TREA

for lateral devices where the connection to the source or drain region is done through at least one part of the semiconductor substrate thickness

Follow

Industry

  • CPC
  • H01L29/4175
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/4175for lateral devices where the connection to the source or drain region is done through at least one part of the semiconductor substrate thickness
Industries