- Hailing Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,790,190
- Issue date Sep 29, 2020
- ELPIS TECHNOLOGIES INC.
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked field-effect transistor switch
- Patent number 10,749,518
- Issue date Aug 18, 2020
- Qorvo US, Inc.
- George Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding techniques for backside-biased semiconductor dice and rel...
- Patent number 10,741,507
- Issue date Aug 11, 2020
- Microchip Technology Incorporated
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,629,482
- Issue date Apr 21, 2020
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,573,554
- Issue date Feb 25, 2020
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,566,235
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual bond pad structure for photonics
- Patent number 10,476,227
- Issue date Nov 12, 2019
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Body contacts for field-effect transistors
- Patent number 10,410,957
- Issue date Sep 10, 2019
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,361,123
- Issue date Jul 23, 2019
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,236,339
- Issue date Mar 19, 2019
- Kabushiki Kaisha Toshiba
- Shinya Kyogoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip reference electrode for biologically sensitive field effect...
- Patent number 10,101,295
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Hsien Chang
- G01 - MEASURING TESTING
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,074,561
- Issue date Sep 11, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,068,851
- Issue date Sep 4, 2018
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 9,852,944
- Issue date Dec 26, 2017
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal layout for radio-frequency switches
- Patent number 9,852,978
- Issue date Dec 26, 2017
- Skyworks Solutions, Inc.
- Ambarish Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to radio-frequency switches having redu...
- Patent number 9,741,653
- Issue date Aug 22, 2017
- Skyworks Solutions, Inc.
- Ambarish Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated-gate photoconductive semiconductor switch
- Patent number 9,543,462
- Issue date Jan 10, 2017
- XI'AN UNIVERSITY OF TECHNOLOGY
- Xinmei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to final substrate
- Patent number 9,514,987
- Issue date Dec 6, 2016
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattened substrate surface for substrate bonding
- Patent number 9,355,936
- Issue date May 31, 2016
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structures and methods of making same
- Patent number 9,159,653
- Issue date Oct 13, 2015
- GLOBALFOUNDRIES Inc.
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CHIP HAVING A BURIED POWER RAIL
- Publication number 20230361041
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Marcus Johannes Henricus VAN DAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AMPLIFYING DEVICE, AND METHOD OF MANUFACTURIN...
- Publication number 20230326832
- Publication date Oct 12, 2023
- Fujitsu Limited
- Tsuyoshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220270954
- Publication date Aug 25, 2022
- Sony Semiconductor Solutions Corporation
- YUKI YANAGISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTROSTATIC DISCHARGE PROTECTION CIRC...
- Publication number 20220165646
- Publication date May 26, 2022
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING FIELD-EFFECT TRANSISTORS WITH INTERLEAVED SOURCE AND DR...
- Publication number 20210265242
- Publication date Aug 26, 2021
- Skyworks Solutions, Inc.
- Hailing Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT FOR RADIO FREQUENCY PO...
- Publication number 20210210415
- Publication date Jul 8, 2021
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210166993
- Publication date Jun 3, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING TECHNIQUES FOR BACKSIDE-BIASED SEMICONDUCTOR DICE AND REL...
- Publication number 20200365530
- Publication date Nov 19, 2020
- MICROCHIP TECHNOLOGY INCORPORATED
- Behrooz Mehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200266125
- Publication date Aug 20, 2020
- SK HYNIX INC.
- Min-Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING FIELD-EFFECT TRANSISTORS WITH BODY CONTACTS
- Publication number 20200075462
- Publication date Mar 5, 2020
- SKYWORKS SOLUTIONS, INC.
- Hailing Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
- Publication number 20200014171
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20190267285
- Publication date Aug 29, 2019
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20180286748
- Publication date Oct 4, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP REFERENCE ELECTRODE FOR BIOLOGICALLY SENSITIVE FIELD EFFECT...
- Publication number 20180172627
- Publication date Jun 21, 2018
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Hsien Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FIELD-EFFECT TRANSISTOR SWITCH
- Publication number 20180145678
- Publication date May 24, 2018
- Qorvo US, Inc.
- George Maxim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180083094
- Publication date Mar 22, 2018
- KABUSHIKI KAISHA TOSHIBA
- Shinya Kyogoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20180068891
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20180068892
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO A FINAL SUBSTRATE
- Publication number 20180040509
- Publication date Feb 8, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BODY CONTACTS FOR FIELD-EFFECT TRANSISTORS
- Publication number 20170287813
- Publication date Oct 5, 2017
- SKYWORKS SOLUTIONS, INC.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL BOND PAD STRUCTURE FOR PHOTONICS
- Publication number 20170125974
- Publication date May 4, 2017
- International Business Machines Corporation
- Jeffrey P. GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO FINAL SUBSTRATE
- Publication number 20160372372
- Publication date Dec 22, 2016
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LAYOUT FOR RADIO-FREQUENCY SWITCHES
- Publication number 20160225709
- Publication date Aug 4, 2016
- SKYWORKS SOLUTIONS, INC.
- Ambarish ROY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURES AND METHODS OF MAKING SAME
- Publication number 20140264878
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20140209908
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURES AND METHODS OF MAKING SAME
- Publication number 20140124933
- Publication date May 8, 2014
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20130105981
- Publication date May 2, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pattern for improved visual inspection of semiconductor devices
- Publication number 20050118738
- Publication date Jun 2, 2005
- Ralph C. Tuttle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20050042808
- Publication date Feb 24, 2005
- NEC Electronics Corporation
- Syogo Kawahigashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040135211
- Publication date Jul 15, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Yasuo Inoue
- H01 - BASIC ELECTRIC ELEMENTS

