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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor arrangements
Patent number
11,973,065
Issue date
Apr 30, 2024
Infineon Technologies AG
Daniel Domes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module
Patent number
11,973,071
Issue date
Apr 30, 2024
Infineon Technologies Austria AG
Gerhard Noebauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package
Patent number
11,973,018
Issue date
Apr 30, 2024
Advanced Semiconductor Engineering, Inc.
Chiung-Ying Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit semiconductor device including through silicon via
Patent number
11,955,408
Issue date
Apr 9, 2024
Samsung Electronics Co., Ltd.
Sohye Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Photonic wafer communication systems and related packages
Patent number
11,947,164
Issue date
Apr 2, 2024
Lightmatter, Inc.
Sukeshwar Kannan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,942,435
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power device module with dummy pad die layout
Patent number
11,935,817
Issue date
Mar 19, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Yusheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package module including a bonding system
Patent number
11,935,824
Issue date
Mar 19, 2024
Microchip Technology Incorporated
Justin Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device and fabrication method of the same having a boots layer
Patent number
11,935,823
Issue date
Mar 19, 2024
E Ink Holdings Inc.
Yi-Jiun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Signal processing board and image forming apparatus
Patent number
11,930,135
Issue date
Mar 12, 2024
Kyocera Document Solutions Inc.
Ken Maruhashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module
Patent number
11,923,265
Issue date
Mar 5, 2024
Delta Electronics (Shanghai) Co., Ltd.
Wei Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structures
Patent number
11,923,349
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chi-Hui Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module
Patent number
11,923,278
Issue date
Mar 5, 2024
Rohm Co., Ltd.
Masashi Hayashiguchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package differential pin pattern for cross-talk...
Patent number
11,917,749
Issue date
Feb 27, 2024
Marvell Israel (M.I.S.L) Ltd.
Dan Azeroual
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module
Patent number
11,908,778
Issue date
Feb 20, 2024
Denso Corporation
Hiroshi Ishino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cell structures and power routing for integrated circuits
Patent number
11,908,538
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Wei Peng
G11 - INFORMATION STORAGE
Information
Patent Grant
Die interconnect substrate, an electrical device and a method for f...
Patent number
11,901,296
Issue date
Feb 13, 2024
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package film having foil layers with intervening multilayer structure
Patent number
11,897,231
Issue date
Feb 13, 2024
Amcor Flexibles North America, Inc.
Ross K Gruetzmacher
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and method for manufacturing same
Patent number
11,901,253
Issue date
Feb 13, 2024
Denso Corporation
Wataru Kobayashi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power unit, power module and inverter
Patent number
11,901,293
Issue date
Feb 13, 2024
SUNGROW POWER SUPPLY CO., LTD.
Hao Zheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Iintegrated fan-out packages with embedded heat dissipation structure
Patent number
11,901,258
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Jan Pei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Head and printer
Patent number
11,897,261
Issue date
Feb 13, 2024
Brother Kogyo Kabushiki Kaisha
Toru Yamashita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package with heatsink
Patent number
11,894,296
Issue date
Feb 6, 2024
Cisco Technology, Inc.
Mike Sapozhnikov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit wiring techniques for stacked transistor structures
Patent number
11,894,303
Issue date
Feb 6, 2024
International Business Machines Corporation
Dongbing Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages with conductive element having cavities...
Patent number
11,887,940
Issue date
Jan 30, 2024
Intel Corporation
Seok Ling Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Signal delivery in stacked device
Patent number
11,887,969
Issue date
Jan 30, 2024
Brent Keeth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked IC structure with orthogonal interconnect layers
Patent number
11,881,454
Issue date
Jan 23, 2024
Adeia Semiconductor Inc.
Ilyas Mohammed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with metal layers and a conne...
Patent number
11,881,443
Issue date
Jan 23, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory array decoding and interconnects
Patent number
11,862,280
Issue date
Jan 2, 2024
Micron Technology, Inc.
Hernan A. Castro
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
Publication number
20240128165
Publication date
Apr 18, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device with Discrete Blocks
Publication number
20240113080
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Wen Hsiao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ROUTING STRUCTURE
Publication number
20240113010
Publication date
Apr 4, 2024
Monolithic Power Systems, Inc.
