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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/03009for protecting parts during manufacture

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating integrated circuit device
- Patent number 11,804,458
- Issue date Oct 31, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 11,710,718
- Issue date Jul 25, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level low melting temperature interco...
- Patent number 11,222,813
- Issue date Jan 11, 2022
- Raytheon Company
- Sean P. Kilcoyne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming and packaging semiconductor die
- Patent number 10,910,270
- Issue date Feb 2, 2021
- MagnaChip Semiconductor, Ltd.
- Jae Sik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,892,246
- Issue date Jan 12, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,886,250
- Issue date Jan 5, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,840,202
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,833,035
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,797,011
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe methodology for ultrafine pitch interconnects
- Patent number 10,748,824
- Issue date Aug 18, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication method thereof
- Patent number 10,643,963
- Issue date May 5, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Feng Ping Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 10,615,137
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor backmetal (BM) and over pad metallization (OPM) struc...
- Patent number 10,600,736
- Issue date Mar 24, 2020
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside integration of RF filters for RF front end modules and des...
- Patent number 10,559,743
- Issue date Feb 11, 2020
- GLOBALFOUNDRIES Inc.
- James W. Adkisson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structures and methods for low temperature bonding using nanoparticles
- Patent number 10,535,626
- Issue date Jan 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,381,279
- Issue date Aug 13, 2019
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power package module of multiple power chips and method of manufact...
- Patent number 10,347,533
- Issue date Jul 9, 2019
- Delta Electronics (Shanghai) Co., Ltd.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device having the same
- Patent number 10,236,271
- Issue date Mar 19, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Yukie Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion resistant aluminum bond pad structure
- Patent number 10,204,877
- Issue date Feb 12, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with sacrificial anode and method for forming
- Patent number 10,199,339
- Issue date Feb 5, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with array of micrometer scale copper pillar ba...
- Patent number 10,128,123
- Issue date Nov 13, 2018
- Imec VZW
- Bivragh Majeed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor devices having a metallisati...
- Patent number 9,887,152
- Issue date Feb 6, 2018
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive vias using ba...
- Patent number 9,865,524
- Issue date Jan 9, 2018
- STATS ChipPAC Pte. Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,837,326
- Issue date Dec 5, 2017
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backside integration of RF filters for RF front end modules and des...
- Patent number 9,786,835
- Issue date Oct 10, 2017
- GLOBALFOUNDRIES Inc.
- James W. Adkisson
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bond pad structure with dual passivation layers
- Patent number 9,691,703
- Issue date Jun 27, 2017
- United Microelectronics Corp.
- Ye Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230335531
- Publication date Oct 19, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20230132060
- Publication date Apr 27, 2023
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE
- Publication number 20230020810
- Publication date Jan 19, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHODS AND STRUCTURES
- Publication number 20220320035
- Publication date Oct 6, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20210225801
- Publication date Jul 22, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...
- Publication number 20210005560
- Publication date Jan 7, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Richard Allen Faust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AND PACKAGING SEMICONDUCTOR DIE
- Publication number 20200312715
- Publication date Oct 1, 2020
- Magnachip Semiconductor, Ltd.
- Jae Sik CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structures And Methods For Low Temperature Bonding Using Nanoparticles
- Publication number 20200152598
- Publication date May 14, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS
- Publication number 20200105630
- Publication date Apr 2, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Javier A. DELACRUZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...
- Publication number 20200075396
- Publication date Mar 5, 2020
- Raytheon Company
- Sean P. Kilcoyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND R...
- Publication number 20190148306
- Publication date May 16, 2019
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE
- Publication number 20190139919
- Publication date May 9, 2019
- International Business Machines Corporation
- Charles L. ARVIN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20180374806
- Publication date Dec 27, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Feng Ping CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20180068910
- Publication date Mar 8, 2018
- RENESAS ELECTRONICS CORPORATION
- Akira YAJIMA
- G11 - INFORMATION STORAGE
Information Patent Application
BACKSIDE INTEGRATION OF RF FILTERS FOR RF FRONT END MODULES AND DES...
- Publication number 20170365775
- Publication date Dec 21, 2017
- GLOBALFOUNDRIES INC.
- James W. Adkisson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER PACKAGE MODULE OF MULTIPLE POWER CHIPS AND METHOD OF MANUFACT...
- Publication number 20170062386
- Publication date Mar 2, 2017
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Tao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROTECTING A MOUNTING TAPE DURING LASER SINGULATION OF A...
- Publication number 20160079118
- Publication date Mar 17, 2016
- Frank ERNST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE INTEGRATION OF RF FILTERS FOR RF FRONT END MODULES AND DES...
- Publication number 20150243879
- Publication date Aug 27, 2015
- International Business Machines Corporation
- James W. ADKISSON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF FABRICATING WAFER-LEVEL CHIP PACKAGE
- Publication number 20150099357
- Publication date Apr 9, 2015
- XINTEC INC.
- Chuan-Jin SHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20140361431
- Publication date Dec 11, 2014
- SONY CORPORATION
- Katsuji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING
- Publication number 20140346663
- Publication date Nov 27, 2014
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20140319684
- Publication date Oct 30, 2014
- Yukie SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Vias Using Ba...
- Publication number 20140300002
- Publication date Oct 9, 2014
- STATS ChipPAC, Ltd.
- Duk Ju Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...
- Publication number 20140284819
- Publication date Sep 25, 2014
- Infineon Technologies Austria AG
- Rudolf Zelsacher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS Device and Method of Formation Thereof
- Publication number 20140248730
- Publication date Sep 4, 2014
- Hsin-Ting Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20140213017
- Publication date Jul 31, 2014
- Samsung Electronics Co., Ltd.
- Jong-Youn KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Nano-Structured Component and Method of Making a Packaged...
- Publication number 20140126165
- Publication date May 8, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BOND PAD STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140116760
- Publication date May 1, 2014
- UNITED MICROELECTRONICS CORP.
- Ye Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING SEMICONDUCTOR PACK...
- Publication number 20140084456
- Publication date Mar 27, 2014
- Myun-sung Kang
- H01 - BASIC ELECTRIC ELEMENTS

