for maintaining a controlled atmosphere inside of the cavity containing the MEMS

Industry

CPC
B81C1/00277

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00277for maintaining a controlled atmosphere inside of the cavity containing the MEMS

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method for manufacturing thereof
- Patent number 11,807,520
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Chuan Teng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure for microelectromechanical systems (MEMS) devices to cont...
- Patent number 11,697,588
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical structure with bonded cover
- Patent number 11,685,650
- Issue date Jun 27, 2023
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Particle filter for MEMS device
- Patent number 11,649,162
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Miniaturized vacuum package and methods of making same
- Patent number 11,551,921
- Issue date Jan 10, 2023
- National Technology & Engineering Solutions of Sandia, LLC
- Hayden James Evans McGuinness
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for fabricating the same
- Patent number 11,434,129
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure for microelectromechanical systems (MEMS) devices to cont...
- Patent number 11,198,606
- Issue date Dec 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,766,768
- Issue date Sep 8, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for protecting a MEMS unit against infrared investigations a...
- Patent number 10,759,657
- Issue date Sep 1, 2020
- Robert Bosch GmbH
- Michael Curcic
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a micromechanical inertial sensor
- Patent number 10,730,746
- Issue date Aug 4, 2020
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Transducer package with integrated sealing
- Patent number 10,519,030
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Klaus Elian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming a micro-electro mechanical system (MEMS) includi...
- Patent number 10,486,964
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,450,190
- Issue date Oct 22, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated package containing MEMS acoustic sensor and pressure sensor
- Patent number 10,351,419
- Issue date Jul 16, 2019
- Invensense, Inc.
- Jia Gao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 10,099,917
- Issue date Oct 16, 2018
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structures for reducing and preventing stress and tensions during p...
- Patent number 10,017,375
- Issue date Jul 10, 2018
- Robert Bosch GmbH
- Frank Reichenbach
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for mounting a MEMS sensor for in-stream measurements
- Patent number 9,969,608
- Issue date May 15, 2018
- DunAn Sensing, LLC
- Tom Kwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for packaging a microelectronic device in a hermetically sea...
- Patent number 9,908,773
- Issue date Mar 6, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Damien Saint-Patrice
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 9,758,371
- Issue date Sep 12, 2017
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component having hermetic through-contacting, and m...
- Patent number 9,725,311
- Issue date Aug 8, 2017
- Robert Bosch GmbH
- Jochen Franz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS die and methods with multiple-pressure sealing
- Patent number 9,695,037
- Issue date Jul 4, 2017
- Wispry, Inc.
- Arthur S. Morris
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating MEMS devices having a plurality of cavities
- Patent number 9,561,954
- Issue date Feb 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device, system and method for providing MEMS structures of a semico...
- Patent number 9,505,610
- Issue date Nov 29, 2016
- Intel Corporation
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulated microelectromechanical structure
- Patent number 9,440,845
- Issue date Sep 13, 2016
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer encapsulated microelectromechanical structure
- Patent number 9,434,608
- Issue date Sep 6, 2016
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices anti-stiction coating and encapsulant having opposing...
- Patent number 9,284,182
- Issue date Mar 15, 2016
- Qualtre, Inc.
- Ashish A. Shah
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensors and methods of making the same
- Patent number 9,212,054
- Issue date Dec 15, 2015
- DunAn Sensing, LLC
- Tom Kwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS die and methods with multiple-pressure sealing
- Patent number 9,156,683
- Issue date Oct 13, 2015
- Wispry, Inc.
- Arthur S. Morris
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical component and method of manufacturing the same
- Patent number 9,126,824
- Issue date Sep 8, 2015
- Kabushiki Kaisha Toshiba
- Tomohiro Saito
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICROMECHANICAL STRUCTURE WITH BONDED COVER
- Publication number 20240002218
- Publication date Jan 4, 2024
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20230382718
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-CHUAN TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...
- Publication number 20230294978
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20220411260
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YI-CHUAN TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220315414
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...
- Publication number 20220089434
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20210221678
- Publication date Jul 22, 2021
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PARTICLE FILTER FOR MEMS DEVICE
- Publication number 20210188627
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...
- Publication number 20210087055
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Yi-Ren Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20200079646
- Publication date Mar 12, 2020
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20190055121
- Publication date Feb 21, 2019
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PROTECTING A MEMS UNIT AGAINST INFRARED INVESTIGATIONS A...
- Publication number 20180299589
- Publication date Oct 18, 2018
- ROBERT BOSCH GmbH
- Michael Curcic
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20180044176
- Publication date Feb 15, 2018
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Transducer package with integrated sealing
- Publication number 20170283246
- Publication date Oct 5, 2017
- INFINEON TECHNOLOGIES AG
- Klaus ELIAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS FOR MOUNTING A MEMS SENSOR FOR IN-STREAM MEASUREMENTS
- Publication number 20170190570
- Publication date Jul 6, 2017
- DunAn Sensing, LLC
- TOM KWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LASER RESEAL INCLUDING DIFFERENT CAP MATERIALS
- Publication number 20170158495
- Publication date Jun 8, 2017
- ROBERT BOSCH GmbH
- Achim Breitling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170129772
- Publication date May 11, 2017
- Taiwan Semiconductor Manufacturing company Ltd.
- CHUN-WEN CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE
- Publication number 20170101310
- Publication date Apr 13, 2017
- SiTime Corporation
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PACKAGING A MICROELECTRONIC DEVICE IN A HERMETICALLY SEA...
- Publication number 20160304338
- Publication date Oct 20, 2016
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Damiel SAINT-PATRICE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS
- Publication number 20160176705
- Publication date Jun 23, 2016
- WESTERN DIGITAL (FREMONT), LLC
- Pezhman Monadgemi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LID AND METHOD FOR SEALING A NON-MAGNETIC PACKAGE
- Publication number 20160122183
- Publication date May 5, 2016
- GENERAL ELECTRIC COMPANY
- CHRISTOPHER KAPUSTA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micromechanical component having hermetic through-contacting, and m...
- Publication number 20150232330
- Publication date Aug 20, 2015
- ROBERT BOSCH GmbH
- Jochen FRANZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING MEMS DEVICES HAVING A PLURALITY OF CAVITIES
- Publication number 20150104895
- Publication date Apr 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Structures and Methods of Forming the Same
- Publication number 20140246708
- Publication date Sep 4, 2014
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140231934
- Publication date Aug 21, 2014
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DIE AND METHODS WITH MULTIPLE-PRESSURE SEALING
- Publication number 20140008738
- Publication date Jan 9, 2014
- WISPRY
- Arthur S. Morris
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device Comprising a Hermetically Sealed Cavity and Devices Obt...
- Publication number 20120013020
- Publication date Jan 19, 2012
- IMEC
- Bin Guo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer encapsulated microelectromechanical structure and method of m...
- Publication number 20070181962
- Publication date Aug 9, 2007
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer encapsulated microelectromechanical structure and method of m...
- Publication number 20070170530
- Publication date Jul 26, 2007
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer encapsulated microelectromechanical structure and method of m...
- Publication number 20070170532
- Publication date Jul 26, 2007
- Aaron Partridge
- B81 - MICRO-STRUCTURAL TECHNOLOGY