Po-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED ELECTRONIC STRUCTURE AND DATA COMMUNICATION BETWEEN COMP...
Publication number
20240105676
Publication date
Mar 28, 2024
ZERO EC SA
Erez HALAHMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING
Publication number
20240105581
Publication date
Mar 28, 2024
Google LLC
Jin Young KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW TEMPERATURE CAPACITIVELY COUPLED DEVICE FOR LOW NOISE CIRCUITS
Publication number
20240105582
Publication date
Mar 28, 2024
Intel Corporation
Abhishek Anil Sharma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Device Assembly in Computer System
Publication number
20240104037
Publication date
Mar 28, 2024
Rambus Inc.
Scott C. Best
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND LAYOUT STRUCTURE
Publication number
20240105618
Publication date
Mar 28, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC
Jing XU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS
Publication number
20240089377
Publication date
Mar 14, 2024
KYOCERA DOCUMENT SOLUTIONS INC.
Ken Maruhashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONTROL APPARATUS
Publication number
20240088013
Publication date
Mar 14, 2024
DENSO CORPORATION
Shintaro KOGURE
B60 - VEHICLES IN GENERAL
Information
Patent Application
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
Publication number
20240088104
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER CONVERTER WITH AT LEAST TWO POWER SEMICONDUCTOR MODULES
Publication number
20240088110
Publication date
Mar 14, 2024
SIEMENS AKTIENGESELLSCHAFT
Felix ZEYSS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240090239
Publication date
Mar 14, 2024
KIOXIA Corporation
Kiichi TACHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING A POWER SUPPLY LINE AND METHOD...
Publication number
20240088141
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Hsiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT (IC) PACKAGE
Publication number
20240079378
Publication date
Mar 7, 2024
Samsung Electronics Co., Ltd.
HUN SEONG CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF SEPARATING SEMICONDUCTOR DIES
Publication number
20240071828
Publication date
Feb 29, 2024
TEXAS INSTRUMENTS INCORPORATED
Michael Todd Wyant
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20240069093
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Sehyun Hwang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CELL STRUCTURES AND POWER ROUTING FOR INTEGRATED CIRCUITS
Publication number
20240055029
Publication date
Feb 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Wei PENG
G11 - INFORMATION STORAGE
Information
Patent Application
INTEGRATED CIRCUIT DEVICE
Publication number
20240047339
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
SEUNGMIN CHA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...
Publication number
20240038631
Publication date
Feb 1, 2024
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
Sheng HU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240030125
Publication date
Jan 25, 2024
Advanced Semiconductor Engineering, Inc.
Jung Jui KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
Publication number
20240030069
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jerry Chang-Jui KAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY SUBSTRATE ROUTING IN PACKAGE
Publication number
20240021562
Publication date
Jan 18, 2024
Intel Corporation
Weng Hong TEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System on Chip (SOC) Current Profile Model for Integrated Voltage R...
Publication number
20240012969
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Haohua Zhou
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FLEXIBLE ELECTRONIC CIRCUITS WITH SUPPORT STRUCTURES
Publication number
20240014148
Publication date
Jan 11, 2024
PRAGMATIC SEMICONDUCTOR LIMITED
Brian COBB
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GATE-ALL-AROUND TRANSISTOR CIRCUIT MODIFICATION USING DIRECT CONTAC...
Publication number
20240006302
Publication date
Jan 4, 2024
Intel Corporation
Richard H. Livengood
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER WITH CONTACT RETENTION WITH HEAT STAKE
Publication number
20240006784
Publication date
Jan 4, 2024
Amphenol Corporation
Paul R. Taylor
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING SMART POWER STAGE AND E-FUSE SOLUTION
Publication number
20230420362
Publication date
Dec 28, 2023
ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
Prabal Upadhyaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH EMBEDDED CAPACITORS
Publication number
20230411385
Publication date
Dec 21, 2023
Intel Corporation
Seok Ling Lim
H01 - BASIC ELECTRIC ELEMENTS