for devices consisting of semiconductor layers on insulating or semi-insulating substrates, e.g. silicon on sapphire devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Flip-chip semiconductor-on-insulator transistor layout

Electrostatic discharge protection circuit having a metal connectio...

Fabricating field-effect transistors with interleaved source and dr...

Semiconductor-on-insulator transistor layout for radio frequency po...

Integrated chip having a buried power rail

Grounding techniques for backside-biased semiconductor dice and rel...

Semiconductor device package and method of manufacturing the same

Arrangement of penetrating electrode interconnections

Fabricating field-effect transistors with body contacts between sou...

Non-symmetric body contacts for field-effect transistors

Backside contact to a final substrate

Stacked field-effect transistor switch

Grounding techniques for backside-biased semiconductor dice and rel...

Backside contact to a final substrate

Backside contact to a final substrate

Backside contact to a final substrate

Dual bond pad structure for photonics

Body contacts for field-effect transistors

Backside contact to a final substrate

Semiconductor device

On-chip reference electrode for biologically sensitive field effect...

Backside contact to a final substrate

Semiconductor package structure and method for manufacturing the same

Backside contact to a final substrate

Metal layout for radio-frequency switches

Devices and methods related to radio-frequency switches having redu...

Insulated-gate photoconductive semiconductor switch

Backside contact to final substrate

Flattened substrate surface for substrate bonding

Copper interconnect structures and methods of making same

Patents Applicationslast 30 patents

INTEGRATED CHIP HAVING A BURIED POWER RAIL

SEMICONDUCTOR DEVICE, AMPLIFYING DEVICE, AND METHOD OF MANUFACTURIN...

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING AN ELECTROSTATIC DISCHARGE PROTECTION CIRC...

FABRICATING FIELD-EFFECT TRANSISTORS WITH INTERLEAVED SOURCE AND DR...

SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT FOR RADIO FREQUENCY PO...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

GROUNDING TECHNIQUES FOR BACKSIDE-BIASED SEMICONDUCTOR DICE AND REL...

SEMICONDUCTOR DEVICE

FABRICATING FIELD-EFFECT TRANSISTORS WITH BODY CONTACTS

DUAL BOND PAD STRUCTURE FOR PHOTONICS

BACKSIDE CONTACT TO A FINAL SUBSTRATE

BACKSIDE CONTACT TO A FINAL SUBSTRATE

ON-CHIP REFERENCE ELECTRODE FOR BIOLOGICALLY SENSITIVE FIELD EFFECT...

STACKED FIELD-EFFECT TRANSISTOR SWITCH

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

BACKSIDE CONTACT TO A FINAL SUBSTRATE

BACKSIDE CONTACT TO A FINAL SUBSTRATE

BACKSIDE CONTACT TO A FINAL SUBSTRATE

BODY CONTACTS FOR FIELD-EFFECT TRANSISTORS

DUAL BOND PAD STRUCTURE FOR PHOTONICS

BACKSIDE CONTACT TO FINAL SUBSTRATE

METAL LAYOUT FOR RADIO-FREQUENCY SWITCHES

COPPER INTERCONNECT STRUCTURES AND METHODS OF MAKING SAME

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

COPPER INTERCONNECT STRUCTURES AND METHODS OF MAKING SAME

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

Pattern for improved visual inspection of semiconductor devices

Semiconductor device and method of fabricating the same

Semiconductor device and method of manufacturing the same