for protecting parts during manufacture

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures for low temperature bonding using nanoparticles

Methods for low temperature bonding using nanoparticles

Method of fabricating integrated circuit device

Structures and methods for low temperature bonding using nanoparticles

Method of manufacturing wafer level low melting temperature interco...

Method of forming and packaging semiconductor die

Structures and methods for low temperature bonding using nanoparticles

Structures and methods for low temperature bonding using nanoparticles

Method of forming solder bumps

Method of forming solder bumps

Method of forming solder bumps

Probe methodology for ultrafine pitch interconnects

Semiconductor fabrication method thereof

Corrosion resistant aluminum bond pad structure

Semiconductor backmetal (BM) and over pad metallization (OPM) struc...

Backside integration of RF filters for RF front end modules and des...

Structures and methods for low temperature bonding using nanoparticles

Method of manufacturing semiconductor device and semiconductor device

Power package module of multiple power chips and method of manufact...

Semiconductor devices and methods of forming thereof

Semiconductor device and electronic device having the same

Corrosion resistant aluminum bond pad structure

Semiconductor structure with sacrificial anode and method for forming

Substrate structure with array of micrometer scale copper pillar ba...

Method for manufacturing semiconductor devices having a metallisati...

Semiconductor device and method of forming conductive vias using ba...

Method of manufacturing semiconductor device and semiconductor device

Conductive connections, structures with such connections, and metho...

Backside integration of RF filters for RF front end modules and des...

Bond pad structure with dual passivation layers

Patents Applicationslast 30 patents

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

METHOD OF FABRICATING INTEGRATED CIRCUIT DEVICE

DIRECT BONDING METHODS AND STRUCTURES

Structures And Methods For Low Temperature Bonding Using Nanoparticles

PROCESS FLOW FOR FABRICATION OF CAP METAL OVER TOP METAL WITH SINTE...

METHOD OF FORMING AND PACKAGING SEMICONDUCTOR DIE

Structures And Methods For Low Temperature Bonding Using Nanoparticles

PROBE METHODOLOGY FOR ULTRAFINE PITCH INTERCONNECTS

METHOD OF MANUFACTURING WAFER LEVEL LOW MELTING TEMPERATURE INTERCO...

SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND R...

CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

BACKSIDE INTEGRATION OF RF FILTERS FOR RF FRONT END MODULES AND DES...

POWER PACKAGE MODULE OF MULTIPLE POWER CHIPS AND METHOD OF MANUFACT...

METHOD OF PROTECTING A MOUNTING TAPE DURING LASER SINGULATION OF A...

BACKSIDE INTEGRATION OF RF FILTERS FOR RF FRONT END MODULES AND DES...

METHOD OF FABRICATING WAFER-LEVEL CHIP PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME

Semiconductor Device and Method of Forming Conductive Vias Using Ba...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A METALLISATI...

MEMS Device and Method of Formation Thereof

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

Packaged Nano-Structured Component and Method of Making a Packaged...

BOND PAD STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING SEMICONDUCTOR PACK...