for maintaining a controlled atmosphere inside of the cavity containing the MEMS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and method for manufacturing thereof

Structure for microelectromechanical systems (MEMS) devices to cont...

Microelectromechanical structure with bonded cover

Particle filter for MEMS device

Miniaturized vacuum package and methods of making same

Semiconductor structure and method for fabricating the same

Structure for microelectromechanical systems (MEMS) devices to cont...

Encapsulated microelectromechanical structure

Method for protecting a MEMS unit against infrared investigations a...

Method for manufacturing a micromechanical inertial sensor

Transducer package with integrated sealing

Method for forming a micro-electro mechanical system (MEMS) includi...

Encapsulated microelectromechanical structure

Integrated package containing MEMS acoustic sensor and pressure sensor

Encapsulated microelectromechanical structure

Structures for reducing and preventing stress and tensions during p...

Methods for mounting a MEMS sensor for in-stream measurements

Method for packaging a microelectronic device in a hermetically sea...

Encapsulated microelectromechanical structure

Micromechanical component having hermetic through-contacting, and m...

MEMS die and methods with multiple-pressure sealing

Method of fabricating MEMS devices having a plurality of cavities

Device, system and method for providing MEMS structures of a semico...

Encapsulated microelectromechanical structure

Wafer encapsulated microelectromechanical structure

MEMS devices anti-stiction coating and encapsulant having opposing...

Pressure sensors and methods of making the same

MEMS die and methods with multiple-pressure sealing

Electrical component and method of manufacturing the same

Patents Applicationslast 30 patents

MICROMECHANICAL STRUCTURE WITH BONDED COVER

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE

STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

PARTICLE FILTER FOR MEMS DEVICE

STRUCTURE FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DEVICES TO CONT...

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

METHOD FOR PROTECTING A MEMS UNIT AGAINST INFRARED INVESTIGATIONS A...

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

Transducer package with integrated sealing

METHODS FOR MOUNTING A MEMS SENSOR FOR IN-STREAM MEASUREMENTS

LASER RESEAL INCLUDING DIFFERENT CAP MATERIALS

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE

METHOD FOR PACKAGING A MICROELECTRONIC DEVICE IN A HERMETICALLY SEA...

SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS

LID AND METHOD FOR SEALING A NON-MAGNETIC PACKAGE

Micromechanical component having hermetic through-contacting, and m...

METHOD OF FABRICATING MEMS DEVICES HAVING A PLURALITY OF CAVITIES

MEMS Structures and Methods of Forming the Same

ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME

MEMS DIE AND METHODS WITH MULTIPLE-PRESSURE SEALING

MEMS Device Comprising a Hermetically Sealed Cavity and Devices Obt...

Wafer encapsulated microelectromechanical structure and method of m...

Wafer encapsulated microelectromechanical structure and method of m...

Wafer encapsulated microelectromechanical structure and method of m...